大功率LED的封装及其散热基板的研究
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摘要
散热问题影响到LED的光输出特性和器件的寿命，是大功率LED封装中的关键问题。金属芯的线路板(MCPCB)是LED白光照明系统中连接内外热通路的核心部件，关系到多芯片LED封装的结构和布局；LED外封装的可靠性-整个系统的电气连接，物理支撑，散热特性，封装的工艺流程以及成本，很大程度上取决于MCPCB。
本文剖析了几种比较有影响力的LED封装方案的结构和散热原理。从解决大功率发光二极管散热和材料热膨胀系数匹配的角度，提出了两种MCPCB方案，并用ANSYS软件对LED进行了热场的有限元模拟以评估其散热性能：
1．AlN薄膜覆Al基板，可以使内热通道的设计变得非常简单，可以高效地把芯片的热量引导出来。利用磁控溅射系统在6061铝材上制备了3μm的AlN薄膜，X射线衍射仪(XRD)、椭偏测试仪、耐压测试表明，AlN膜为具有良好取向的多晶薄膜，击穿电压接近单晶。利用自动划痕仪对AlN膜进行剥离实验，临界载荷为6N左右。AlN和铝基体间的结合主要是物理吸附和机械锚合。基于AlN膜／Al热沉的LED的封装结构的散热性能优异，模型的内通道热阻小于3K／W。
这种方案目前尚需解决的问题是生产的效率尚待提升，成本较高，AlN膜与铝基的结合力有限，在后续的封装工艺中膜的附着性较难保证。
2．等离子微弧氧化(MAO)工艺制作的铝芯金属基板，附着性等机械性能无可争议，MAO铝芯复合基板的工艺重复性好，其低成本、低热阻、性能稳定、便于加工和进行多样结构的封装更是其突出优点。基于MAO-MCPCB基板封装的LED内热通路热阻小于10K／W，有望在普通照明应用中大露头角。热导率更高、厚度更薄的MAO膜，其内部散热通道更通畅，热阻更低。
通过系列实验，优化了20μm到40μm MAO膜的工艺参数，可以制作膜厚20μm、偏差±1μm(磨抛前)结晶性优良的MAO膜，其热导率达到2.3 WK~(-1)m~(-1)。基于本论文中特殊的应用场合，对厚度20μm到100μm的MAO膜的微观结构(主要是膜的均匀性、表观形貌、表面缺陷)有更多的关注。
微弧氧化是生成与溶解的共存过程，期间火化放电的强弱、发生的时序以及相互位置关系对膜的均匀性和膜的微观结构形成有决定性的影响。故本论文对表面放电的规律和微熔区的凝固规律作了较深入的研究：
1．对微弧氧化的击穿放电机制，提出了一种基于趋肤效应的假设：氧化膜和铝基体的界面凹凸不平，在微观上有许多尖端和凹区，由于电荷在铝表面有趋肤效应，尖端形成富电荷区而微观凹区形成贫电荷区。因为正负电荷相吸的原理，正电荷(电子空位，或电子浓度相对较低)在铝表面的分布影响了负电荷(杂质阴离子)在膜／液界面的分布。从而在铝界面的微观尖端位置上加载的电场强度远高于其它区域，击穿更容易发生。经过长时间放电，氧化膜和铝基体的界面不再存在对比非常强的“贫电荷区”和“富电荷区”，击穿放电几率就基本上由所在位置的绝缘强度即厚度决定，这样最终陶瓷膜的厚度生长到比较均衡的程度，场强因而比较均衡地分布，从而击穿放电事件减少甚至终止。
2．通过实验和模拟拟合，对微弧氧化过程中Al_2O_3膜表面的对流散热系数作了估计，实验过程中发现Al_2O_3／Al界面在微观上也是一个冷却界面，Al基体在冷却过程中起“热量中转”的作用，熔池在淬冷过程中的大部分热量经过了邻近区域的Al_2O_3膜或者铝基体。通过热模拟得到的纵深各点温度-时间曲线来表征微熔区的淬冷过程。通过对各节点的相对冷却速度比较，阐述了淬冷过程对α-Al_2O_3分布和Al_2O_3膜表面形貌的影响，压力因素在微观结构形成过程中所产生的影响作了粗略的分析。
放电规律针对的主要是均匀成膜和高效率成膜的问题，凝固规律针对的主要是MAO膜微观结构的形成机制。这正是基板制作所重视的两个方面。
Thermal management is a key issue in the high-power LED package, which has great effect on the output power and lifetime of the device. Metal core printed circuit board(MCPCB), as one of decisive components to solve this problem, is attached great importance in the consideration for the structure and configuration of the LED devices. The reliability and stability, including electric-connecting, physical supporting, heat dissipating ability, the packaging process and the system cost, to a great extent dependents on MCPCB.
