平稳弹性浮动研磨的扰动抑制控制系统研究
摘要
金刚石具有突出的物理、化学、机械性能,在先进的科技和工程技术领域中得到了广泛的应用,特别在超精密加工的领域中,通常被用作超精密切削刀具材料。随着科技和应用的发展,对金刚石的表面质量提出了更严格的要求。但金刚石具有的高硬度、易脆、耐磨等特异性能,同时获得高精度及粗糙度值低的金刚石表面极其困难。所以进行金刚石的精密研磨加工技术研究,具有很好的应用前景和实用价值。
在弹性浮动研磨加工过程中,加工条件、设备和相应的控制系统是影响金刚石研磨精度和效率的重要因素,其中改进研磨设备控制系统,提高研磨装置运行的精度和平稳性成为能否加工出高精度金刚石表面的关键问题。本文首先讨论和分析影响研磨装置运行精度和平稳性的主要因素,在此基础上提出基于精密流体动力轴承、采用无位置传感器无刷直流电机技术设计高速运转平稳的小型精密主轴系统；进给系统采用精密的伺服电机进给平台进行径向进给。
从金刚石研磨原理出发,探讨了金刚石表面出现解理、划痕等加工缺陷的产生原因是：金刚石表面在研磨加工过程中受到了不断变化的冲击。从弹性浮动研磨后的金刚石表面可以看出,不断变化的冲击主要来白研磨盘的端跳和弹性梁的振动。研磨过程中不同径向位置研磨盘的端跳会使得金刚石表面和研磨盘之间发生变化的撞击,而无法达到所需的加工精度和表面质量[1]。为了抑制在径向进给过程中端跳造成振动和冲击对金刚石研磨表面质量的影响,本文采用在径向进给过程中实时调整进给速度的策略,对工件表而的冲击进行控制。本文提出通过调节径向进给速度来控制端跳造成的冲击。然后,结合弹性浮动研磨的特点分析比较了常用控制方法的优缺点,选取了合适的控制方法及制定了分阶段调速进给的冲击控制策略,同时设计了冲击控制系统的总方案。在此基础上,根据控制系统的性能要求对系统的各个部分进行分析、设计及选型,按照控制系统构成原理对其进行数学建模,求出了控制系统的开环传递函数,并使用之前选取的控制方法设计出冲击控制器与系统的开环传递函数一起进行了全闭环仿真实验。最后,使用LabVIEW软件开发环境编写出了控制系统,构建控制策略验证系统,对所设计的控制策略及控制系统进行了验证。
Diamond has some excellent performance in physics、chemistry mechanism. Diamond has been playing an important role in technology and industry. Especially, in the field of ultra-precision machining, diamond is considered the best ideal of ultra-precision cutting tool materials. with the technology and application development, People on the diamond surface made more stringent requirements. As the rigid material properties of diamond, Generally, Obtain a shape of the required accuracy and surface roughness of the difficulties of low diamond, Thereby, the precision diamond lapping technology, Have a good prospect and practical value.
In processing of diamond lapping, there arc some factors which influence diamond lapping, like process condition, equipment and corresponding control system. But most important and base problem is improving lapped equipment control system, so how to improve move's precision and stabilization of lapped machine is the key problem. This paper first discusses and analyzes the main factors of influence grinding device running accuracy and stability. The minitype and precise spindle system has been designed and done. It adopts fluid dynamic bearings technology and sensorless BLDC motor techcnology so that spindle system can rotates stably and precisely. Feeding system adopts the precision of servo motors into platform to radial feeding.
