基于冲击射流的电子器件冷却方法研究
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摘要
当今电子器件的正向朝着高集成度、微型化、高功耗的方向发展,其热流密度迅速提高,电子设备过热或热缺陷是电子产品失效的主要原因之一,所以冷却问题成为制约其发展的一个瓶颈。冲击射流作为一种独特的流动方式,具有比常规流动强得多的换热能力,是解决高密度电子器件散热问题的颇具潜力的方案。针对以往对气体冲击射流的研究主要是大孔径和高雷诺数的状况,本文主要研究微小孔径和中低雷诺数空气冲击射流的换热特性及在电子器件冷却的应用,主要工作有:
(1)系统开展了空气冲击射流换热的实验研究。构建了包含射流发生部分、模拟芯片及温度采集部分的实验测试系统,分析了实验测量误差,发现热沉热阻(θ_(ab))及努塞尔数(Nu)的相对误差分别不超过3.43%和8.77%。通过实验研究了孔径为1mm、2mm和3mm三种的微小孔径圆形单孔平板受限冲击射流、圆形和方形两种排布的1mm孔径圆形多孔受限射流及斜射流的换热特性;分析了相关参数对换热的影响;得到了平板冲击受限射流驻点区的换热准则方程,相同流量下的多孔冲击射流平均换热系数均小于单孔冲击射流、倾斜角主要影响上坡部分的换热等结论。选取三组矩形柱鳍热沉进行了射流冲击实验,分析了影响热阻的相关参数,得到其平均换热的准则方程。实验结果表明空气冲击射流与热沉结合的散热方式较传统空冷有非常显著的优势。
(2)采用数值模拟的方法,对微小孔径空气受限冲击射流的传热特性进行了深入研究。通过数值计算和实验结果的对比,发现RNGκ-ε模型对冲击射流模拟具有最好的适用性。采用该模型,对喷嘴直径为1-5mm,雷诺数(Re)为1000～15000的微小孔径圆形气体受限冲击射流及旋转射流进行了系统的数值模拟,得到了驻点区和全局换热面上的平均努塞尔特数换热关联式。数值模拟结果表明,微小孔径冲击射流换热表现有一定的尺度效应,有旋转时的板上平均换热系数略小于无旋转时的板上平均换热系数,但换热更为均匀。RNGκ-ε模型同样适合于热沉冲击射流换热的数值模拟,通过数值计算得到了热阻最小时热沉的肋高、列数及其几何形状参数。
(3)研究了热沉最优化结构设计理论。将序列二次规划法(SQP)算法引入到热沉最优化设计中,并与数值计算方法结合起来,建立空气射流冲击热沉最优化分析和设计的系统方法。该方法可求解含约束的单个或多个目标函数的优化问题,解决了热沉最优化过程中缺乏最优化理论指导的不足。将热阻和压降组合构成多目标函数,当权重系数各为0.5时,得到了一个8×8结构的方柱柱鳍热沉优化后的鳍片宽度为4.16mm、高度19.0mm和基板厚度3.73mm。
(4)进行了空气射流在电子器件冷却的应用研究及分析和评价。以FC-BGA芯片为冷却对象,建立其简化传热模型,采用热型线法对冲击射流散热方式进行了分析。计算结果表明,当Re分别为4000、8000和12000时,单孔射流直接冲击换热面的散热方式存在一定的局限性,而采用冲击射流与热沉相结合,较没有加装热沉前芯片功率增加了118.8%、116.7%和123.5%,微小孔径空气射流冲击热沉的方法可直接用于中低功率的高密度封装器件的冷却。
本文的结论为冲击射流应用于电子器件冷却提供了系统的理论和实验依据,具有比较重大的理论意义和实际价值。
本文工作得到了国家自然科学基金项目(No:50376076)的资助。
The cooling of generally complex electronic systems has become a tough challenge and a development bottleneck indeed, resulting from the combined effects of increasing high-power, heat fluxes, miniaturisation and the striving for zero defects. Electronic equipment overheating or thermal defect has become a major reason for electronic products' failure. The jet impingement heat transfer has become well established as a high performance technique for cooling comparing with normal heat transport methods. It has become a viable candidate for high-powered electronic cooling solutions. Numerous studies have been conducted to investigate the air impinging jet under condition of large aperture and high Reynolds number. However, Air jet coming from tiny diameter circular jet and impinging on the heat transfer surface with middle and low Reynolds number and its application to cooling electronics were studied in this paper. The main works are as follows:
(1) Heat transfer of air impinging jet has been studied by experiment systematically. The experimental system was constructed which contains of jet generator, simulative test chip and temperature acquisition part. The experimental measurement error was analyzed and discovered that heat sink thermal resistance (θ_(ab)) and Nusselt number(Nu), respectively, the relative error not exceeding 3.43% and 8.77%. Heat transfer characteristics of confined single impinging jet with three small circular diameter which is lmm,2mm and 3mm, and multiple jets with arrangements of circular and square which every jet is circular and diameter is 1mm were experimental studied. Many physical and geometric parameters were changed to investigate their influence on heat transfer. Heat transfer criteria equation of confined impinging jet in stagnation region and average transfer coefficient of multi-jets is less than the single impinging jet with the same flow flux, heat transfer of the plate uphill part varied major with jet angle were concluded. Experiments were performed to investigate the turbulent fluid flow and heat transfer from three pin-fin heat sink geometries with air impingement cooling. Results for the average heat transfer coefficient were correlated in terms of Reynolds number and geometric parameters of the heat sinks. Parameters influencing to thermal resistance of heat sink were analyzed. The experimental results show that the method of air impinging jet combining with heat sink has a very significant advantage in comparison with the traditional air-cooling.
