新型CPU集成热管散热技术研究
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摘要
近年来，随着个人电脑CPU工作频率的增加和集成度的不断提高，使得CPU表面的热流密度急剧上升，因而CPU的散热问题已经成为制约其发展的瓶颈。热管作为一种高效传热元件，具有极高的导热性、优良的等温性、高散热效率和良好的环境适应性等特点，非常适合于小温差高热流密度条件下的散热。将热管技术应用于CPU的冷却，已经成为当前CPU散热的发展趋势。
本文首先对CPU散热技术和热管型CPU散热器的国内外研究进展及现状进行了综述；介绍了热管工作基本原理，并对其主要传热热阻进行了分析；针对目前市场上用于CPU冷却的热管型散热器存在的不足，提出了具有散热效率高、结构简单、形式紧凑、接触热阻小、重量轻、成本低等特点的两款新型热管散热器——单管扁曲型集成热管散热器和多管扁曲型集成热管散热器；利用CFD软件对上述两款散热器的外部流场分别进行了数值模拟，确定了单管扁曲型集成热管散热器的结构尺寸，同时通过对相同横截面面积的圆形和椭圆形两种热管的外部流场的数值模拟，证实了椭圆形热管的优越性，为多管扁曲型热管的结构确定指明了方向；在上述研究的基础上，加工制造了单管扁曲型集成热管散热器；根据国家关于电力半导体有关测试标准，建立了散热器性能测试试验台以及热管工质灌注系统；测试了单管扁曲型集成热管散热器的均温性以及不同充液量、不同工质以及不同风速对其传热性能的影响；测试结果表明，单管扁曲型集成热管散热器完全能够满足200W的CPU散热量。
In recent years, with the increase in integral density and performance and the decrease in size for CPU of PC, heat flux is critically high. So the heat dissipation has become the bottleneck in development of CPU. As a two-phase heat transfer device, heat pipe can transport a considerate quantity of heat with a very small temperature difference from evaporation section to condensing section, so heat pipe is widely applied to the field of high heat flux due to its intrinsic merits such as superior conductivity, surface temperature uniformity, high efficiency of heat transfer and compact and adaptable structure, ect. Therefore, heat sink with heat pipes has become the trend of CPU cooling in the future.
At first, the technology for CPU cooling and the development of heat sink using heat pipe for CPU were summarized in this paper. Then, the operating principle and the main thermal resistances of heat pipe introduced briefly. In view of the disadvantage of the heat sink using heat pipe for CPU cooling in the market, two new structure of heat pipe heat sinks were brought forward: single-tube flat-flexed integrated heat pipes [SFIHP] and multi-tube flat-flexed integrated heat pipes [MFIHP], which have many advantages, such as high heat dissipate efficiency, simple structure, low contact thermal resistances, light weight, low cost and so on. The method of CFD numerical simulation is employed to simulate the exterior fluid field of the two new types of heat pipe heat sinks and determined the structure and size of FBSIHP. At the same time, after the simulated to the exterior fluid field of the same cross section area round heat pipes and ellipse heat pipes which have equal cross section area. In conclusion, the advantage of the ellipse heat pipes was approved which point out the direction for the determination of the MFBSIHP structure and size.
After the investigation about the heat pipe on the forward in the paper, one FBSIHP model was made. According to GB/T 8446.2-2004, an experimental system was established to test heat transfer performance of FBSIHP. A heat pipe filling system was set up also. The temperature uniformity of the surface of the FBSIHP and the influence in different working fluid filling, different working fluid and different air upwind velocities was tested in the paper. In conclusion, the tests show that the FBSIHP can adapt 200W CPU heat cooling completely.
本文首先对CPU散热技术和热管型CPU散热器的国内外研究进展及现状进行了综述；介绍了热管工作基本原理，并对其主要传热热阻进行了分析；针对目前市场上用于CPU冷却的热管型散热器存在的不足，提出了具有散热效率高、结构简单、形式紧凑、接触热阻小、重量轻、成本低等特点的两款新型热管散热器——单管扁曲型集成热管散热器和多管扁曲型集成热管散热器；利用CFD软件对上述两款散热器的外部流场分别进行了数值模拟，确定了单管扁曲型集成热管散热器的结构尺寸，同时通过对相同横截面面积的圆形和椭圆形两种热管的外部流场的数值模拟，证实了椭圆形热管的优越性，为多管扁曲型热管的结构确定指明了方向；在上述研究的基础上，加工制造了单管扁曲型集成热管散热器；根据国家关于电力半导体有关测试标准，建立了散热器性能测试试验台以及热管工质灌注系统；测试了单管扁曲型集成热管散热器的均温性以及不同充液量、不同工质以及不同风速对其传热性能的影响；测试结果表明，单管扁曲型集成热管散热器完全能够满足200W的CPU散热量。
In recent years, with the increase in integral density and performance and the decrease in size for CPU of PC, heat flux is critically high. So the heat dissipation has become the bottleneck in development of CPU. As a two-phase heat transfer device, heat pipe can transport a considerate quantity of heat with a very small temperature difference from evaporation section to condensing section, so heat pipe is widely applied to the field of high heat flux due to its intrinsic merits such as superior conductivity, surface temperature uniformity, high efficiency of heat transfer and compact and adaptable structure, ect. Therefore, heat sink with heat pipes has become the trend of CPU cooling in the future.
