面对面的小间隙机器视觉系统研究
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摘要
20世纪90年代以来,移动电话、个人数字助手(PDA)、笔记本电脑、数码相机等消费类电子产品的体积越来越小,工作速度越来越快,智能化程度也越来越高。这些日新月异的变化为电子封装与组装技术带来了许多挑战和机遇,但是电子封装与组装手动设备尚存在速度慢、精度低等问题,产品质量和产量也都无法保证。而自动化设备的出现则很好地解决了电子封装与组装手动设备速度和精度问题,这种自动化设备所依赖的核心技术就是机器视觉系统的设计与实现。
在本课题中使用机器视觉技术快速、准确地识别芯片和基板,通过用ICC(工业控制计算机)驱动高精度机械执行机构完成芯片和基板对位。
本课题利用光学技术、摄像技术、微机控制技术、图像处理技术等来识别目标、完成自动对位。为研制高效、稳定、精确、自动化的机器视觉系统提供了一个切实可行的设计方案。
课题从实际出发,把机器视觉技术和运动控制技术结合起来,开发了面对面小间隙机器视觉系统。本论文首先介绍了机器视觉技术及其组成部分、各部分的选型、应用意义、国内外发展状况等;接着着重介绍了小间隙机器视觉系统的总体设计,详细描述了总体设计的思想,各部分的选型原则、设计原则,以及本系统的选型。其中的难点是由于焊接对象基板与芯片通常不是透明物,为保证其对位精度,芯片和基板的工作间距很小,不能采用常规CCD镜头组合直接成像,而是采用特制的光学探头,实现小间距光学成像功能;然后介绍了图像处理技术的基础知识、基本算法等。最后,介绍了机器视觉系统实现自动对位的算法设计以及运用该算法进行实验,验证设备的性能。
通过对实验数据进行分析、对产品进行检测,检验该设备的机器视觉系统的性能稳定性、速度以及精度是否满足要求。
Since the 1990s, mobile phones, personal digital assistant (PDA), notebook computers, digital cameras and other consumer electronic products become smaller, faster and faster pace of work, higher level of intelligence. These rapid changes in electronic packaging and assembly technology has brought many challenges and opportunities. Electronic packaging and assembly manual equipment, often there is the problem of low accuracy, product quality and output can not be assured. Automation equipment can very well solve the problem of speed and accuracy. the core technology is the machine vision technology.
In this topic, the use of machine vision technology can quickly and accurately accomplish recognition of chip and substrate. ICC (industrial control computer) drives the completion of high-precision machinery executing agency to complete contraposition.
This issue use optical technology, video technology, microcomputer control technology, image processing technology to identify the objectives, complete automatic contraposition. For the development of an efficient, stable and accurate automated machine vision system, the issue provides a practical design.
The subject from reality, by combined machine vision technology with motion control technology, has developed a face-to-face small-gap machine vision system. This paper firstly introduced machine vision technology, its component parts,the selection of every part, the significance of application, development status at home and abroad etc. Then the paper emphatically introduces the small gap machine vision system design, detailed description of the overall design ideas, the selection principle of the various parts, design principles, as well as the selection of the system.Because welding object substrate and chips are usually not transparent and chip and substrate working space is very small, it cannot use the conventional CCD lens combination directly imaging. In order to ensure the accuracy of its position, instead of using the specially designed optical probe, it can accomplish function of small distance optical imaging. and then this paper introduced the basic knowledge of image processing technology and the basic algorithm. Finally, the paper introduced the realization of automatic machine vision systems using the alignment algorithm design and experiment of verifying the algorithm to verify equipment performance.
Through the analysis of experimental data on the products tested, indicating that the machine vision equipment, the performance of the system stability, speed and accuracy requirements are met.