We started from the diamond grinding mechanism to explore the nature of the reasons for the phenomenon of emergence of cleavage and micropore on the diamond surface:the phenomenon of cleavage and the micropore is due to the instable impact during the diamond lapping. We can see, from the diamond surface after elastic float lapping, that the variational impact is mainly produced by the end beating of grinding disc and the vibration of elastic beam. These interferes both vibration and impact different radial positions will make relative motion between the lapped diamond tools and grinding disc so that diamond tools cannot achieve the required processing precision and surface quality1". In order to restrain the vibration and impact caused for end jump to the diamond grinding surface quality in radial feeding process, this paper take use of the strategy by the adjustment of speed in the radial feeding process timely to control the impact on the surface of diamond.This paper proposes an idea of controlling radial feeding speed to regulate the impact from the end jump. With the characteristic of elastic floating grinding, pros and cons of commonly-used methods are analyzed and compared. After that it selects out the appropriate methods and works out the grinding control strategy offers in phases, meanwhile the overall program of grinding control system has been designed. On the basis of those, with the function desire of the control system, analyze, design and choose models of every part of the system. A close-loop simulation was made by putting the open-loop transfer function and the controller together. At last, the software of the control system has been programmed in LabVIEW environment, and impact control method verifying system is used to inspect the practicability of the system.
在弹性浮动研磨加工过程中,加工条件、设备和相应的控制系统是影响金刚石研磨精度和效率的重要因素,其中改进研磨设备控制系统,提高研磨装置运行的精度和平稳性成为能否加工出高精度金刚石表面的关键问题。本文首先讨论和分析影响研磨装置运行精度和平稳性的主要因素,在此基础上提出基于精密流体动力轴承、采用无位置传感器无刷直流电机技术设计高速运转平稳的小型精密主轴系统；进给系统采用精密的伺服电机进给平台进行径向进给。
从金刚石研磨原理出发,探讨了金刚石表面出现解理、划痕等加工缺陷的产生原因是：金刚石表面在研磨加工过程中受到了不断变化的冲击。从弹性浮动研磨后的金刚石表面可以看出,不断变化的冲击主要来白研磨盘的端跳和弹性梁的振动。研磨过程中不同径向位置研磨盘的端跳会使得金刚石表面和研磨盘之间发生变化的撞击,而无法达到所需的加工精度和表面质量[1]。为了抑制在径向进给过程中端跳造成振动和冲击对金刚石研磨表面质量的影响,本文采用在径向进给过程中实时调整进给速度的策略,对工件表而的冲击进行控制。本文提出通过调节径向进给速度来控制端跳造成的冲击。然后,结合弹性浮动研磨的特点分析比较了常用控制方法的优缺点,选取了合适的控制方法及制定了分阶段调速进给的冲击控制策略,同时设计了冲击控制系统的总方案。在此基础上,根据控制系统的性能要求对系统的各个部分进行分析、设计及选型,按照控制系统构成原理对其进行数学建模,求出了控制系统的开环传递函数,并使用之前选取的控制方法设计出冲击控制器与系统的开环传递函数一起进行了全闭环仿真实验。最后,使用LabVIEW软件开发环境编写出了控制系统,构建控制策略验证系统,对所设计的控制策略及控制系统进行了验证。
Diamond has some excellent performance in physics、chemistry mechanism. Diamond has been playing an important role in technology and industry. Especially, in the field of ultra-precision machining, diamond is considered the best ideal of ultra-precision cutting tool materials. with the technology and application development, People on the diamond surface made more stringent requirements. As the rigid material properties of diamond, Generally, Obtain a shape of the required accuracy and surface roughness of the difficulties of low diamond, Thereby, the precision diamond lapping technology, Have a good prospect and practical value.
In processing of diamond lapping, there arc some factors which influence diamond lapping, like process condition, equipment and corresponding control system. But most important and base problem is improving lapped equipment control system, so how to improve move's precision and stabilization of lapped machine is the key problem. This paper first discusses and analyzes the main factors of influence grinding device running accuracy and stability. The minitype and precise spindle system has been designed and done. It adopts fluid dynamic bearings technology and sensorless BLDC motor techcnology so that spindle system can rotates stably and precisely. Feeding system adopts the precision of servo motors into platform to radial feeding.