(2) A detail numerical simulation study of heat transfer due to confined impinging small circular jet was presented. Numerical computations were performed by using several different turbulence models. The numerical results based on the RNG k-εturbulence model showed reasonable agreement with the experimental data for local heat transfer coefficient distributions. The confined air impinging jets with nozzle diameter from 1mm to 5mm, Reynolds number from 1000 to 15000 and swirling impinging jet with tiny nozzle were systematically and numerically simulated with RNG k-εmodel. Nusselt number correlations in both stagnation region and the whole heat transfer area were obtained. Numerical simulation results show that heat transfer characteristics of the tiny nozzle impinging jet represents scale effects, average heat transfer coefficient of swirling jet impingement is less than that without swirl velocity and heat transfer on the surface become uniform. RNG k-εmodel is also suitable for numerical simulation of heat sinks impingement. Minimizing thermal resistance of pin-fin heat sinks for impingement was studied. These calculations took into consideration design parameters including fin height, the number of rows and geometrical shape.
(3) A theoretical methodology of optimization the geometry of the pin-fin heat sink was performed numerically. The methodology was integrated by the CFD and mathematical optimization method carried out by means of the sequential quadratic programming(SQP) which is widely used in the constrained nonlinear optimization problem. The flow and thermal fields are predicted using CFD. This method can solve the constraints with the single or multiple objective function optimization problems. The design optimization of the 8×8 pin-fins heat sink is performed. The fin height, fin width, and basement thickness are chosen as the design variables and the pressure drop and thermal resistance are adopted as the objective functions and minimized simultaneously. The results show that the optimum design variables for the weighting coefficient of 0.5 are as follows: fin width is 4.16mm, fin height is 19.0mm and basement thickness is 3.73mm.
(4) The air impinging jet for electronic cooling application is studied. A simplified heat transfer model of Flip-Chip BGA packaging was built up. The impinging jet cooling effect was analyzed by Thermal Profile method. When Re is 4000,8000 and 12000 respectively, The simulation results show that cooling effect of the single jet impinging on the surface of the chip is limited. The air jet impinging on heat sink is better and the chip power increases 118.8%, 116.7 % and 123.5 % respectively. Air jet impinging to heat sink can be directly applied to cooling of high-heat-flux electronic packaging with middle and low power
The objective of the present study is to provide a physical insight into heat transfer effects and to facilitate the validation of electronics cooling. The research conclusions in this paper provide a systematic theoretical and experimental basis for impinging jet cooling used in electronics and have significant theoretical and practical value.
