湿热载荷下无铅焊点电阻应变研究
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摘要
随着无铅焊料应用的普及,无铅焊点的可靠性问题备受关注。因此各种无铅焊点可靠性实验也相应提出来。电子元器件在实际使用环境中同时受到湿热的影响。湿热在焊点失效原因中占了很大比例,因此有必要在湿热同时加载的情况下,研究焊点的可靠性。
本文首先简述了无铅焊点可靠性的研究现状,分析了研究无铅焊点可靠性的重要性,概述了湿热载荷下无铅焊点可靠性研究的现状及研究意义,分析了无铅焊点可靠性电测方法的可行性以及电测方法的研究现状。研究探讨了无铅焊点(SnAgCu)在单独湿、热载荷下以及共同作用下无铅焊点的失效机制。根据湿热载荷下裸露无铅焊点的失效机制,建立起一个简单焊点断裂模型,再推导了无铅焊点损伤与电阻应变的关系,为湿热载荷下无铅焊点电阻应变特性研究提供理论基础。在微电阻测试系统的基础上,设计了湿热载荷下焊点测试系统；提出用五探针差分法代替四探针微电阻测试法,并通过实验证明了五探针差分法的优点。制作长宽各1mm、厚度不等的SnAgCu焊点试样,采用五探针差分法分别进行了高低温循环、高温循环、高温保温低湿度实验(相对湿度近似为零),以及低温湿度循环、中温湿度实验。采用Origin软件对焊点试样测试结果进行数学处理,结果表明：1、焊点电阻应变随着循环温度范围的增大,变化范围也增大；2、在升温与降温过程中,电阻应变曲线出现迟滞回线现象,并且升降温的范围越大,迟滞回线面积越大;3、随着温度循环次数的增加,焊点电阻及电阻应变峰值都有上升的趋势,与蠕变理论相符合；4、在短时间内,焊点电阻应变不随湿度的变化而变化,原因是焊点还没有因腐蚀而产生蚀坑或者裂纹,湿度对焊点的影响还不是很明显。根据湿热载荷下焊点损伤与电阻应变的关系式,进一步推导了电阻应变与腐蚀速率和内部裂纹生长速率以及服役时间的关系,并绘制了湿热载荷下保温时的电阻应变随时间变化的曲线；比较在湿热载荷与湿度载荷、纯温度载荷三种情况下的保温电阻应变随时间变化的曲线,发现湿热载荷下的电阻应变提前进入损伤加速阶段,缩短了焊点寿命,与湿热载荷下焊点失效机制是相符合的。
The reliability of lead-free solder joints continues to remain a major concern as the popularity of lead-free solder. So, all kinds of reliability experiments of lead-free solder joints are raised accordingly. Electronic components are influenced by temperature and humidity at the same time in the actual environment. Temperature and humidity constitute a high proportion in the failure cause of solder joints, so reliability about solder joints consideration which is in the environment of temperature and humidity is necessary.
Firstly, this paper summarizes situation of lead-free solder joints reliability study, analyzes the importance of lead-free solder joints reliability study, overviews meanings and situation of study about lead-free solder joints reliability under the load of temperature and humidity, analyzes feasibility of a electrical measurement method about lead-free joints reliability and situation of study on electrical measurement. Failure mechanism of lead-free solder joints (SnAgCu) has been researched in the circumstance of temperature and humidity load alone, and combined action. According to failure mechanism of the exposed lead-free solder joints under the combined action of temperature and humidity, simple model of invalidation solder joints was built and relation expression between damage of solder joints and resistance strain was deduced. It provides fundamental basis for characteristic research of SnAgCu solder joints resistance strain under the load of temperature and humidity. On the foundation of former test system of micro-resistance, test system of solder joints was designed to measure resistance in the environment of temperature and humidity. Four-probe method in micro-resistance measurement has been replaced by five-probe difference method which is precise through experimental proof in the paper. In this article, with SnAgCu solder joints specimens (the width and length is lmm, different thickness), five kinds of experiments have been performed by five-probe difference method, including high-low thermal shock cycle test with low humidity, high temperature cycle with low humidity, high temperature constant, humidity cycle under low temperature and humidity cycle under medium temperature constant. A lot of solder specimens'testing results have been processed by origin software. The results show that: 1. changes in solder joints'resistance strain become greater with enlargement of cycle temperature range; 2. in the process of elevation and decrease of temperature, a phenomenon of hysteresis loop appears in the curve of resistance strain and area of hysteresis loop become greater with enlargement of cycle temperature range; 3. summit of solder joints'resistance and resistance strain has a rising trend as the number of cycle index is incremental, which accords with creep theory; 4. in the short term, solder joints'resistance and resistance strain don't change in relation to humidity change, the reason is that etch pits and flaws in the solder joints aren't formed by corrosion and influence of humidity isn't very obvious. A deep relationship among resistance strain, corrosion rate, growth rate of internal crack and time was deduced according to relation expression between solder joints'damage and resistor strain, then curve of constant temperature resistance strain over time was drew in the condition of temperature and humidity. Compared constant temperature resistance strain curve over time under the load of thermal and humidity to constant temperature resistance strain curve over time under the load of temperature alone and resistance strain curve over time under the load of humidity alone, the first circumstance gets into accelerated stage of damage in advance, which reduce solder joint life and according to failure mechanism of lead-free solder joints. At last, further research and assumption are put forward according to drawback in this paper.
