RFID标签热压工艺平台设计与性能验证
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摘要
射频识别(RFID,Radio Frequnency Identification)技术在21世纪是最具前途和应用前景的一项信息技术,因此RFID标签封装设备的开发对于该技术的发展有着极其重大的意义。其标签封装设备包括基板输送、检测、点胶、贴装和热压五个模块,热压工序的功能是保证芯片与天线的机械互连和电气互连,是设备中不可或缺的重要环节。本文主要对热压工艺平台进行设计,对热压头进行了热分析,对热压工艺平的性能进行了实验验证,具体如下:
首先通过对比选择合适的封装工艺,根据热压工艺平台的设计指标,规划工作流程,设计整体方案。
其次根据热温度和压力的精确控制需求,提出了热压头弹簧机构和气缸机构的两种设计方案,并分别设计了其机械结构,对主要驱动部件的选型进行计算,通过两种方案优缺点的对比,确定用弹簧机构实现热压头的设计。
然后对热压头的结构模型进行了必要的简化,建立了有限元模型并划分网格,进行温度场分析仿真,并通过对比环境温度、加热温度、零件材料(工作面、螺栓等)对温度场分布的影响,以评估热压头在不同工作状态下的性能,并提出了改进方案。
最后通过对温度以及压力控制精度和稳定性的实际测试,验证了基于弹簧力控热压头的热压工艺平台对温度和压力控制的有效性,并在此基础之上进行了工艺实验研究,研究了温度和压力对DELO导电胶接触电阻的影响规律,同时从侧面佐证了热压工艺平台的一致性。
The radio frequency identification technology is one of the most promising and applying information technologies in the 21th century, therefore, it is very meaningful to do the research and development of RFID tag-package equipments. A RFID tag-package equipment includes five modules, they are web-conveyed module, testing module, dispensing module, flip-chip bonding module, and hot pressing module. As a necessary process of the equipment, the function of hot pressing is to provide the mechanic and electric connection of chip and antenna. This article mainly states that designing the hot pressing machine, analyzing the thermal situation of hot pressing head while working and testing the performance of the machine.
Firstly, comparing with the electronic packaging processing, the most suitable one is chosen. Then the design requirement of the hot pressing machine, the working procedure and the entire proposal is created according to the design figure of the equipment.
Secondly, two kind of schemes are mapped out on the basis of the requirement of thermal and pressure precise control, therefore, the structural design and the selection of main driver parts are worked out through the two different ways separately, which are spring structure and cylinder structure. Then the structure of hot pressing head is selected by comparing the two schemes.
Thirdly, To begin with the CAD model simplified, it sets up the finite element model and makes meshing. And the thermal simulation of hot pressing head is required by Workbench of ANSYS software. After taking the assessment of the hot pressing head performance in different working conditions with different materials, a structure which matches well with the machine is worked out through the analysis.
Finally, by way of the performance test of the stability and precision of temperature and pressure control, the hot pressing machine is working in a good condition. What’s more, the research of the influence of the temperature and pressure to contact resistance is been doing, which prove the consistency of the machine’s performance.
首先通过对比选择合适的封装工艺,根据热压工艺平台的设计指标,规划工作流程,设计整体方案。
其次根据热温度和压力的精确控制需求,提出了热压头弹簧机构和气缸机构的两种设计方案,并分别设计了其机械结构,对主要驱动部件的选型进行计算,通过两种方案优缺点的对比,确定用弹簧机构实现热压头的设计。
然后对热压头的结构模型进行了必要的简化,建立了有限元模型并划分网格,进行温度场分析仿真,并通过对比环境温度、加热温度、零件材料(工作面、螺栓等)对温度场分布的影响,以评估热压头在不同工作状态下的性能,并提出了改进方案。
最后通过对温度以及压力控制精度和稳定性的实际测试,验证了基于弹簧力控热压头的热压工艺平台对温度和压力控制的有效性,并在此基础之上进行了工艺实验研究,研究了温度和压力对DELO导电胶接触电阻的影响规律,同时从侧面佐证了热压工艺平台的一致性。
The radio frequency identification technology is one of the most promising and applying information technologies in the 21th century, therefore, it is very meaningful to do the research and development of RFID tag-package equipments. A RFID tag-package equipment includes five modules, they are web-conveyed module, testing module, dispensing module, flip-chip bonding module, and hot pressing module. As a necessary process of the equipment, the function of hot pressing is to provide the mechanic and electric connection of chip and antenna. This article mainly states that designing the hot pressing machine, analyzing the thermal situation of hot pressing head while working and testing the performance of the machine.