在本课题中使用机器视觉技术快速、准确地识别芯片和基板,通过用ICC(工业控制计算机)驱动高精度机械执行机构完成芯片和基板对位。
本课题利用光学技术、摄像技术、微机控制技术、图像处理技术等来识别目标、完成自动对位。为研制高效、稳定、精确、自动化的机器视觉系统提供了一个切实可行的设计方案。
课题从实际出发,把机器视觉技术和运动控制技术结合起来,开发了面对面小间隙机器视觉系统。本论文首先介绍了机器视觉技术及其组成部分、各部分的选型、应用意义、国内外发展状况等;接着着重介绍了小间隙机器视觉系统的总体设计,详细描述了总体设计的思想,各部分的选型原则、设计原则,以及本系统的选型。其中的难点是由于焊接对象基板与芯片通常不是透明物,为保证其对位精度,芯片和基板的工作间距很小,不能采用常规CCD镜头组合直接成像,而是采用特制的光学探头,实现小间距光学成像功能;然后介绍了图像处理技术的基础知识、基本算法等。最后,介绍了机器视觉系统实现自动对位的算法设计以及运用该算法进行实验,验证设备的性能。
通过对实验数据进行分析、对产品进行检测,检验该设备的机器视觉系统的性能稳定性、速度以及精度是否满足要求。
Since the 1990s, mobile phones, personal digital assistant (PDA), notebook computers, digital cameras and other consumer electronic products become smaller, faster and faster pace of work, higher level of intelligence. These rapid changes in electronic packaging and assembly technology has brought many challenges and opportunities. Electronic packaging and assembly manual equipment, often there is the problem of low accuracy, product quality and output can not be assured. Automation equipment can very well solve the problem of speed and accuracy. the core technology is the machine vision technology.
In this topic, the use of machine vision technology can quickly and accurately accomplish recognition of chip and substrate. ICC (industrial control computer) drives the completion of high-precision machinery executing agency to complete contraposition.
This issue use optical technology, video technology, microcomputer control technology, image processing technology to identify the objectives, complete automatic contraposition. For the development of an efficient, stable and accurate automated machine vision system, the issue provides a practical design.
The subject from reality, by combined machine vision technology with motion control technology, has developed a face-to-face small-gap machine vision system. This paper firstly introduced machine vision technology, its component parts,the selection of every part, the significance of application, development status at home and abroad etc. Then the paper emphatically introduces the small gap machine vision system design, detailed description of the overall design ideas, the selection principle of the various parts, design principles, as well as the selection of the system.Because welding object substrate and chips are usually not transparent and chip and substrate working space is very small, it cannot use the conventional CCD lens combination directly imaging. In order to ensure the accuracy of its position, instead of using the specially designed optical probe, it can accomplish function of small distance optical imaging. and then this paper introduced the basic knowledge of image processing technology and the basic algorithm. Finally, the paper introduced the realization of automatic machine vision systems using the alignment algorithm design and experiment of verifying the algorithm to verify equipment performance.
Through the analysis of experimental data on the products tested, indicating that the machine vision equipment, the performance of the system stability, speed and accuracy requirements are met.
引文
[1]邹中升.热超声倒装键合实验台视觉定位系统的设计与研究[D].长沙:中南大学,2007
[2]蒋明、杨邦朝.微电子封装设备市场分析,电子与封装,2005,5(3):26-32
[3]李枚.微电子封装技术的发展与展望[J].半导体技术,2000,25(5):1-3
[4]丁汉,朱利民,林忠钦.面向芯片封装的高加速度运动系统的精确定位和操作.自然科学进展,2003,13(6):568-574
[5]Jeng Y R, Chen J Y. On the microcontact mechanism of thermosonic wire bonding in microelectronics: Saturation of interfacial phenomena[J]. Trib -ology Transactions, 2005, 48(1): 127-132
[6]曾健维.晶片印字瑕疵检测之研究,私立中原大学工业工程研究所,硕士论文,2000
[7]葛劢冲,微电子封装中芯片焊接技术及其设备的发展,电子工业专用设备,29(4):5-10
[8]孙大海.零件孔径视觉测量系统研究[D].长春:长春工业大学,2006.
