晶圆针测技术之异常问题分析与研究
摘要
IC测试主要分为晶圆针测以及成品测试，其主要功能为检测出IC在制造过程中所发生的瑕疵并找出其中根本原因，以确保产品良率正常及提供测试资料作为IC设计及IC制造分析之用。
晶圆针测是针对整个芯片上的完整晶粒，以探针的方式扎在每颗晶粒上的焊垫进行检测，用来筛选芯片上晶粒之良品与不良品，另外在内存晶圆测试时，可针对可修护之晶粒予以雷射修补，以提高芯片的良率；然而，如何减少测试时间与降低测试时所发生的误宰，则是晶圆针测中的瓶颈。
在测试生产线上，昂贵的测试机台为主要的生产设备，机台折旧为主要的营运成本，也就是说机台闲置一个小时就有一个小时的折旧损失，因此，机台的产能利用率就关系到一个测试厂的营运状况。机台若能不断地正常生产,这也代表着机台以及产能利用率的提升;因此,要是在生产过程当中有不正常的异常状况发生时，如何能有效地分析问题并即时找到相对应的预防措施是非常重要的。
在晶圆探针测试当中，常会由于测试环境或是针测机台参数的改变，使得针痕不正常偏移并打出开窗区，造成测试时的误宰,因而造成公司的损失，本文将就晶圆针测中，由于不正常针痕偏移问题探讨进行分析与研究。
IC testing can be sorted by Wafer probing and Finial testing, their main function is to inspect the defective IC, which is in wafer fabrication, and then find out the root cause among the defective IC. They can make sure the product yield is correct and provide the testing data for IC designing and manufacturing analyzing.
Wafer probing can distinguish the good die and bad die by contacting the aluminum pad on the wafer for each die. For the memory products, Laser Repair can repair the repairable dice in addition. It can improve the yield for the wafer probing. However, how to reduce the testing time and overkill that is the bottleneck in wafer testing process.
On the testing production line, the costly testers are the primary production equipments. The equipment depreciation is the major working cost. For instance, if the equipment is idled for one hour, it would cost company one hour depreciation loss. So, the utilization ratio of the equipment is the major concerning for the testing factory. That is means if you could keep the equipment production normally and continually, that is stand for the utilization of the equipment is very efficiency. Therefore, it is very important if you could analyze the problem efficiently; find the prevention and solution methods timely when any abnormal is occurred during the production.
During the wafer testing process, due to the testing environment or prober parameter is changed that could cause probe mark shifting abnormally and even probe mark out of the aluminum pad. That will cause overkill and diminish the company’s profit. So at here, I will share my knowledge and research results on probe mark abnormally during the wafer testing process.
晶圆针测是针对整个芯片上的完整晶粒，以探针的方式扎在每颗晶粒上的焊垫进行检测，用来筛选芯片上晶粒之良品与不良品，另外在内存晶圆测试时，可针对可修护之晶粒予以雷射修补，以提高芯片的良率；然而，如何减少测试时间与降低测试时所发生的误宰，则是晶圆针测中的瓶颈。
在测试生产线上，昂贵的测试机台为主要的生产设备，机台折旧为主要的营运成本，也就是说机台闲置一个小时就有一个小时的折旧损失，因此，机台的产能利用率就关系到一个测试厂的营运状况。机台若能不断地正常生产,这也代表着机台以及产能利用率的提升;因此,要是在生产过程当中有不正常的异常状况发生时，如何能有效地分析问题并即时找到相对应的预防措施是非常重要的。
在晶圆探针测试当中，常会由于测试环境或是针测机台参数的改变，使得针痕不正常偏移并打出开窗区，造成测试时的误宰,因而造成公司的损失，本文将就晶圆针测中，由于不正常针痕偏移问题探讨进行分析与研究。
IC testing can be sorted by Wafer probing and Finial testing, their main function is to inspect the defective IC, which is in wafer fabrication, and then find out the root cause among the defective IC. They can make sure the product yield is correct and provide the testing data for IC designing and manufacturing analyzing.
Wafer probing can distinguish the good die and bad die by contacting the aluminum pad on the wafer for each die. For the memory products, Laser Repair can repair the repairable dice in addition. It can improve the yield for the wafer probing. However, how to reduce the testing time and overkill that is the bottleneck in wafer testing process.
On the testing production line, the costly testers are the primary production equipments. The equipment depreciation is the major working cost. For instance, if the equipment is idled for one hour, it would cost company one hour depreciation loss. So, the utilization ratio of the equipment is the major concerning for the testing factory. That is means if you could keep the equipment production normally and continually, that is stand for the utilization of the equipment is very efficiency. Therefore, it is very important if you could analyze the problem efficiently; find the prevention and solution methods timely when any abnormal is occurred during the production.
During the wafer testing process, due to the testing environment or prober parameter is changed that could cause probe mark shifting abnormally and even probe mark out of the aluminum pad. That will cause overkill and diminish the company’s profit. So at here, I will share my knowledge and research results on probe mark abnormally during the wafer testing process.