This work was supported by the National Natural Science Foundation of China (No. 50376076).
(1)系统开展了空气冲击射流换热的实验研究。构建了包含射流发生部分、模拟芯片及温度采集部分的实验测试系统,分析了实验测量误差,发现热沉热阻(θ_(ab))及努塞尔数(Nu)的相对误差分别不超过3.43%和8.77%。通过实验研究了孔径为1mm、2mm和3mm三种的微小孔径圆形单孔平板受限冲击射流、圆形和方形两种排布的1mm孔径圆形多孔受限射流及斜射流的换热特性;分析了相关参数对换热的影响;得到了平板冲击受限射流驻点区的换热准则方程,相同流量下的多孔冲击射流平均换热系数均小于单孔冲击射流、倾斜角主要影响上坡部分的换热等结论。选取三组矩形柱鳍热沉进行了射流冲击实验,分析了影响热阻的相关参数,得到其平均换热的准则方程。实验结果表明空气冲击射流与热沉结合的散热方式较传统空冷有非常显著的优势。
(2)采用数值模拟的方法,对微小孔径空气受限冲击射流的传热特性进行了深入研究。通过数值计算和实验结果的对比,发现RNGκ-ε模型对冲击射流模拟具有最好的适用性。采用该模型,对喷嘴直径为1-5mm,雷诺数(Re)为1000～15000的微小孔径圆形气体受限冲击射流及旋转射流进行了系统的数值模拟,得到了驻点区和全局换热面上的平均努塞尔特数换热关联式。数值模拟结果表明,微小孔径冲击射流换热表现有一定的尺度效应,有旋转时的板上平均换热系数略小于无旋转时的板上平均换热系数,但换热更为均匀。RNGκ-ε模型同样适合于热沉冲击射流换热的数值模拟,通过数值计算得到了热阻最小时热沉的肋高、列数及其几何形状参数。
(3)研究了热沉最优化结构设计理论。将序列二次规划法(SQP)算法引入到热沉最优化设计中,并与数值计算方法结合起来,建立空气射流冲击热沉最优化分析和设计的系统方法。该方法可求解含约束的单个或多个目标函数的优化问题,解决了热沉最优化过程中缺乏最优化理论指导的不足。将热阻和压降组合构成多目标函数,当权重系数各为0.5时,得到了一个8×8结构的方柱柱鳍热沉优化后的鳍片宽度为4.16mm、高度19.0mm和基板厚度3.73mm。
(4)进行了空气射流在电子器件冷却的应用研究及分析和评价。以FC-BGA芯片为冷却对象,建立其简化传热模型,采用热型线法对冲击射流散热方式进行了分析。计算结果表明,当Re分别为4000、8000和12000时,单孔射流直接冲击换热面的散热方式存在一定的局限性,而采用冲击射流与热沉相结合,较没有加装热沉前芯片功率增加了118.8%、116.7%和123.5%,微小孔径空气射流冲击热沉的方法可直接用于中低功率的高密度封装器件的冷却。
本文的结论为冲击射流应用于电子器件冷却提供了系统的理论和实验依据,具有比较重大的理论意义和实际价值。
本文工作得到了国家自然科学基金项目(No:50376076)的资助。
The cooling of generally complex electronic systems has become a tough challenge and a development bottleneck indeed, resulting from the combined effects of increasing high-power, heat fluxes, miniaturisation and the striving for zero defects. Electronic equipment overheating or thermal defect has become a major reason for electronic products' failure. The jet impingement heat transfer has become well established as a high performance technique for cooling comparing with normal heat transport methods. It has become a viable candidate for high-powered electronic cooling solutions. Numerous studies have been conducted to investigate the air impinging jet under condition of large aperture and high Reynolds number. However, Air jet coming from tiny diameter circular jet and impinging on the heat transfer surface with middle and low Reynolds number and its application to cooling electronics were studied in this paper. The main works are as follows:
(1) Heat transfer of air impinging jet has been studied by experiment systematically. The experimental system was constructed which contains of jet generator, simulative test chip and temperature acquisition part. The experimental measurement error was analyzed and discovered that heat sink thermal resistance (θ_(ab)) and Nusselt number(Nu), respectively, the relative error not exceeding 3.43% and 8.77%. Heat transfer characteristics of confined single impinging jet with three small circular diameter which is lmm,2mm and 3mm, and multiple jets with arrangements of circular and square which every jet is circular and diameter is 1mm were experimental studied. Many physical and geometric parameters were changed to investigate their influence on heat transfer. Heat transfer criteria equation of confined impinging jet in stagnation region and average transfer coefficient of multi-jets is less than the single impinging jet with the same flow flux, heat transfer of the plate uphill part varied major with jet angle were concluded. Experiments were performed to investigate the turbulent fluid flow and heat transfer from three pin-fin heat sink geometries with air impingement cooling. Results for the average heat transfer coefficient were correlated in terms of Reynolds number and geometric parameters of the heat sinks. Parameters influencing to thermal resistance of heat sink were analyzed. The experimental results show that the method of air impinging jet combining with heat sink has a very significant advantage in comparison with the traditional air-cooling.