We started from the diamond grinding mechanism to explore the nature of the reasons for the phenomenon of emergence of cleavage and micropore on the diamond surface:the phenomenon of cleavage and the micropore is due to the instable impact during the diamond lapping. We can see, from the diamond surface after elastic float lapping, that the variational impact is mainly produced by the end beating of grinding disc and the vibration of elastic beam. These interferes both vibration and impact different radial positions will make relative motion between the lapped diamond tools and grinding disc so that diamond tools cannot achieve the required processing precision and surface quality1". In order to restrain the vibration and impact caused for end jump to the diamond grinding surface quality in radial feeding process, this paper take use of the strategy by the adjustment of speed in the radial feeding process timely to control the impact on the surface of diamond.This paper proposes an idea of controlling radial feeding speed to regulate the impact from the end jump. With the characteristic of elastic floating grinding, pros and cons of commonly-used methods are analyzed and compared. After that it selects out the appropriate methods and works out the grinding control strategy offers in phases, meanwhile the overall program of grinding control system has been designed. On the basis of those, with the function desire of the control system, analyze, design and choose models of every part of the system. A close-loop simulation was made by putting the open-loop transfer function and the controller together. At last, the software of the control system has been programmed in LabVIEW environment, and impact control method verifying system is used to inspect the practicability of the system.
引文
[1]陈波,刘献礼,张燕彬.超硬道具及其选用[J].机械工程师,2000,
[2]袁哲俊,十先逵.精密和超精密加工技术[M].北京：机械工业出版社,1999.
[3]傅惠南,王小红,姚强等. 金刚石表面精密研磨机理的研究[J].广东工业大学学报,2005,22(1)：15-19.
[4]刘志平,董丽华,韩毅松,宋坚.超精密金刚石刀具研磨技术的研究[J].人工晶体学报,2001(4)：413—418
[5]孙涛,谭久彬,董中.天然金刚石刀具的研磨及其刃口半径检测技术[J].机械技术与机
[6]Nanotechnology Researchers Network Center of Japan. What's nanotechnology support project[EB/OL].http://www.nanonet.go.jp/english/aboutus/prject.htm 1.2006.
[7]Grillo S E,Field J E.Investigation of the Possibility of Eleetrieal Wear by Sparking in Diamond polishing[J].Wear,1997(211):30-40.
[8]TSUWA H, IKAWA N, Mori Y, et a 1.Numerically con-trolled elastic emission machine[J].Annals of CIRP.1979,28(1):193-197.
[9]曹志锡,邓乾发,楼飞燕等.纳米级研磨技术及发展动向[J].新技术新工艺,2006(5) ：10-13.
[10]荣烈润.超精密研磨抛光方法[J].航空精密制造技术,2005(4)：4-8.
[11]ADACHI K, UTCHINGS I M.Wear-mode mapping for the micro-scale abrasion test[J].Wear,2003,255(1-6):23-29.
[12]蒋中伟,张竞敏,黄文浩.金刚石热化学抛光机理研究[J].光学精密工程,2002(2)：50-55.
[13]S.K.Cho,D.Y.Jun,S.Y.Kweon,S.K.Jung.Surface characterization of diamond films Polished by thermomechanical polishing method[J].Thin Solid films.1996(279): 110-114
[14]Masanori Yoshikawa.Development and Performance of diamond films polishing apparatus with hot metals[J].Diamond OPtics.1990(3):210-221.
[15]陈延君,黄云,朱凯旋等.精密砂袋研磨特性研究及应用[J].重庆大学学报：自然科学版,2006(3)：28-31.
[16]李长河,蔡光起,李琦等.砂轮约束磨粒喷射精密光整加工材料去除机理研究[J].中国机械工程,2005(12)：2116-2120.
[17]郑家锦,吴明明,周兆忠.高精度陶瓷球的研磨加工技术研究[J].现代机械,2006(2)：44-46.
[18]潘洪平,梁迎春,董申.陶瓷球的超声振动研磨[J].哈尔滨理工大学学报,1999,4(3)：29-33.
[19]蔡光起,冯宝富,赵恒华.磨削技术的最新进展[C].2002年中国机械工程学会年会论文集,2002：1041-1047.
[20]蔡光起.磨削技术现状与新进展[J].湖南大学学报,1999(4)：1-4.