Firstly, comparing with the electronic packaging processing, the most suitable one is chosen. Then the design requirement of the hot pressing machine, the working procedure and the entire proposal is created according to the design figure of the equipment.
Secondly, two kind of schemes are mapped out on the basis of the requirement of thermal and pressure precise control, therefore, the structural design and the selection of main driver parts are worked out through the two different ways separately, which are spring structure and cylinder structure. Then the structure of hot pressing head is selected by comparing the two schemes.
Thirdly, To begin with the CAD model simplified, it sets up the finite element model and makes meshing. And the thermal simulation of hot pressing head is required by Workbench of ANSYS software. After taking the assessment of the hot pressing head performance in different working conditions with different materials, a structure which matches well with the machine is worked out through the analysis.
Finally, by way of the performance test of the stability and precision of temperature and pressure control, the hot pressing machine is working in a good condition. What’s more, the research of the influence of the temperature and pressure to contact resistance is been doing, which prove the consistency of the machine’s performance.
引文
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[2]徐济仁,陈家松,牛纪海.射频识别技术及应用发展.数据通信, 2009,1: 21~26.
[3]陶玉芬. RFID技术应用展望电脑应用技术.二零零六总第六十八期: 5~8.
[4]《中国射频识别技术政策白皮书》编写组.中国射频识别技术政策白皮书. 2005年10月26日.
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[6]李楠楠. RFID封装中热压模块温度控制系统的设计与实现.华中科技大学硕士论文,2007.5.
[7] Lau J.H. Electronic packaging: Design, Materials, Process and Reliability [M]. McGRAW-HILL Company,2003.
[8]佚名.RFID标签天线及读写器设计制造.RFID世界网.
[9]倪晓军,梁彤翔.导电胶的研究进展.电子元件与材料,2002年1月第1期:1~3.
[10]蔺永诚,陈旭.各项异性导电胶互连技术的研究进展.电子与封装,2006年7月第7期:1~7.
[11]刘运吉,杨道国,秦连城,张旭,李宇军.固化工艺参数对导电胶导电性能的影响.电子元件与材料, 2005年10月第10期: 20~26.
[12] Chang D D., Crawford PA,Fulton J A, et al. An overview and evaluation of anisotropically conductive adhesive film for fine pitch electronic assembly [J]. IEEE Trans Component, Package Manufacturing Technology, 1993, 16(8):828~835.
[13] Chan Y C, Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii.different bonding pressure [J].Microelectronic Reliability,2002,42:1195~1204.
[14] Chen X., Zhang J., Jiao C.L, et al. Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection [J]. Microelctronics Reliability, 2006, 46.
[15] Johan Liu,Zonghe Lai.Reliability of anisotropically conductive adhesive joints ona flip-chip/fr-4 substrate,transactions of ASME [J].J Electronic Package,2002,124:240~245.
[16] Zonghe Lai,Johan Liu. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates.IEEE Trans on Components,Packaging,and Manufacturing Technology[B],Vol 19,No.3,August 1996,644~660.
[17] Chan Y C,Luk D Y.Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly i.different bonding temperature [J].Microelectronic Reliability, 2002,42:1185~1194.
[18] Zhang J. H., Chan Y. C., Alam M. O., et al. Contact resistance and adhesion performance of ACF interconnections to aluminum metallization [J]. Microelectronics Reliability, 2003, 43: 1303~1310.
[19] Tan C. W., Chan Y. C., Yeung N. H. Effect of autoclave test on anisotropic conductive joints [J]. Microelectronics Reliability, 2003, 43: 279~285.
[20] Wei Z., Waf L. S., Loo N. Y., et al. Studies on moisture-induced failures in ACF interconnection [J]. Proceedings of the 4th Electronics Packaging Technology Conference, 2002: 133~138.
[21]商跃进.有限元原理与ANSYS应用指南.清华大学出版社, 2005.
[22] C. A. Harper. Electronic Assembly Fabrication. McGraw-Hill companies, Inc, 2002.