[9]廖强,周忆.机器视觉在精密测量中的应用[J].重庆大学学报(自然科J-a,版),2002,25(6):1-4
[10]阳什,吴久峰.基于机器视觉工业实时测量技术研究[J].制造业自动化,2003,25(2):10-13
[11]杨维全,陈伟民,胡松等.图像处理在高精度对准系统中的应用[J].微细加工技术,2002,24(1):35-40
[12]宋福民,张小丽,马如震.SMT2505全视觉多功能贴片机的研制[J].电子工业专用设备,2002,31(4):219-223
[13]K,A. Cooper,R. Yang,J.S.Mottet,et al. Flip Chip Equipment for High End Electro-optical Modules.In:49th Electronic Components and Technology Conference, Proceedings of the 49th electronic components and technology conference. 49th Electronic Components and Technology Conference. CA1999: 176-180
[14]http:// www.nowa.com.tw/report/pattern-matching.htm影像图形辨识法则与相关产品市场动态
[15]图像和机器视觉产品手册.凌云光视数字图像技术有限公司
[16]傅德胜,寿益禾.图形图像处理学.第一版.南京.东南大学出版社.2001.12
[17]杨建生.焊料凸点式倒装片与引线键合成本比较分析[J].电子与封装,2007,10(7):1-7
[18]Lapidus SN.New techniques for industral vision inspection. Applied Machine Vision, 1984, (1):105-112
[19]方如明,蔡键荣,许俐.计算机图像处理技术及其在农业工程中的应用.第一版.北京.清华大学出版社.200
[20]Chin-Hsing Chen. Color Image Segment for Cancer Diagnosis. Mathl Compute Modelling, 1998, 27(2):103-120
[21] ArthurR.Weeks,G.Eric Hague. Color Segmentation in the HIS color space Using the K-means algorithm[J]. SPIE 1997(30)
[22]Dimla E,Dima Snr, Sensor signal for tool-wear monitoring in mental cutting operations-a review of methods, International Journal of machine tools and manufacture 40(2000):1073-1098
[23]Ei-Hakim S F.Performance Evaluation of a Vision Dimension Metrology system.Industrial Metrology. SPIE,1991,1526:76-82
[24]金洪震,等.线阵CCD光谱特性的研究及应用[J]浙江师范大学学报(自然科学版).2000,23(3):253-256
[25]张宏林.Visual C++数字图像模式识别技术及工程实践[M].人民邮电出版社.2003
[26]何斌. Visual C++数字图像处理[M].人民邮电出版社.2002
[27]章毓晋编著.图像处理和分析[M].清华大学出版社社.2000.6
[28]A M Darwish,A K Jian.A rule based approach for visual pattern inspec- Tion[J].IEE Transactions of Pattern Analysis and Machine Intelligence, 1998:8(3):193-201
[29]艾海舟,武勃.图像处理、分析与机器视觉[M].北京:北京邮电出版社,2003.9
[30]夏良正.数字图像处理.东南大学出版社.1999
[31]IbrabhimZ,Al-Attas S A R, Aspar Z.Analysis of the Wavelet-based Image Difference Algorithm for PCB Inspection[C]. Proceedings of the 41stSICE Ann -ual Conference, 2002,4:2108-2113
[32]章毓敏.图像分割[M].北京:科学出版社,2001
[33]姚敏.数字图像处理[M].北京:机械工业出版社,2006
[34]王碧波,岳金福,周泽兵.基于二维精密电容微位移传感器的二维纳米定位系统,纳米技术与精密工程,2005,3(2):137-141
[35]张文典,实用表面组装技术,电子工业出版,2002:213-221
[36]周德俭,吴兆华编,表面组装工艺技术,国防工业出版社,2002:120-135
[37]Walter Nehls. Gold Wire Bonders for the Nineties[J]. Solid State Te -chnology, 1991,34(6):59-62.
[2]蒋明、杨邦朝.微电子封装设备市场分析,电子与封装,2005,5(3):26-32
[3]李枚.微电子封装技术的发展与展望[J].半导体技术,2000,25(5):1-3
[4]丁汉,朱利民,林忠钦.面向芯片封装的高加速度运动系统的精确定位和操作.自然科学进展,2003,13(6):568-574
[5]Jeng Y R, Chen J Y. On the microcontact mechanism of thermosonic wire bonding in microelectronics: Saturation of interfacial phenomena[J]. Trib -ology Transactions, 2005, 48(1): 127-132
[6]曾健维.晶片印字瑕疵检测之研究,私立中原大学工业工程研究所,硕士论文,2000
[7]葛劢冲,微电子封装中芯片焊接技术及其设备的发展,电子工业专用设备,29(4):5-10
[8]孙大海.零件孔径视觉测量系统研究[D].长春:长春工业大学,2006.