[21]阎树田,陈惠贤.机械加上中主轴运动影响的数学分析
[22]Materials·Ph·D·dissertation[D]'Department of Mechanical Engineering, University of Bochester.NY,2000.
[23]雷大江,周天剑,岳晓斌.金刚石刀具刃磨装夹系统的振动特性分析[J].工具技术,2008,
[24]宗文俊,李旦,孙涛等.机械振动对高精度金刚石刀具研磨质量的影响,航空学报,2005.26(3)：367-370.
[25]Yuan Z J, Waug X K. Precision and ultrapreeision maehing techniques[M]. Beijing: Machine Industry Press,1999.
[26]袁巨龙,王志伟,文东辉,等.超精密加工现状综述[J].机械工程学报,2007,(1)： 35-48.
[27]王慧军,张飞虎,赵航,等.超声波磁流变复合抛光中几种工艺参数对材料去除率的影响[J].光学精密工程,2007,(10)：1583-1588.
[28]江伟,基于双并联主手的力觉临场感实验研究,[D].哈尔滨工业大学.学位论文.2004年
[29]田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究[D].大连：大连理工大学.2007.3
[30]师黎等.智能控制理论及应用[M].北京：清华大学出版社.2009.4
[31]田业冰,金洙吉,康仁科,郭东明.硅片白旋转磨削的运动几何学分析[J].中国机械工程.2005,16(20)：1798-1801
[321田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究[D].大连：大连理工大学.2007.3
[33]S Matsui:An experimental study on the grinding of silicon wafer-the wafer rotation grinding method(1st report) 1988(04):3-5.
[34]李忠信.硅片自旋磨削试验台关键技术的研究[D].大连：大连理工大学.2005.3
[35]P.O.Hahn:The 300 mm silicon wafer-A cost and technology challenge[J]. Microelectronic Engineering.2001.56(1-2):3-13
[36]翟文杰,王闯.变向恒速平动研磨机的研制[J].制造技术与机床,2005,(5)：53-55
[37]王伟,张晶涛,柴天佑.PID参数先进整定方法综述[J].自动化学报,2000,26(3)：347-355
[38]李士勇.模糊控制.神经控制和智能控制.哈尔滨工业大学出版社.1998.9
[39]汤姆.波特冈特.海因.采用流体动力轴承电机的驱动器：性能更高、噪音更低[J].今日电子.2001(3)：19-20
[40]Lin Guo,and Yih-Jen Dennis Chen.Disk F1utter and Its Impact on HDD Servo Performance[J].IEEE. Transactions on magnetics.2001(2):866-870
[41]卢京潮.自动控制理论.西北工业大学出版社.2004.9
[42]AC免增益调整伺服电动机组合产品手册.日本东方马达有限公司.2012
[43]http://www.yaskawa.com.cn/product/Seriesother.aspx?parentid=72620543991349248 &classid=72621643502977024[2011-08-26]
[44]THK滚珠丝杠产品目录THK CO., LTD
[45]龚仲华.交流伺服驱动从原理到完全应用[M].北京：人民邮电出版社,2010.1
[46]李琳.数控机床交流倒服摔制系统的设计与仿真[D].三峡大学.硕上论文.2006.10
[47]钱平.伺服系统[M].北京：机械工业出版社,2005
[48]刘胜,彭侠夫,叶瑰.现代伺服系统设计[M].哈尔滨：哈尔滨工程大学出版社,2001
[49]资嘉磊.高效深磨振动特性及对工程陶瓷加工表面质量影响的研究[D].长沙：湖南大学,2006.
[50]胡寿松.自动控制原理[M].北京：科学出版社.2001
[51]∑-∏系列SGMH/SGDM用户手册(设计维护篇).安川电机株式会社.1997
[52]滚珠丝杠THK综合产品目录P.A707 THK CO.,LTD.