Functions of several types of MCPCB have been analyzed in detail. From the angle of thermal management and coefficient of temperature expanding (CTE) matching of the packaging materials and the LED chip, two kind of MCPCB were introduced, advantages& disadvantages was investigated respectively, and finite element method (FEM) was adopted to evaluate the temperature distribution of LED package.
1. AlN films with thickness of approximately 3μm were deposited by Magnetron sputtering System on 6061 Al substrates. Preferential orientation polycrystalline AlN films were discriminated by XRD and Spectroscopic Ellipsometry. Potential resistance testing showed that breakdown voltage of the AlN film resembles single crystal. The coating -substrate interfacial was investigated on a scratch tester, and the critical load was 6 Newton. Reason of strong adhesion was presented by SEM. The package model of LED was analyzed by FEM, and the internal thermal resistance, was less than 3 K/W.
AlN/Al composite make easy to design the internal thermal passage, conducting the heat from the chip efficiently. The problems of this composite include low efficiency thus high cost, and adhesive limit of the AlN films was disbennifit to later package processes.
2. A special MCPCB fabricated by PEO (plasma electrolyte oxidation) is introduced, Excellent Mechanical performance, low cost, good electrical isolation, excellent thermal transfer and its convenience for later package processes is the great advantage. MAO-MCPCB substrate, the internal thermal resistance of the LED package based on which was less than 10 K/W, has a great promise in the future general lighting application. The higher is the thermal conductivity of the MAO coating, or the thinner is the MAO coating, the lower is the internal thermal resistance.
The technical Parameter fabricating MAO coatings with thickness from 20μm to 40μm was optimized On the basis of a great deal of experiments, and 20μm±1μm (before grinding or finishing) polycrystalline MAO coatings was acquired, the thermal conductivity reached 2. 3 W K~(-1)m~(-1). Aimed at the application for MCPCB, This paper attached great importance on the efficiency of the MAO-Process and microstructure of MAO coatings, such as uniformity, surface morphology and surface-micro-crack-distribution.
MAO coating growth coexists with the dissolution; at the same time strength, sequence, and ubiety of the discharge has great effect on the uniformity and microstructure of MAO coatings. So the discharge characteristic(I) and quenching process of the micro-melting pool( II) was deeply investigated.
(I)As to the uniformity of MAO Coatings and efficiency of MAO Process, assumption aboat breakdown was brought up. From microcosmic viewpoint, the Al_2O_3/Al interface was accidented. Because of skin effect, protuberant region is electric-charge-rich (electron-pool) region and concave region electric-charge-pool (electron-rich) region at the anode-positive-loaded half cycle. As like electric charge species repel and unlike attract each other, the distribution of positive electrical charge on the Al interface impact on the distribution of negative ion on the Al_2O_3/solution interface. The Electric Field on electric-charge-rich region was stronger than other region, so this position has more probability to breakdown. When the MAO Coating grow to even enough, and Electric Field was relatively equilibrium, the frequency of discharge events gradually die away.
(II )The convection heat transfer coefficient on Al_2O_3 coating during microarc oxidation process was estimated by experiment and simulation. The Al_2O_3/Al interface was found to be a heat-transfer passage. During quenching, most heat of the micro-melting-pool was transferred through the Al substrate and the Al_2O_3 coating nearby. The micro-melting-pool was modeled by finite element method (FEM), and the process of quenching was characterized by the simulated temperature-time curves of the nodes along the depth, respectively. The effects of the quenching on the distribution ofα-Al_2O_3 and surface morphology of Al_2O_3 coating were discussed by comparing the relative cooling rate at different positions. The influence of pressure on the microstructure of MAO coating was also discussed briefly.
