铜铝复合母线排的电学性能及界面稳定性的研究
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摘要
采用轧制复合技术生产的铜—铝复合板，不仅具有结合面过渡电阻和热阻抗低，还具有耐蚀、延展性和成形性好等综合性能，是母线排的材料制备的重要发展方向。但是，铜铝双金属冷轧复合技术的实际生产还存在轧制复合工艺和后续热处理工艺参数的确定，以及工艺参数对复合板界面状态，界面稳定性，导电性等方面性能的影响研究不够等问题。为此，本文利用ANSYS软件模拟分析了铜铝复合板的导电性能及加载电压频率、铜铝复合板厚度、铜铝复合板宽度、铜层厚度以及复合板型对铜铝复合板导电性的影响；并研究了热处理温度及保温时间对铜铝复合板界面形貌、扩散层以及界面撕裂的影响，分析了复合板界面热疲劳性能。
结果表明：相同条件的铜铝复合板加载电压频率由50Hz增加到1000Hz时，其总电流密度大幅下降，复合板的阻抗显著增加；随着铜层厚度、复合板厚度和复合板宽度的增加，铜铝复合板上总的电流密度均逐渐增加，复合板的阻抗逐渐减小，通过模拟获得的铜与铝的最佳厚度比为0.2；铜铝复合板的外形对铜铝复合板的导电性有很大影响，四面覆铜的直角边铜铝复合板相对于圆边复合板加载相同电压时，电流密度分布较规则，但电流集中程度要低；相同规格的铜铝复合板的导电性略低于纯铜母线，但明显优于纯铝母线排，可实现相同规格母线排的替代。
在热处理过程中，由于Cu、Al原子逐渐穿越界面发生远程扩散，Cu／Al界面的界线越来越模糊，在界面附近形成一定深度的扩散过渡区域，扩散层厚度也随着热处理温度和时间的增加而增加；随着热处理温度的增加，复合板撕裂界面由类韧窝状逐渐转变为类河流状最后转变为花芯状，界面撕裂也由韧性撕裂逐渐转变为脆性撕裂；轧制铜铝复合板在有应力和无应力状态下进行热疲劳实验后，复合界面保持良好的结合状态，表明复合板界面层具有良好的热稳定性。
Cu/Al clad plate that is produced by clad rolling technique has been the research focus in the field of bus-bar materials for its advantages of not only low bonding resistance of both heat and electricity, but also good ductibility and forming property. However, there are many deficiencies in its research such as the control of process parameter during clad rolling and the subsequent heat treatment, and its effects on the interfacial characteristics and electric conductivity. So the electric conductivity of Cu/Al clad plate and its influencing factors, including thickness, width and contour of the clad plate, the applied voltage frequency, the thickness of copper layer were analyzed using ANSYS software. Also the effects of the temperature and time of heat treatment on the interfacial morphologies, diffusion transitional layer, as well as interfacial peeling and thermal fatigue behavior of the Cu/Al clad plate, were investigated.
The results show that with the applied voltage frequency increases from 50 to 1000 Hz, the total electric current density decreases greatly, and the resistance of the Cu/Al clad plate increases obviously. With the increase of copper layer thickness, clad plate thickness and width respectively, the total electric current density increases and the resistance of the Cu/Al clad plate decreases gradually, and the optimal thickness ratio of copper and aluminum is obtained as 0.2 by simulation analysis. Also the contour of clad plate affects its electric conductivity greatly, as for the square edge clad plate, the electric current distributes more regular and concentration level is lighter than that of the round corner one with the same applied current. The electric conductivity of the Cu/Al clad plate is lower slightly than that of pure copper bus-bar, while much more excellent that of pure aluminum one with the same specification, so the clad plate can be used to substitute for the conventional pure copper or aluminum bus-bar.