(2) A detail numerical simulation study of heat transfer due to confined impinging small circular jet was presented. Numerical computations were performed by using several different turbulence models. The numerical results based on the RNG k-εturbulence model showed reasonable agreement with the experimental data for local heat transfer coefficient distributions. The confined air impinging jets with nozzle diameter from 1mm to 5mm, Reynolds number from 1000 to 15000 and swirling impinging jet with tiny nozzle were systematically and numerically simulated with RNG k-εmodel. Nusselt number correlations in both stagnation region and the whole heat transfer area were obtained. Numerical simulation results show that heat transfer characteristics of the tiny nozzle impinging jet represents scale effects, average heat transfer coefficient of swirling jet impingement is less than that without swirl velocity and heat transfer on the surface become uniform. RNG k-εmodel is also suitable for numerical simulation of heat sinks impingement. Minimizing thermal resistance of pin-fin heat sinks for impingement was studied. These calculations took into consideration design parameters including fin height, the number of rows and geometrical shape.
(3) A theoretical methodology of optimization the geometry of the pin-fin heat sink was performed numerically. The methodology was integrated by the CFD and mathematical optimization method carried out by means of the sequential quadratic programming(SQP) which is widely used in the constrained nonlinear optimization problem. The flow and thermal fields are predicted using CFD. This method can solve the constraints with the single or multiple objective function optimization problems. The design optimization of the 8×8 pin-fins heat sink is performed. The fin height, fin width, and basement thickness are chosen as the design variables and the pressure drop and thermal resistance are adopted as the objective functions and minimized simultaneously. The results show that the optimum design variables for the weighting coefficient of 0.5 are as follows: fin width is 4.16mm, fin height is 19.0mm and basement thickness is 3.73mm.
(4) The air impinging jet for electronic cooling application is studied. A simplified heat transfer model of Flip-Chip BGA packaging was built up. The impinging jet cooling effect was analyzed by Thermal Profile method. When Re is 4000,8000 and 12000 respectively, The simulation results show that cooling effect of the single jet impinging on the surface of the chip is limited. The air jet impinging on heat sink is better and the chip power increases 118.8%, 116.7 % and 123.5 % respectively. Air jet impinging to heat sink can be directly applied to cooling of high-heat-flux electronic packaging with middle and low power
The objective of the present study is to provide a physical insight into heat transfer effects and to facilitate the validation of electronics cooling. The research conclusions in this paper provide a systematic theoretical and experimental basis for impinging jet cooling used in electronics and have significant theoretical and practical value.
This work was supported by the National Natural Science Foundation of China (No. 50376076).
引文
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