本文剖析了几种比较有影响力的LED封装方案的结构和散热原理。从解决大功率发光二极管散热和材料热膨胀系数匹配的角度，提出了两种MCPCB方案，并用ANSYS软件对LED进行了热场的有限元模拟以评估其散热性能：
1．AlN薄膜覆Al基板，可以使内热通道的设计变得非常简单，可以高效地把芯片的热量引导出来。利用磁控溅射系统在6061铝材上制备了3μm的AlN薄膜，X射线衍射仪(XRD)、椭偏测试仪、耐压测试表明，AlN膜为具有良好取向的多晶薄膜，击穿电压接近单晶。利用自动划痕仪对AlN膜进行剥离实验，临界载荷为6N左右。AlN和铝基体间的结合主要是物理吸附和机械锚合。基于AlN膜／Al热沉的LED的封装结构的散热性能优异，模型的内通道热阻小于3K／W。
这种方案目前尚需解决的问题是生产的效率尚待提升，成本较高，AlN膜与铝基的结合力有限，在后续的封装工艺中膜的附着性较难保证。
2．等离子微弧氧化(MAO)工艺制作的铝芯金属基板，附着性等机械性能无可争议，MAO铝芯复合基板的工艺重复性好，其低成本、低热阻、性能稳定、便于加工和进行多样结构的封装更是其突出优点。基于MAO-MCPCB基板封装的LED内热通路热阻小于10K／W，有望在普通照明应用中大露头角。热导率更高、厚度更薄的MAO膜，其内部散热通道更通畅，热阻更低。
通过系列实验，优化了20μm到40μm MAO膜的工艺参数，可以制作膜厚20μm、偏差±1μm(磨抛前)结晶性优良的MAO膜，其热导率达到2.3 WK~(-1)m~(-1)。基于本论文中特殊的应用场合，对厚度20μm到100μm的MAO膜的微观结构(主要是膜的均匀性、表观形貌、表面缺陷)有更多的关注。
微弧氧化是生成与溶解的共存过程，期间火化放电的强弱、发生的时序以及相互位置关系对膜的均匀性和膜的微观结构形成有决定性的影响。故本论文对表面放电的规律和微熔区的凝固规律作了较深入的研究：
1．对微弧氧化的击穿放电机制，提出了一种基于趋肤效应的假设：氧化膜和铝基体的界面凹凸不平，在微观上有许多尖端和凹区，由于电荷在铝表面有趋肤效应，尖端形成富电荷区而微观凹区形成贫电荷区。因为正负电荷相吸的原理，正电荷(电子空位，或电子浓度相对较低)在铝表面的分布影响了负电荷(杂质阴离子)在膜／液界面的分布。从而在铝界面的微观尖端位置上加载的电场强度远高于其它区域，击穿更容易发生。经过长时间放电，氧化膜和铝基体的界面不再存在对比非常强的“贫电荷区”和“富电荷区”，击穿放电几率就基本上由所在位置的绝缘强度即厚度决定，这样最终陶瓷膜的厚度生长到比较均衡的程度，场强因而比较均衡地分布，从而击穿放电事件减少甚至终止。
2．通过实验和模拟拟合，对微弧氧化过程中Al_2O_3膜表面的对流散热系数作了估计，实验过程中发现Al_2O_3／Al界面在微观上也是一个冷却界面，Al基体在冷却过程中起“热量中转”的作用，熔池在淬冷过程中的大部分热量经过了邻近区域的Al_2O_3膜或者铝基体。通过热模拟得到的纵深各点温度-时间曲线来表征微熔区的淬冷过程。通过对各节点的相对冷却速度比较，阐述了淬冷过程对α-Al_2O_3分布和Al_2O_3膜表面形貌的影响，压力因素在微观结构形成过程中所产生的影响作了粗略的分析。
放电规律针对的主要是均匀成膜和高效率成膜的问题，凝固规律针对的主要是MAO膜微观结构的形成机制。这正是基板制作所重视的两个方面。
Thermal management is a key issue in the high-power LED package, which has great effect on the output power and lifetime of the device. Metal core printed circuit board(MCPCB), as one of decisive components to solve this problem, is attached great importance in the consideration for the structure and configuration of the LED devices. The reliability and stability, including electric-connecting, physical supporting, heat dissipating ability, the packaging process and the system cost, to a great extent dependents on MCPCB.
