基于潮解作用的KDP晶体抛光技术的研究
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摘要
KDP(Potassium Dihydrogen Phosphate,磷酸二氢钾)晶体是20世纪40年代发展起来的一种非常优良的电光非线性光学晶体材料。这种材料是“惯性约束核聚变”(ICF)固体激光驱动器、强激光武器中不可替代的光学倍频转换器和电光开关器件用材料。但是,KDP晶体具有质软、脆性高、易潮解、对温度变化敏感的特点,这些特点对其加工十分不利,同时,激光惯性约束核聚变对KDP晶体光学元件的要求很高,所有这些使得KDP晶体零件的制造非常困难,大尺寸高精度光学KDP晶体零件是目前公认的最难加工的光学零件之一。目前应用于KDP晶体超精密加工的方法都不同程度地存在着一定的问题,还有待于进一步完善。在努力完善原有KDP晶体超精密加工方法的同时,也应该积极探索新的KDP晶体超精密加工方法,以满足实际应用的需要。
为了适应KDP晶体超精密加工技术的发展需要,本文提出一种利用潮解作用对KDP晶体进行超精密加工的新技术,即基于潮解作用的KDP晶体抛光技术。本文对该方法的关键技术进行了研究,具体的研究内容包括:
本文首先综述了KDP晶体超精密加工技术的国内外发展现状,简要介绍了一些新型抛光技术,在此基础之上,根据KDP晶体的易潮解性质,提出了基于潮解作用的KDP晶体抛光技术。
在对KDP晶体材料进行介绍和对潮解本质进行研究的基础上,进行了KDP晶体表面溶解实验,并借鉴晶片化学机械抛光(CMP)中材料的去除机制,提出了基于潮解作用的KDP晶体抛光的材料去除机制。对基于潮解作用的KDP晶体抛光工艺进行了规划,进行了基于潮解作用的KDP晶体抛光实验,验证了所提出材料去除机制的正确性、可行性与有效性。
在对基于潮解作用的KDP晶体抛光过程进行简单分析的基础上,探讨了对基于潮解作用的KDP晶体抛光中溶解作用进行控制的意义,提出了通过含水的抛光液对水的溶解作用进行控制的思想,重点对抛光液进行了研究,研制出了抛光液。通过基于潮解作用的KDP晶体抛光实验,对所提出溶解作用控制方法进行了验证,并检验了所研制抛光液的性能。
通过基于潮解作用的KDP晶体抛光工艺实验,研究了KDP晶体表面初始状况、抛光时间、抛光盘转数等输入变量对基于潮解作用的KDP晶体抛光材料去除和表面粗糙度的影响,获得了较优的工艺参数组合范围,为基于潮解作用的KDP晶体抛光技术的进一步研究与应用奠定了基础。
对基于潮解作用的KDP晶体抛光过程进行了运动学分析,并在此基础上对基于潮解作用的KDP晶体抛光相对运动轨迹进行了研究,进行了相对速度分析和抛光行程分析。从理论上对基于潮解作用的KDP晶体抛光过程进行了分析,研究了基于潮解作用的KDP晶体抛光中主要因素对抛光过程的影响。
KDP (Potassium Dihydrogen Phosphate) crystal is a kind of good electro-optic nonlinear optical material developed in 1940s. In solid-state lasers for Inertial Confinement Fusion(ICF) and high power laser weapons, it is an irreplaceable material for the application in optical frequency converters and electro-optic switches. But the KDP crystal is soft, fragile, deliquescent and sensitive to temperature change, which is very disadvantageous to its machining. At the same time, in ICF, high demands are made on the optical elements of KDP crystal. All of these make it difficult to machine KDP crystal, optical parts with large sizes and high precision made of it is known as one kind of the optics most difficult to fabricate. Presently, the ultraprecision machining methods applied to KDP crystals have some defects, they still remain to be further improved. In order to meet the requirements of practical applications, on the one hand, the existing ultraprecision machining methods applied to KDP crystals should be improved, on the other hand, new ultraprecision machining technologies for KDP crystals should be searched after.