[53]邱志成.谐波驱动柔性关节机械臂接触力的动态特性[J].测试技术学报.2006.20(5)：377-382
[54]秦宇辉,辛洪兵,李增,肖业平.谐波齿轮减速器传动性能的实验研究[J].北京工商大学学报(自然科学版).2004.22(3).17-22
[55]贺朝霞.基于动态实验数据的机械系统动力学建模与仿真[D].西北工业大学.硕士学位论文.2004
[56]胡峰.数控机床进给系统动态特性辨识与状态监测方法研究[D].华中科技大学.博士学位论文.2009
[57]廖效果.数控技术[M].武汉：湖北科学技术出版社,2002
[58]王小明.电动机的单片机控制[M].北京：北京航空航天大学.2008
[2]袁哲俊,十先逵.精密和超精密加工技术[M].北京：机械工业出版社,1999.
[3]傅惠南,王小红,姚强等. 金刚石表面精密研磨机理的研究[J].广东工业大学学报,2005,22(1)：15-19.
[4]刘志平,董丽华,韩毅松,宋坚.超精密金刚石刀具研磨技术的研究[J].人工晶体学报,2001(4)：413—418
[5]孙涛,谭久彬,董中.天然金刚石刀具的研磨及其刃口半径检测技术[J].机械技术与机
[6]Nanotechnology Researchers Network Center of Japan. What's nanotechnology support project[EB/OL].http://www.nanonet.go.jp/english/aboutus/prject.htm 1.2006.
[7]Grillo S E,Field J E.Investigation of the Possibility of Eleetrieal Wear by Sparking in Diamond polishing[J].Wear,1997(211):30-40.
[8]TSUWA H, IKAWA N, Mori Y, et a 1.Numerically con-trolled elastic emission machine[J].Annals of CIRP.1979,28(1):193-197.
[9]曹志锡,邓乾发,楼飞燕等.纳米级研磨技术及发展动向[J].新技术新工艺,2006(5) ：10-13.
[10]荣烈润.超精密研磨抛光方法[J].航空精密制造技术,2005(4)：4-8.
[11]ADACHI K, UTCHINGS I M.Wear-mode mapping for the micro-scale abrasion test[J].Wear,2003,255(1-6):23-29.
[12]蒋中伟,张竞敏,黄文浩.金刚石热化学抛光机理研究[J].光学精密工程,2002(2)：50-55.
[13]S.K.Cho,D.Y.Jun,S.Y.Kweon,S.K.Jung.Surface characterization of diamond films Polished by thermomechanical polishing method[J].Thin Solid films.1996(279): 110-114
[14]Masanori Yoshikawa.Development and Performance of diamond films polishing apparatus with hot metals[J].Diamond OPtics.1990(3):210-221.
[15]陈延君,黄云,朱凯旋等.精密砂袋研磨特性研究及应用[J].重庆大学学报：自然科学版,2006(3)：28-31.
[16]李长河,蔡光起,李琦等.砂轮约束磨粒喷射精密光整加工材料去除机理研究[J].中国机械工程,2005(12)：2116-2120.
[17]郑家锦,吴明明,周兆忠.高精度陶瓷球的研磨加工技术研究[J].现代机械,2006(2)：44-46.
[18]潘洪平,梁迎春,董申.陶瓷球的超声振动研磨[J].哈尔滨理工大学学报,1999,4(3)：29-33.
[19]蔡光起,冯宝富,赵恒华.磨削技术的最新进展[C].2002年中国机械工程学会年会论文集,2002：1041-1047.
[20]蔡光起.磨削技术现状与新进展[J].湖南大学学报,1999(4)：1-4.
[21]阎树田,陈惠贤.机械加上中主轴运动影响的数学分析
[22]Materials·Ph·D·dissertation[D]'Department of Mechanical Engineering, University of Bochester.NY,2000.
[23]雷大江,周天剑,岳晓斌.金刚石刀具刃磨装夹系统的振动特性分析[J].工具技术,2008,
[24]宗文俊,李旦,孙涛等.机械振动对高精度金刚石刀具研磨质量的影响,航空学报,2005.26(3)：367-370.
[25]Yuan Z J, Waug X K. Precision and ultrapreeision maehing techniques[M]. Beijing: Machine Industry Press,1999.
