高体积分数SiCp/Al复合材料精密磨削机理及表面评价研究
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摘要
SiC颗粒体积含量50%以上的高体积分数碳化硅铝基复合材料(SiCp/Al)不仅具有高比模量、低膨胀等优异性能,而且在密度、热导率、热变形系数等关键指标上优于SiC,已成为替代微晶玻璃、石英玻璃、SiC材料等的重要反射镜材料。由于SiCp/Al复合材料中SiC颗粒增强相与Al合金基体相截然不同的特性,其加工比单纯的金属和脆性材料更为困难,加工机理也更为复杂,已加工表面缺陷严重,常规的表面粗糙度也难以对其加工表面给予合理的评价。对其精密、超精密加工技术,加工机理及表面完整性进行研究具有重要的理论和实际意义。本文针对高体积分数SiCp/Al复合材料精密磨削加工难题,对其精密磨削机理、已加工表面缺陷特征、已加工表面的评价表征方法及高完整性表面形成机理和条件进行了深入系统的研究,主要研究内容如下：
(1)研究了高体积分数SiCp/Al复合材料的磨削去除形式,应用SEM观察分析了SiCp/Al复合材料磨削表面缺陷及磨屑的形貌特征和类型,提出了其形成机理。应用压痕实验和压痕断裂力学理论研究了压痕深度、压痕作用位置及SiC颗粒形状对SiC颗粒裂纹产生的影响,进而提出了实现硬质SiC颗粒增强相塑性域去除的机理和条件。建立SiCp/Al复合材料塑性域磨削条件的三维非线性有限元模型,研究了磨粒钝球半径和压入深度对复合材料硬质增强相SiC颗粒脆-塑性转变的影响。
(2)对高体积分数SiCp/Al复合材料进行了精密磨削实验。对湿式磨削、干式磨削、低温冷冻磨削和ELID磨削工艺条件下的磨削力作了对比研究,分析磨削深度、工件进给速度和磨削工艺条件对磨削力的影响规律,并研究磨削SiCp/Al复合材料时的磨削力分力比的变化规律,从而进一步的揭示SiCp/Al复合材料的去除机理。
(3)研究了高体积分数SiCp/Al复合材料磨削表面的形成机理。研究了低温冷冻处理对SiCp/Al复合材料硬度、残余应力及界面结合情况的影响,在此基础上研究低温冷冻条件下高完整性表面的形成机理。在ELID精密磨削条件下,从磨粒的微刃性、等高性,钝化膜的作用及磨粒的微切削作用几方面,揭示ELID精密磨削条件下SiCp/Al复合材料的高完整性表面的形成机理。在低温冷冻磨削条件下的高完整性表面磨削加工机理及理论研究是一个新的探索。
(4)针对SiCp/Al复合材料磨削加工表面形貌的特点及主要的缺陷形式,在对二维粗糙度评定参数与三维粗糙度评定参数表征方法,功率谱密度和表面分形维数表征方法的适用性进行比较后,建立能够真实反映SiCp/Al复合材料磨削加工表面微观形貌的表征参数体系,利用表面粗糙度三维评定参数和表面功率谱密度对SiCp/Al复合材料磨削加工表面的幅度特征和空间波长分布特征进行表征。在此基础上,对磨削加工SiCp/Al复合材料表面质量进行评价,分析磨削参数和磨削工艺条件对加工表面质量的影响,为工程生产实际提供参考依据和理论指导。
Not only owing to their superior thermo-physical properties such as high specific modulus and low thermal expansion, but also in the density, thermal conductivity and thermal deformation coefficient superior to that of SiC, SiC particles reinforced aluminum matrix (SiCp/Al) composites with high volume fraction containing more50%SiC particles are being widely used to replace the conventional materials such as glass, quartz glass and SiC material in space mirror material. Because of SiC particles and Al alloy matrix in SiCp/Al composites with distinct characteristics, compared to the monolithic alloys and ductile material, its processing is more difficult and its grinding mechanism is complex, which leads to much special surface morphology. Conventional surface roughness of machined surface is also difficult to give reasonable evaluation. Therefore, the studies on technology of the precision and ultra precision machining, machining mechanism and surface integrity have important theoretical and practical significance. Aiming to solve the precision and ultra precision grinding machining problems existing in processing SiCp/Al composites with high volume fraction, this paper makes a research on the precision and ultra precision grinding mechanism, surface defect characteristics, the evaluation methods of machined surface, high surface integrity formation mechanism and conditions, the main studies are as follows:
1. The grinding removal model of SiCp/Al composites was established. The surface defects, chips morphology and type were observed with scanning electron microscope (SEM), and its formation mechanism was put forward. Based on indentation experiments and fracture mechanics theory, the effect of indentation depth, indentation position and the shape of SiC particle on crack formation of SiC particles have been investigated. And the ductile-regime removal mechanism and conditions of SiC particles were put forward. Three-dimensional nonlinear finite element model of ductile-regime grinding condition of SiCp/Al composites was established to analyze the influence of edge radius of grain and indentation depth on the ductile-brittle transition of hard and brittle SiC particles.