To meet the requirement of the developing in ultraprecision machining technologies for KDP crystals, this dissertation proposes a new technology, i.e. polishing technology for KDP crystals based on deliquescent action, which utilizes deliquescent action for ultraprecision machining KDP crystals. The key technologies of this method are studied in the dissertation. The main aspects of the study are including:
First the general status of the ultraprecision machining methods applied to KDP crystals in both domestic and overseas is reviewed, and some novel polishing technologies are briely introduced. On the basis of the review and the introduction, according to the characteristic that KDP crystal is deliquescent, the polishing technology for KDP crystals based on deliquescent action is proposed.
Based on the introduction of KDP crystal and the researching of essence of deliquescence, the dissolution experiment of KDP crystal’s surface was conducted, and referring to the material removal mechanism in chemical mechanical polishing wafer, the material removal mechanism in polishing of KDP crystals based on deliquescent action is proposed. The polishing process of KDP crystals based on deliquescent action was planned, the polishing experiment of KDP crystal based on deliquescent action was carried out, the validity, feasibility and effectiveness of the material removal mechanism was verified.
On the basis of analyzing the polishing process of KDP crystals based on deliquescent action simply, the significance of controlling the deliquescent action in polishing of KDP crystals based on deliquescent action is discussed, the ieda of controlling the deliquescent action of water through polishing fluid with water is proposed. The polishing fluid is studied with emphasis. The polishing fluid was developed. Through polishing experiments of KDP crystals based on deliquescent action, the controlling method of deliquescent action was verified, and the performance of the developed polishing fluid was tested.
Through polishing experiments of KDP crystals based on deliquescent action, effect of main input variables, including KDP crystal’s initial surface state, polishing time, revolution of polishing plate, etc., on material removal and surface roughness in polishing of KDP crystals based on deliquescent action is stuedied. The processing parameters combination is achieved to get better polishing results in polishing of KDP crystals based on deliquescent action. The study will be the basis for the further researching and application of the polishing technology for KDP crystals based on deliquescent action.
To the polishing process of KDP crystal based on deliquescent action, kinematic analysis is made. On the basis of the analysis, track, velocity and polishing distance of a point on the KDP crystal’s surface in polishing of KDP crystal based on deliquescent action are studied. The polishing process of KDP crystal based on deliquescent action is analyzed theoretically, and the effect of main parameters in polishing on polishing process is studied.
为了适应KDP晶体超精密加工技术的发展需要,本文提出一种利用潮解作用对KDP晶体进行超精密加工的新技术,即基于潮解作用的KDP晶体抛光技术。本文对该方法的关键技术进行了研究,具体的研究内容包括:
本文首先综述了KDP晶体超精密加工技术的国内外发展现状,简要介绍了一些新型抛光技术,在此基础之上,根据KDP晶体的易潮解性质,提出了基于潮解作用的KDP晶体抛光技术。
在对KDP晶体材料进行介绍和对潮解本质进行研究的基础上,进行了KDP晶体表面溶解实验,并借鉴晶片化学机械抛光(CMP)中材料的去除机制,提出了基于潮解作用的KDP晶体抛光的材料去除机制。对基于潮解作用的KDP晶体抛光工艺进行了规划,进行了基于潮解作用的KDP晶体抛光实验,验证了所提出材料去除机制的正确性、可行性与有效性。
在对基于潮解作用的KDP晶体抛光过程进行简单分析的基础上,探讨了对基于潮解作用的KDP晶体抛光中溶解作用进行控制的意义,提出了通过含水的抛光液对水的溶解作用进行控制的思想,重点对抛光液进行了研究,研制出了抛光液。通过基于潮解作用的KDP晶体抛光实验,对所提出溶解作用控制方法进行了验证,并检验了所研制抛光液的性能。
通过基于潮解作用的KDP晶体抛光工艺实验,研究了KDP晶体表面初始状况、抛光时间、抛光盘转数等输入变量对基于潮解作用的KDP晶体抛光材料去除和表面粗糙度的影响,获得了较优的工艺参数组合范围,为基于潮解作用的KDP晶体抛光技术的进一步研究与应用奠定了基础。
对基于潮解作用的KDP晶体抛光过程进行了运动学分析,并在此基础上对基于潮解作用的KDP晶体抛光相对运动轨迹进行了研究,进行了相对速度分析和抛光行程分析。从理论上对基于潮解作用的KDP晶体抛光过程进行了分析,研究了基于潮解作用的KDP晶体抛光中主要因素对抛光过程的影响。