At first, the technology for CPU cooling and the development of heat sink using heat pipe for CPU were summarized in this paper. Then, the operating principle and the main thermal resistances of heat pipe introduced briefly. In view of the disadvantage of the heat sink using heat pipe for CPU cooling in the market, two new structure of heat pipe heat sinks were brought forward: single-tube flat-flexed integrated heat pipes [SFIHP] and multi-tube flat-flexed integrated heat pipes [MFIHP], which have many advantages, such as high heat dissipate efficiency, simple structure, low contact thermal resistances, light weight, low cost and so on. The method of CFD numerical simulation is employed to simulate the exterior fluid field of the two new types of heat pipe heat sinks and determined the structure and size of FBSIHP. At the same time, after the simulated to the exterior fluid field of the same cross section area round heat pipes and ellipse heat pipes which have equal cross section area. In conclusion, the advantage of the ellipse heat pipes was approved which point out the direction for the determination of the MFBSIHP structure and size.
After the investigation about the heat pipe on the forward in the paper, one FBSIHP model was made. According to GB/T 8446.2-2004, an experimental system was established to test heat transfer performance of FBSIHP. A heat pipe filling system was set up also. The temperature uniformity of the surface of the FBSIHP and the influence in different working fluid filling, different working fluid and different air upwind velocities was tested in the paper. In conclusion, the tests show that the FBSIHP can adapt 200W CPU heat cooling completely.
引文
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[2] Masataka Mochizuki, Thang Nguyen, Koichi Mashiko ect. Practical Application of Heat Pipe and Vapor Chamber for Cooling High Performance Personal Computer. 13# International Heat Pipe Conference, Shanghai, China, 2004.
[3] 姚广寿，马哲树，罗林等．电子电器设备中高效热管散热技术的研究现状及发展．第八届全国热管会议：中国工程热物理学会热管专业组，成都，2002．7．
[4] L A Nelson, K S Sekhon, J E Frita. Pirect heat pipe cooling of semiconductor devices. Proceedings of the 3~# International Heat Pipe Conference, 1978.
[5] Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim k ect.. Heat pipe cooling technology for desktop PC CPU. Applied Thermal Engineering 23(2003) 1137-1144.
[6] 庄骏，张红．热管技术及其工程应用．北京：化学工业出版社工业装备与信息工程出版社中心 2000，6．
[7] 孙玮 热管型电子器件散热器的数值模拟和试验研究：(硕士学位论文)杭州：浙江大学2003．
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[10] 孔巧玲 贺建华．热管在笔记本电脑散热中的应用．电脑开发与应用 17(2)，PP39-41．
[11] 殷际英．一种热管式 CPU 芯片散热器的原理结构设计．新设备·新材料·新方法轻工机械，2004年第1期，pp105-107．
[12] 范春利，曲伟，杨立等．微槽平板热管传热性能的试验研究．海军工程大学学报 16(2)2004年4月．
[13] 范春利 曲伟，孙丰瑞等．重力对微槽平板热管传热性能的影响．热能动力工程19(1) 2004年1月．
[14] 喜娜．CPU 集成热管散热器的研究(硕士学位论文)。大连：大连理工大学，2005．
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[16] 笔记本电脑散热！-你注意了吗? http://www.dgnote.com/list.asp?unid=114
[17] Ryan J, McGlen, Roshan Jachuck, ect.. Integrated thermal management techniques for high power electronic devices. Applied Thermal Engineering 24(2004) 1143-1156.
[18] Seok Hwan Moon, Gunn Hwang, Sang Choon Ko ect. Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon. Microelectronics Reliability 44(2004) 315-321.
[19] V. G. Pastukhov, Yu. F. Maidanik, C. V. Vershinin ect. Miniature loop heat pipes for electronics cooling Applied. Thermal Engineering 23(2003) 1125-1135.
[20] Takahiro Shimura Satoru Isogai Yuichi Kimura. Heat Pipe Remote Cooling for Semiconductive Devece. 13# International Heat Pipe Conference, Shanghai, China, 2004.
[21] Yao Wenjiang, Chen JianLiang. Development of the heat pipe used for an electronic equipment casing. 13# International Heat Pipe Conference, Shanghai, China, 2004.
[22 Eric DiStefano, Himanshu Pokhama, Sridhar V. Machiroutu. Raising The Bar for Heat Pipe in Notebook Cooling. 13# International Heat Pipe Conference, Shanghai, China, 2004.
[23] Masataka Mochizuki, Koichi Mashiko. Cactus-type heat pipe for cooling CPU. Heat pipe technology Pergamon, 1997.
[24] Howard, W. Markctein. Cooling techniques for today's electronics. EP&P, 1997: 78-82.
[25] K. Vafai, W. Wang. Analysis of flow and heat transfer characteristics of an asymmetrical flat plate heat pipe. International Journal of Heat and Mass Transfer, 1992. v35, pp2087-2099.
[26] Wang Y, Vafai. K. Transient characterization of flat plate heat pipe during startup and shutdown operation. International Journal of Heat and Mass Transfer, 2000.v43, n15, p2641-2655.
[27] W. Wang, Vafai. K. Experimental investigation of the thermal performance of an asymmetrical flat plate heat pipe. International Journal of Heat and Mass Transfer, 2000.v43, n15, pp2657-2668.
[28] N. ZHU, K. Vafai. Vapor and liquid flow in an asymmetrical flat plate heat pipe: a three-dimensional analytical and numerical investigation. International Journal of Heat and Mass Transfer. 1998. V41, n1, pp159-174
[29] N. ZHU, K. Vafai. Analytical modeling of the startup characteristics of asymmetrical flat-plate and disk-shaped heat pipes. 1998. V41, n17, pp2619-2637.
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