2. A series of experiments for the surface grinding process were conducted on SiCp/Al composites with high volume fraction by diamond grinding wheel, in order to investigate the effect of different grinding conditions (wet, dry, cryogenic and ELID grinding conditions) and various grinding parameters on the grinding force and grinding force ratio during grinding of SiCp/Al composites. These studies further revealed the grindability and removal mechanism of SiCp/Al composites.
3. The surface formation mechanism of high integrity surface in ductile grinding under cryogenic and ELID grinding conditions was studied. The formation mechanism of high integrity surface was studied under cryogenic grinding condition on the basis the analysis of micro-area hardness, two-phase residual stress and interface combination status before and after freezing treatment. Micro edge and equal high properties of wheel grains, passive film and micro-cutting effect of grains revealed formation mechanism of high integrity surface under the ELID precision grinding conditions. The grinding mechanism and theoretical research of high integrity surface under cryogenic conditions is a new exploration.
4. According to surface morphology characteristics and typical defects of the SiCp/Al composites, comparative analysis of characterization method of two-dimensional roughness and three-dimensional roughness, power spectrum density and surface fractal dimension were made in this paper. The objective characterization parameter system of SiCp/Al composites grinded surface was established. The three dimensional evaluation parameters of surface roughness and surface power spectrum density respectively indicate the amplitudes characteristics and spatial wavelength distribution characterization of SiCp/Al composites grinding surface. Based on the characterization system, machined surface quality of SiCp/Al composites was evaluated. The influence of grinding parameters and grinding conditions on machined surface quality was analyzed, which contributes to references and theoretical guidance for practical application.
(1)研究了高体积分数SiCp/Al复合材料的磨削去除形式,应用SEM观察分析了SiCp/Al复合材料磨削表面缺陷及磨屑的形貌特征和类型,提出了其形成机理。应用压痕实验和压痕断裂力学理论研究了压痕深度、压痕作用位置及SiC颗粒形状对SiC颗粒裂纹产生的影响,进而提出了实现硬质SiC颗粒增强相塑性域去除的机理和条件。建立SiCp/Al复合材料塑性域磨削条件的三维非线性有限元模型,研究了磨粒钝球半径和压入深度对复合材料硬质增强相SiC颗粒脆-塑性转变的影响。
(2)对高体积分数SiCp/Al复合材料进行了精密磨削实验。对湿式磨削、干式磨削、低温冷冻磨削和ELID磨削工艺条件下的磨削力作了对比研究,分析磨削深度、工件进给速度和磨削工艺条件对磨削力的影响规律,并研究磨削SiCp/Al复合材料时的磨削力分力比的变化规律,从而进一步的揭示SiCp/Al复合材料的去除机理。
(3)研究了高体积分数SiCp/Al复合材料磨削表面的形成机理。研究了低温冷冻处理对SiCp/Al复合材料硬度、残余应力及界面结合情况的影响,在此基础上研究低温冷冻条件下高完整性表面的形成机理。在ELID精密磨削条件下,从磨粒的微刃性、等高性,钝化膜的作用及磨粒的微切削作用几方面,揭示ELID精密磨削条件下SiCp/Al复合材料的高完整性表面的形成机理。在低温冷冻磨削条件下的高完整性表面磨削加工机理及理论研究是一个新的探索。
(4)针对SiCp/Al复合材料磨削加工表面形貌的特点及主要的缺陷形式,在对二维粗糙度评定参数与三维粗糙度评定参数表征方法,功率谱密度和表面分形维数表征方法的适用性进行比较后,建立能够真实反映SiCp/Al复合材料磨削加工表面微观形貌的表征参数体系,利用表面粗糙度三维评定参数和表面功率谱密度对SiCp/Al复合材料磨削加工表面的幅度特征和空间波长分布特征进行表征。在此基础上,对磨削加工SiCp/Al复合材料表面质量进行评价,分析磨削参数和磨削工艺条件对加工表面质量的影响,为工程生产实际提供参考依据和理论指导。
Not only owing to their superior thermo-physical properties such as high specific modulus and low thermal expansion, but also in the density, thermal conductivity and thermal deformation coefficient superior to that of SiC, SiC particles reinforced aluminum matrix (SiCp/Al) composites with high volume fraction containing more50%SiC particles are being widely used to replace the conventional materials such as glass, quartz glass and SiC material in space mirror material. Because of SiC particles and Al alloy matrix in SiCp/Al composites with distinct characteristics, compared to the monolithic alloys and ductile material, its processing is more difficult and its grinding mechanism is complex, which