[9]廖强,周忆.机器视觉在精密测量中的应用[J].重庆大学学报(自然科J-a,版),2002,25(6):1-4
[10]阳什,吴久峰.基于机器视觉工业实时测量技术研究[J].制造业自动化,2003,25(2):10-13
[11]杨维全,陈伟民,胡松等.图像处理在高精度对准系统中的应用[J].微细加工技术,2002,24(1):35-40
[12]宋福民,张小丽,马如震.SMT2505全视觉多功能贴片机的研制[J].电子工业专用设备,2002,31(4):219-223
[13]K,A. Cooper,R. Yang,J.S.Mottet,et al. Flip Chip Equipment for High End Electro-optical Modules.In:49th Electronic Components and Technology Conference, Proceedings of the 49th electronic components and technology conference. 49th Electronic Components and Technology Conference. CA1999: 176-180
[14]http:// www.nowa.com.tw/report/pattern-matching.htm影像图形辨识法则与相关产品市场动态
[15]图像和机器视觉产品手册.凌云光视数字图像技术有限公司
[16]傅德胜,寿益禾.图形图像处理学.第一版.南京.东南大学出版社.2001.12
[17]杨建生.焊料凸点式倒装片与引线键合成本比较分析[J].电子与封装,2007,10(7):1-7
[18]Lapidus SN.New techniques for industral vision inspection. Applied Machine Vision, 1984, (1):105-112
[19]方如明,蔡键荣,许俐.计算机图像处理技术及其在农业工程中的应用.第一版.北京.清华大学出版社.200
[20]Chin-Hsing Chen. Color Image Segment for Cancer Diagnosis. Mathl Compute Modelling, 1998, 27(2):103-120
[21] ArthurR.Weeks,G.Eric Hague. Color Segmentation in the HIS color space Using the K-means algorithm[J]. SPIE 1997(30)
[22]Dimla E,Dima Snr, Sensor signal for tool-wear monitoring in mental cutting operations-a review of methods, International Journal of machine tools and manufacture 40(2000):1073-1098
[23]Ei-Hakim S F.Performance Evaluation of a Vision Dimension Metrology system.Industrial Metrology. SPIE,1991,1526:76-82
[24]金洪震,等.线阵CCD光谱特性的研究及应用[J]浙江师范大学学报(自然科学版).2000,23(3):253-256
[25]张宏林.Visual C++数字图像模式识别技术及工程实践[M].人民邮电出版社.2003
[26]何斌. Visual C++数字图像处理[M].人民邮电出版社.2002
[27]章毓晋编著.图像处理和分析[M].清华大学出版社社.2000.6
[28]A M Darwish,A K Jian.A rule based approach for visual pattern inspec- Tion[J].IEE Transactions of Pattern Analysis and Machine Intelligence, 1998:8(3):193-201
[29]艾海舟,武勃.图像处理、分析与机器视觉[M].北京:北京邮电出版社,2003.9
[30]夏良正.数字图像处理.东南大学出版社.1999
[31]IbrabhimZ,Al-Attas S A R, Aspar Z.Analysis of the Wavelet-based Image Difference Algorithm for PCB Inspection[C]. Proceedings of the 41stSICE Ann -ual Conference, 2002,4:2108-2113
[32]章毓敏.图像分割[M].北京:科学出版社,2001
[33]姚敏.数字图像处理[M].北京:机械工业出版社,2006
[34]王碧波,岳金福,周泽兵.基于二维精密电容微位移传感器的二维纳米定位系统,纳米技术与精密工程,2005,3(2):137-141
[35]张文典,实用表面组装技术,电子工业出版,2002:213-221
[36]周德俭,吴兆华编,表面组装工艺技术,国防工业出版社,2002:120-135
[37]Walter Nehls. Gold Wire Bonders for the Nineties[J]. Solid State Te -chnology, 1991,34(6):59-62.