[26]袁巨龙,王志伟,文东辉,等.超精密加工现状综述[J].机械工程学报,2007,(1)： 35-48.
[27]王慧军,张飞虎,赵航,等.超声波磁流变复合抛光中几种工艺参数对材料去除率的影响[J].光学精密工程,2007,(10)：1583-1588.
[28]江伟,基于双并联主手的力觉临场感实验研究,[D].哈尔滨工业大学.学位论文.2004年
[29]田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究[D].大连：大连理工大学.2007.3
[30]师黎等.智能控制理论及应用[M].北京：清华大学出版社.2009.4
[31]田业冰,金洙吉,康仁科,郭东明.硅片白旋转磨削的运动几何学分析[J].中国机械工程.2005,16(20)：1798-1801
[321田业冰.大尺寸硅片磨削平整化理论与工艺技术的研究[D].大连：大连理工大学.2007.3
[33]S Matsui:An experimental study on the grinding of silicon wafer-the wafer rotation grinding method(1st report) 1988(04):3-5.
[34]李忠信.硅片自旋磨削试验台关键技术的研究[D].大连：大连理工大学.2005.3
[35]P.O.Hahn:The 300 mm silicon wafer-A cost and technology challenge[J]. Microelectronic Engineering.2001.56(1-2):3-13
[36]翟文杰,王闯.变向恒速平动研磨机的研制[J].制造技术与机床,2005,(5)：53-55
[37]王伟,张晶涛,柴天佑.PID参数先进整定方法综述[J].自动化学报,2000,26(3)：347-355
[38]李士勇.模糊控制.神经控制和智能控制.哈尔滨工业大学出版社.1998.9
[39]汤姆.波特冈特.海因.采用流体动力轴承电机的驱动器：性能更高、噪音更低[J].今日电子.2001(3)：19-20
[40]Lin Guo,and Yih-Jen Dennis Chen.Disk F1utter and Its Impact on HDD Servo Performance[J].IEEE. Transactions on magnetics.2001(2):866-870
[41]卢京潮.自动控制理论.西北工业大学出版社.2004.9
[42]AC免增益调整伺服电动机组合产品手册.日本东方马达有限公司.2012
[43]http://www.yaskawa.com.cn/product/Seriesother.aspx?parentid=72620543991349248 &classid=72621643502977024[2011-08-26]
[44]THK滚珠丝杠产品目录THK CO., LTD
[45]龚仲华.交流伺服驱动从原理到完全应用[M].北京：人民邮电出版社,2010.1
[46]李琳.数控机床交流倒服摔制系统的设计与仿真[D].三峡大学.硕上论文.2006.10
[47]钱平.伺服系统[M].北京：机械工业出版社,2005
[48]刘胜,彭侠夫,叶瑰.现代伺服系统设计[M].哈尔滨：哈尔滨工程大学出版社,2001
[49]资嘉磊.高效深磨振动特性及对工程陶瓷加工表面质量影响的研究[D].长沙：湖南大学,2006.
[50]胡寿松.自动控制原理[M].北京：科学出版社.2001
[51]∑-∏系列SGMH/SGDM用户手册(设计维护篇).安川电机株式会社.1997
[52]滚珠丝杠THK综合产品目录P.A707 THK CO.,LTD.
[53]邱志成.谐波驱动柔性关节机械臂接触力的动态特性[J].测试技术学报.2006.20(5)：377-382
[54]秦宇辉,辛洪兵,李增,肖业平.谐波齿轮减速器传动性能的实验研究[J].北京工商大学学报(自然科学版).2004.22(3).17-22
[55]贺朝霞.基于动态实验数据的机械系统动力学建模与仿真[D].西北工业大学.硕士学位论文.2004
[56]胡峰.数控机床进给系统动态特性辨识与状态监测方法研究[D].华中科技大学.博士学位论文.2009
[57]廖效果.数控技术[M].武汉：湖北科学技术出版社,2002
[58]王小明.电动机的单片机控制[M].北京：北京航空航天大学.2008