During the heat treatment, the boundary becomes vague and the diffusion transition zone with a certain thickness is formed at the interfacial zone between copper layer and aluminum one for the diffusion of copper and aluminum atoms occurring across the interface, and the thickness of diffusion layer increases with the increases of the heat treatment temperature and time. As the heat treatment temperature increases, the morphology of peeling interface changes from dimple-like to stream-like, and then to pistil-like, and the interfacial peeling behavior changes from ductile peering to brittle one. The composite interface is still of good bonding state after thermal fatigue testing with and without stress, which indicates that the interfacial layer of the Cu/Al clad plate is of good thermal stability.
结果表明：相同条件的铜铝复合板加载电压频率由50Hz增加到1000Hz时，其总电流密度大幅下降，复合板的阻抗显著增加；随着铜层厚度、复合板厚度和复合板宽度的增加，铜铝复合板上总的电流密度均逐渐增加，复合板的阻抗逐渐减小，通过模拟获得的铜与铝的最佳厚度比为0.2；铜铝复合板的外形对铜铝复合板的导电性有很大影响，四面覆铜的直角边铜铝复合板相对于圆边复合板加载相同电压时，电流密度分布较规则，但电流集中程度要低；相同规格的铜铝复合板的导电性略低于纯铜母线，但明显优于纯铝母线排，可实现相同规格母线排的替代。
在热处理过程中，由于Cu、Al原子逐渐穿越界面发生远程扩散，Cu／Al界面的界线越来越模糊，在界面附近形成一定深度的扩散过渡区域，扩散层厚度也随着热处理温度和时间的增加而增加；随着热处理温度的增加，复合板撕裂界面由类韧窝状逐渐转变为类河流状最后转变为花芯状，界面撕裂也由韧性撕裂逐渐转变为脆性撕裂；轧制铜铝复合板在有应力和无应力状态下进行热疲劳实验后，复合界面保持良好的结合状态，表明复合板界面层具有良好的热稳定性。
Cu/Al clad plate that is produced by clad rolling technique has been the research focus in the field of bus-bar materials for its advantages of not only low bonding resistance of both heat and electricity, but also good ductibility and forming property. However, there are many deficiencies in its research such as the control of process parameter during clad rolling and the subsequent heat treatment, and its effects on the interfacial characteristics and electric conductivity. So the electric conductivity of Cu/Al clad plate and its influencing factors, including thickness, width and contour of the clad plate, the applied voltage frequency, the thickness of copper layer were analyzed using ANSYS software. Also the effects of the temperature and time of heat treatment on the interfacial morphologies, diffusion transitional layer, as well as interfacial peeling and thermal fatigue behavior of the Cu/Al clad plate, were investigated.
The results show that with the applied voltage frequency increases from 50 to 1000 Hz, the total electric current density decreases greatly, and the resistance of the Cu/Al clad plate increases obviously. With the increase of copper layer thickness, clad plate thickness and width respectively, the total electric current density increases and the resistance of the Cu/Al clad plate decreases gradually, and the optimal thickness ratio of copper and aluminum is obtained as 0.2 by simulation analysis. Also the contour of clad plate affects its electric conductivity greatly, as for the square edge clad plate, the electric current distributes more regular and concentration level is lighter than that of the round corner one with the same applied current. The electric conductivity of the Cu/Al clad plate is lower slightly than that of pure copper bus-bar, while much more excellent that of pure aluminum one with the same specification, so the clad plate can be used to substitute for the conventional pure copper or aluminum bus-bar.
During the heat treatment, the boundary becomes vague and the diffusion transition zone with a certain thickness is formed at the interfacial zone between copper layer and aluminum one for the diffusion of copper and aluminum atoms occurring across the interface, and the thickness of diffusion layer increases with the increases of the heat treatment temperature and time. As the heat treatment temperature increases, the morphology of peeling interface changes from dimple-like to stream-like, and then to pistil-like, and the interfacial peeling behavior changes from ductile peering to brittle one. The composite interface is still of good bonding state after thermal fatigue testing with and without stress, which indicates that the interfacial layer of the Cu/Al clad plate is of good thermal stability.
引文
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