Functions of several types of MCPCB have been analyzed in detail. From the angle of thermal management and coefficient of temperature expanding (CTE) matching of the packaging materials and the LED chip, two kind of MCPCB were introduced, advantages& disadvantages was investigated respectively, and finite element method (FEM) was adopted to evaluate the temperature distribution of LED package.
1. AlN films with thickness of approximately 3μm were deposited by Magnetron sputtering System on 6061 Al substrates. Preferential orientation polycrystalline AlN films were discriminated by XRD and Spectroscopic Ellipsometry. Potential resistance testing showed that breakdown voltage of the AlN film resembles single crystal. The coating -substrate interfacial was investigated on a scratch tester, and the critical load was 6 Newton. Reason of strong adhesion was presented by SEM. The package model of LED was analyzed by FEM, and the internal thermal resistance, was less than 3 K/W.
AlN/Al composite make easy to design the internal thermal passage, conducting the heat from the chip efficiently. The problems of this composite include low efficiency thus high cost, and adhesive limit of the AlN films was disbennifit to later package processes.
2. A special MCPCB fabricated by PEO (plasma electrolyte oxidation) is introduced, Excellent Mechanical performance, low cost, good electrical isolation, excellent thermal transfer and its convenience for later package processes is the great advantage. MAO-MCPCB substrate, the internal thermal resistance of the LED package based on which was less than 10 K/W, has a great promise in the future general lighting application. The higher is the thermal conductivity of the MAO coating, or the thinner is the MAO coating, the lower is the internal thermal resistance.
The technical Parameter fabricating MAO coatings with thickness from 20μm to 40μm was optimized On the basis of a great deal of experiments, and 20μm±1μm (before grinding or finishing) polycrystalline MAO coatings was acquired, the thermal conductivity reached 2. 3 W K~(-1)m~(-1). Aimed at the application for MCPCB, This paper attached great importance on the efficiency of the MAO-Process and microstructure of MAO coatings, such as uniformity, surface morphology and surface-micro-crack-distribution.
MAO coating growth coexists with the dissolution; at the same time strength, sequence, and ubiety of the discharge has great effect on the uniformity and microstructure of MAO coatings. So the discharge characteristic(I) and quenching process of the micro-melting pool( II) was deeply investigated.
(I)As to the uniformity of MAO Coatings and efficiency of MAO Process, assumption aboat breakdown was brought up. From microcosmic viewpoint, the Al_2O_3/Al interface was accidented. Because of skin effect, protuberant region is electric-charge-rich (electron-pool) region and concave region electric-charge-pool (electron-rich) region at the anode-positive-loaded half cycle. As like electric charge species repel and unlike attract each other, the distribution of positive electrical charge on the Al interface impact on the distribution of negative ion on the Al_2O_3/solution interface. The Electric Field on electric-charge-rich region was stronger than other region, so this position has more probability to breakdown. When the MAO Coating grow to even enough, and Electric Field was relatively equilibrium, the frequency of discharge events gradually die away.
(II )The convection heat transfer coefficient on Al_2O_3 coating during microarc oxidation process was estimated by experiment and simulation. The Al_2O_3/Al interface was found to be a heat-transfer passage. During quenching, most heat of the micro-melting-pool was transferred through the Al substrate and the Al_2O_3 coating nearby. The micro-melting-pool was modeled by finite element method (FEM), and the process of quenching was characterized by the simulated temperature-time curves of the nodes along the depth, respectively. The effects of the quenching on the distribution ofα-Al_2O_3 and surface morphology of Al_2O_3 coating were discussed by comparing the relative cooling rate at different positions. The influence of pressure on the microstructure of MAO coating was also discussed briefly.
引文
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