[23]邹茉莲.焊接理论及工艺基础.北京:北京航空航天大学出版社, 1994.9.
[24]傅岳鹏,谭凯,田民波.电子封装技术的最新进展.半导体技术,第34卷第2期2009年2月: 113~118.
[25] Alien Technology and RFID. http://www.alientechnology.com.
[26] F.Kriebel, Th.Seidowski. Smart labels-High volume applications using adhesive flip-chip-technologies. IEEE, 2001.
[27] John H. Lau. Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies. McGraw-Hill Companies, Inc, 2000.
[28]郭江华,王水弟,张忠会,胡涛,贾松良.倒装芯片凸焊点的UBM.半导体技术,2001年6月,第26卷第6期: 60~64.
[29]刘汉诚,汪正平,李宁成,李世玮.电子制造技术—利用无铅、无卤素和导电胶.化学工业出版社, 2005.
[30] Joachim Pajonk.New Flip Chip Technology Utilizing Non-Conductive Adhesive Adapted for High Volume Chip Card Module Production.IEEE/SEMI Int’l Electronics Manufacturing Technology Symposium,2004: 165~170.
[31]张智文.射频识别技术理论与实践.北京:中国科学技术出版社, 2008.
[32] RFID Technology Of Muehlbauer. http://www.muehlbauer.de.
[33] Datacon8800. http://www.datacon.at.
[34] Toray Tech. http://www.toray-eng.com.
[35] HRB user manual. http://www.hallys.co.jp/chi/html/rotary.html.
[36]郑堃.面向RFID标签封装的固化系统设计及其热分析.华中科技大学硕士论文,2006.5.
[37] Datacon. Discover the RFID tag production with Besi,2006.
[38]成大先.机械设计手册.北京:化学工业出版社,2002.
[39]黄国权.有限元法基础及ANSYS应用.北京:机械工业出版社,2004.
[40] Zinekiewicz OC, Taylor RL. The Finite Element Method. 4thed. London: MaGraw-Hill, 1991.
[41]周传月,腾万秀,张俊堂.工程有限元与优化分析实用实例教程.北京:科学出版社,2005.
[42]戴锅生.传热学.高等教育出版社,1999.
[43] Bathe KJ, Wilson EL. Numerical Methods in Finite Element Analysis. Prentice-Hall Inc, 1976: 109~208.
[44]小枫工作室.最新经典ANSYS及Workbench教程.电子工业出版社,2004.
[45] Saeed Moaveni. Finite Element Analysis: Theory and Application with ANSYS. Second Edition. New Jersey: Prentice Hall, 2003.
[46]康鹏工作室.UGNX3三维建模精彩实例导航.北京:机械工业出版社,2006.
[47]邢桂菊,黄素逸.热工实验原理和技术.冶金工业出版社, 2007.
[2]徐济仁,陈家松,牛纪海.射频识别技术及应用发展.数据通信, 2009,1: 21~26.
[3]陶玉芬. RFID技术应用展望电脑应用技术.二零零六总第六十八期: 5~8.
[4]《中国射频识别技术政策白皮书》编写组.中国射频识别技术政策白皮书. 2005年10月26日.
[5]吴懿平,丁汉.电子制造技术基础.机械工业出版社, 2005.
[6]李楠楠. RFID封装中热压模块温度控制系统的设计与实现.华中科技大学硕士论文,2007.5.
[7] Lau J.H. Electronic packaging: Design, Materials, Process and Reliability [M]. McGRAW-HILL Company,2003.
[8]佚名.RFID标签天线及读写器设计制造.RFID世界网.
[9]倪晓军,梁彤翔.导电胶的研究进展.电子元件与材料,2002年1月第1期:1~3.
[10]蔺永诚,陈旭.各项异性导电胶互连技术的研究进展.电子与封装,2006年7月第7期:1~7.
[11]刘运吉,杨道国,秦连城,张旭,李宇军.固化工艺参数对导电胶导电性能的影响.电子元件与材料, 2005年10月第10期: 20~26.
[12] Chang D D., Crawford PA,Fulton J A, et al. An overview and evaluation of anisotropically conductive adhesive film for fine pitch electronic assembly [J]. IEEE Trans Component, Package Manufacturing Technology, 1993, 16(8):828~835.
[13] Chan Y C, Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii.different bonding pressure [J].Microelectronic Reliability,2002,42:1195~1204.