leads to much special surface morphology. Conventional surface roughness of machined surface is also difficult to give reasonable evaluation. Therefore, the studies on technology of the precision and ultra precision machining, machining mechanism and surface integrity have important theoretical and practical significance. Aiming to solve the precision and ultra precision grinding machining problems existing in processing SiCp/Al composites with high volume fraction, this paper makes a research on the precision and ultra precision grinding mechanism, surface defect characteristics, the evaluation methods of machined surface, high surface integrity formation mechanism and conditions, the main studies are as follows:
1. The grinding removal model of SiCp/Al composites was established. The surface defects, chips morphology and type were observed with scanning electron microscope (SEM), and its formation mechanism was put forward. Based on indentation experiments and fracture mechanics theory, the effect of indentation depth, indentation position and the shape of SiC particle on crack formation of SiC particles have been investigated. And the ductile-regime removal mechanism and conditions of SiC particles were put forward. Three-dimensional nonlinear finite element model of ductile-regime grinding condition of SiCp/Al composites was established to analyze the influence of edge radius of grain and indentation depth on the ductile-brittle transition of hard and brittle SiC particles.
2. A series of experiments for the surface grinding process were conducted on SiCp/Al composites with high volume fraction by diamond grinding wheel, in order to investigate the effect of different grinding conditions (wet, dry, cryogenic and ELID grinding conditions) and various grinding parameters on the grinding force and grinding force ratio during grinding of SiCp/Al composites. These studies further revealed the grindability and removal mechanism of SiCp/Al composites.
3. The surface formation mechanism of high integrity surface in ductile grinding under cryogenic and ELID grinding conditions was studied. The formation mechanism of high integrity surface was studied under cryogenic grinding condition on the basis the analysis of micro-area hardness, two-phase residual stress and interface combination status before and after freezing treatment. Micro edge and equal high properties of wheel grains, passive film and micro-cutting effect of grains revealed formation mechanism of high integrity surface under the ELID precision grinding conditions. The grinding mechanism and theoretical research of high integrity surface under cryogenic conditions is a new exploration.
4. According to surface morphology characteristics and typical defects of the SiCp/Al composites, comparative analysis of characterization method of two-dimensional roughness and three-dimensional roughness, power spectrum density and surface fractal dimension were made in this paper. The objective characterization parameter system of SiCp/Al composites grinded surface was established. The three dimensional evaluation parameters of surface roughness and surface power spectrum density respectively indicate the amplitudes characteristics and spatial wavelength distribution characterization of SiCp/Al composites grinding surface. Based on the characterization system, machined surface quality of SiCp/Al composites was evaluated. The influence of grinding parameters and grinding conditions on machined surface quality was analyzed, which contributes to references and theoretical guidance for practical application.
引文
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