KDP (Potassium Dihydrogen Phosphate) crystal is a kind of good electro-optic nonlinear optical material developed in 1940s. In solid-state lasers for Inertial Confinement Fusion(ICF) and high power laser weapons, it is an irreplaceable material for the application in optical frequency converters and electro-optic switches. But the KDP crystal is soft, fragile, deliquescent and sensitive to temperature change, which is very disadvantageous to its machining. At the same time, in ICF, high demands are made on the optical elements of KDP crystal. All of these make it difficult to machine KDP crystal, optical parts with large sizes and high precision made of it is known as one kind of the optics most difficult to fabricate. Presently, the ultraprecision machining methods applied to KDP crystals have some defects, they still remain to be further improved. In order to meet the requirements of practical applications, on the one hand, the existing ultraprecision machining methods applied to KDP crystals should be improved, on the other hand, new ultraprecision machining technologies for KDP crystals should be searched after.
To meet the requirement of the developing in ultraprecision machining technologies for KDP crystals, this dissertation proposes a new technology, i.e. polishing technology for KDP crystals based on deliquescent action, which utilizes deliquescent action for ultraprecision machining KDP crystals. The key technologies of this method are studied in the dissertation. The main aspects of the study are including:
First the general status of the ultraprecision machining methods applied to KDP crystals in both domestic and overseas is reviewed, and some novel polishing technologies are briely introduced. On the basis of the review and the introduction, according to the characteristic that KDP crystal is deliquescent, the polishing technology for KDP crystals based on deliquescent action is proposed.
Based on the introduction of KDP crystal and the researching of essence of deliquescence, the dissolution experiment of KDP crystal’s surface was conducted, and referring to the material removal mechanism in chemical mechanical polishing wafer, the material removal mechanism in polishing of KDP crystals based on deliquescent action is proposed. The polishing process of KDP crystals based on deliquescent action was planned, the polishing experiment of KDP crystal based on deliquescent action was carried out, the validity, feasibility and effectiveness of the material removal mechanism was verified.
On the basis of analyzing the polishing process of KDP crystals based on deliquescent action simply, the significance of controlling the deliquescent action in polishing of KDP crystals based on deliquescent action is discussed, the ieda of controlling the deliquescent action of water through polishing fluid with water is proposed. The polishing fluid is studied with emphasis. The polishing fluid was developed. Through polishing experiments of KDP crystals based on deliquescent action, the controlling method of deliquescent action was verified, and the performance of the developed polishing fluid was tested.
Through polishing experiments of KDP crystals based on deliquescent action, effect of main input variables, including KDP crystal’s initial surface state, polishing time, revolution of polishing plate, etc., on material removal and surface roughness in polishing of KDP crystals based on deliquescent action is stuedied. The processing parameters combination is achieved to get better polishing results in polishing of KDP crystals based on deliquescent action. The study will be the basis for the further researching and application of the polishing technology for KDP crystals based on deliquescent action.
To the polishing process of KDP crystal based on deliquescent action, kinematic analysis is made. On the basis of the analysis, track, velocity and polishing distance of a point on the KDP crystal’s surface in polishing of KDP crystal based on deliquescent action are studied. The polishing process of KDP crystal based on deliquescent action is analyzed theoretically, and the effect of main parameters in polishing on polishing process is studied.
引文
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