[14] Chen X., Zhang J., Jiao C.L, et al. Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection [J]. Microelctronics Reliability, 2006, 46.
[15] Johan Liu,Zonghe Lai.Reliability of anisotropically conductive adhesive joints ona flip-chip/fr-4 substrate,transactions of ASME [J].J Electronic Package,2002,124:240~245.
[16] Zonghe Lai,Johan Liu. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates.IEEE Trans on Components,Packaging,and Manufacturing Technology[B],Vol 19,No.3,August 1996,644~660.
[17] Chan Y C,Luk D Y.Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly i.different bonding temperature [J].Microelectronic Reliability, 2002,42:1185~1194.
[18] Zhang J. H., Chan Y. C., Alam M. O., et al. Contact resistance and adhesion performance of ACF interconnections to aluminum metallization [J]. Microelectronics Reliability, 2003, 43: 1303~1310.
[19] Tan C. W., Chan Y. C., Yeung N. H. Effect of autoclave test on anisotropic conductive joints [J]. Microelectronics Reliability, 2003, 43: 279~285.
[20] Wei Z., Waf L. S., Loo N. Y., et al. Studies on moisture-induced failures in ACF interconnection [J]. Proceedings of the 4th Electronics Packaging Technology Conference, 2002: 133~138.
[21]商跃进.有限元原理与ANSYS应用指南.清华大学出版社, 2005.
[22] C. A. Harper. Electronic Assembly Fabrication. McGraw-Hill companies, Inc, 2002.
[23]邹茉莲.焊接理论及工艺基础.北京:北京航空航天大学出版社, 1994.9.
[24]傅岳鹏,谭凯,田民波.电子封装技术的最新进展.半导体技术,第34卷第2期2009年2月: 113~118.
[25] Alien Technology and RFID. http://www.alientechnology.com.
[26] F.Kriebel, Th.Seidowski. Smart labels-High volume applications using adhesive flip-chip-technologies. IEEE, 2001.
[27] John H. Lau. Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies. McGraw-Hill Companies, Inc, 2000.
[28]郭江华,王水弟,张忠会,胡涛,贾松良.倒装芯片凸焊点的UBM.半导体技术,2001年6月,第26卷第6期: 60~64.
[29]刘汉诚,汪正平,李宁成,李世玮.电子制造技术—利用无铅、无卤素和导电胶.化学工业出版社, 2005.
[30] Joachim Pajonk.New Flip Chip Technology Utilizing Non-Conductive Adhesive Adapted for High Volume Chip Card Module Production.IEEE/SEMI Int’l Electronics Manufacturing Technology Symposium,2004: 165~170.
[31]张智文.射频识别技术理论与实践.北京:中国科学技术出版社, 2008.
[32] RFID Technology Of Muehlbauer. http://www.muehlbauer.de.
[33] Datacon8800. http://www.datacon.at.
[34] Toray Tech. http://www.toray-eng.com.
[35] HRB user manual. http://www.hallys.co.jp/chi/html/rotary.html.
[36]郑堃.面向RFID标签封装的固化系统设计及其热分析.华中科技大学硕士论文,2006.5.
[37] Datacon. Discover the RFID tag production with Besi,2006.
[38]成大先.机械设计手册.北京:化学工业出版社,2002.
[39]黄国权.有限元法基础及ANSYS应用.北京:机械工业出版社,2004.
[40] Zinekiewicz OC, Taylor RL. The Finite Element Method. 4thed. London: MaGraw-Hill, 1991.
[41]周传月,腾万秀,张俊堂.工程有限元与优化分析实用实例教程.北京:科学出版社,2005.
[42]戴锅生.传热学.高等教育出版社,1999.
[43] Bathe KJ, Wilson EL. Numerical Methods in Finite Element Analysis. Prentice-Hall Inc, 1976: 109~208.
[44]小枫工作室.最新经典ANSYS及Workbench教程.电子工业出版社,2004.
[45] Saeed Moaveni. Finite Element Analysis: Theory and Application with ANSYS. Second Edition. New Jersey: Prentice Hall, 2003.
[46]康鹏工作室.UGNX3三维建模精彩实例导航.北京:机械工业出版社,2006.
[47]邢桂菊,黄素逸.热工实验原理和技术.冶金工业出版社, 2007.