引文
[1] 杨雅岚, “晶圆测试技术趋势”, 工研院IEK-ITIS 计画, 2003
[2] 洪士程,林心宇, “以序的最佳化方法为基础降低晶圆测试之误宰与重测”, 2003
[3] 黄炜智,“大陆半导体制造业厂商现况”, ITIS 产业评析, 2002
[4] 林恩鹤,“逻辑测试产业关键设备与部品供货商评估及管理”, 国立清华大学工业工程研究所硕士论文, 2004
[5] 罗济平, “半导体测试夜的竞争优势与经营策”,国立清华大学科技管理研究所硕士论文, 2004
[6] 董钟明,”台湾测试产业回顾与趋势”, IEK 产业情报网,2005
[7] 李宜璋, “高速高频多芯片探针卡微探针电气特性之设计、仿真与制造”, 国立成功大学电机工程学系微电子所硕士论文,2004
[8] 黄荣堂 赖文雄 ”圆级探针卡简介” ,台北科技大学机电整合研究所, 2004
[9] 王敬业，“集成电路芯片在封装前利用钨探针量测系统及相关制程技术”，交通大学电子工程系硕士论文，1999
[10] 游啟源，2000.1，IC 股投資高手，P.13-17，財訊出版社
[11] 何宗宪、陈建良、张进群、陈俊杰、曾淑美、何土城、邓玉春，“IC 测试制程与设备简介”，机械工业杂志,1998
[12] SEMI web site: www.semi.com
[13] Spirox web site: www.spirox.com.tw
[14] JEM web site: www.jemam.com
[15] Formfactor web site: www.formfactor.com
[16] 中国台湾太平洋证券分析报告web site:www.nettrade.com.tw
[17] National semiconductor: www.national.com
[18] Cascade web site: www.cascademicrotech.com
[19] 亚洲电子科技网 web site:www.neataiwan.com.tw
[20] C. Barsotti, S. Tremaine and M. Bonham “Very High Density Probing,” IEEEInternational Test Conference, pp.608-614,1988.
[21] R. Dennis Bates “The Search For The Universal Probe Card Solution,” IEEEInternational Test Conference, pp.533-538,1997.
[22] W. R. Runyan and K. E. Bean, Semiconductor Integrated Processing Technology, Addison Welsey, 1990.
[23] T. R. Chen and C. W. Chen “Due Windows Scheduling for IC Sort and Testwith Precedence Constraints via Lagrangian Relaxion”,IEEE/SEMI Int’l Semiconductor Manufacturing Science Symposium, 1993.
[24] Ames, V. et al. 1995. Semiconductor Manufacturing Productivity: OverallEquipment Effectiveness Guidebook. Revision 1.0. SEMATECH.
[25] R. Iscoff, “What’s in the cards for wafer probing,”Semi conduct. Int ,1994
[2] 洪士程,林心宇, “以序的最佳化方法为基础降低晶圆测试之误宰与重测”, 2003
[3] 黄炜智,“大陆半导体制造业厂商现况”, ITIS 产业评析, 2002
[4] 林恩鹤,“逻辑测试产业关键设备与部品供货商评估及管理”, 国立清华大学工业工程研究所硕士论文, 2004
[5] 罗济平, “半导体测试夜的竞争优势与经营策”,国立清华大学科技管理研究所硕士论文, 2004
[6] 董钟明,”台湾测试产业回顾与趋势”, IEK 产业情报网,2005
[7] 李宜璋, “高速高频多芯片探针卡微探针电气特性之设计、仿真与制造”, 国立成功大学电机工程学系微电子所硕士论文,2004
[8] 黄荣堂 赖文雄 ”圆级探针卡简介” ,台北科技大学机电整合研究所, 2004
[9] 王敬业，“集成电路芯片在封装前利用钨探针量测系统及相关制程技术”，交通大学电子工程系硕士论文，1999
[10] 游啟源，2000.1，IC 股投資高手，P.13-17，財訊出版社
[11] 何宗宪、陈建良、张进群、陈俊杰、曾淑美、何土城、邓玉春，“IC 测试制程与设备简介”，机械工业杂志,1998
[12] SEMI web site: www.semi.com
[13] Spirox web site: www.spirox.com.tw
[14] JEM web site: www.jemam.com
[15] Formfactor web site: www.formfactor.com
[16] 中国台湾太平洋证券分析报告web site:www.nettrade.com.tw
[17] National semiconductor: www.national.com
[18] Cascade web site: www.cascademicrotech.com
[19] 亚洲电子科技网 web site:www.neataiwan.com.tw
[20] C. Barsotti, S. Tremaine and M. Bonham “Very High Density Probing,” IEEEInternational Test Conference, pp.608-614,1988.
[21] R. Dennis Bates “The Search For The Universal Probe Card Solution,” IEEEInternational Test Conference, pp.533-538,1997.
[22] W. R. Runyan and K. E. Bean, Semiconductor Integrated Processing Technology, Addison Welsey, 1990.
[23] T. R. Chen and C. W. Chen “Due Windows Scheduling for IC Sort and Testwith Precedence Constraints via Lagrangian Relaxion”,IEEE/SEMI Int’l Semiconductor Manufacturing Science Symposium, 1993.
[24] Ames, V. et al. 1995. Semiconductor Manufacturing Productivity: OverallEquipment Effectiveness Guidebook. Revision 1.0. SEMATECH.
[25] R. Iscoff, “What’s in the cards for wafer probing,”Semi conduct. Int ,1994