本文首先简述了无铅焊点可靠性的研究现状,分析了研究无铅焊点可靠性的重要性,概述了湿热载荷下无铅焊点可靠性研究的现状及研究意义,分析了无铅焊点可靠性电测方法的可行性以及电测方法的研究现状。研究探讨了无铅焊点(SnAgCu)在单独湿、热载荷下以及共同作用下无铅焊点的失效机制。根据湿热载荷下裸露无铅焊点的失效机制,建立起一个简单焊点断裂模型,再推导了无铅焊点损伤与电阻应变的关系,为湿热载荷下无铅焊点电阻应变特性研究提供理论基础。在微电阻测试系统的基础上,设计了湿热载荷下焊点测试系统；提出用五探针差分法代替四探针微电阻测试法,并通过实验证明了五探针差分法的优点。制作长宽各1mm、厚度不等的SnAgCu焊点试样,采用五探针差分法分别进行了高低温循环、高温循环、高温保温低湿度实验(相对湿度近似为零),以及低温湿度循环、中温湿度实验。采用Origin软件对焊点试样测试结果进行数学处理,结果表明：1、焊点电阻应变随着循环温度范围的增大,变化范围也增大；2、在升温与降温过程中,电阻应变曲线出现迟滞回线现象,并且升降温的范围越大,迟滞回线面积越大;3、随着温度循环次数的增加,焊点电阻及电阻应变峰值都有上升的趋势,与蠕变理论相符合；4、在短时间内,焊点电阻应变不随湿度的变化而变化,原因是焊点还没有因腐蚀而产生蚀坑或者裂纹,湿度对焊点的影响还不是很明显。根据湿热载荷下焊点损伤与电阻应变的关系式,进一步推导了电阻应变与腐蚀速率和内部裂纹生长速率以及服役时间的关系,并绘制了湿热载荷下保温时的电阻应变随时间变化的曲线；比较在湿热载荷与湿度载荷、纯温度载荷三种情况下的保温电阻应变随时间变化的曲线,发现湿热载荷下的电阻应变提前进入损伤加速阶段,缩短了焊点寿命,与湿热载荷下焊点失效机制是相符合的。
The reliability of lead-free solder joints continues to remain a major concern as the popularity of lead-free solder. So, all kinds of reliability experiments of lead-free solder joints are raised accordingly. Electronic components are influenced by temperature and humidity at the same time in the actual environment. Temperature and humidity constitute a high proportion in the failure cause of solder joints, so reliability about solder joints consideration which is in the environment of temperature and humidity is necessary.
Firstly, this paper summarizes situation of lead-free solder joints reliability study, analyzes the importance of lead-free solder joints reliability study, overviews meanings and situation of study about lead-free solder joints reliability under the load of temperature and humidity, analyzes feasibility of a electrical measurement method about lead-free joints reliability and situation of study on electrical measurement. Failure mechanism of lead-free solder joints (SnAgCu) has been researched in the circumstance of temperature and humidity load alone, and combined action. According to failure mechanism of the exposed lead-free solder joints under the combined action of temperature and humidity, simple model of invalidation solder joints was built and relation expression between damage of solder joints and resistance strain was deduced. It provides fundamental basis for characteristic research of SnAgCu solder joints resistance strain under the load of temperature and humidity. On the foundation of former test system of micro-resistance, test system of solder joints was designed to measure resistance in the environment of temperature and humidity. Four-probe method in micro-resistance measurement has been replaced by five-probe difference method which is precise through experimental proof in the paper. In this article, with SnAgCu solder joints specimens (the width and length is lmm, different thickness), five kinds of experiments have been performed by five-probe difference method, including high-low thermal shock cycle test with low humidity, high temperature cycle with low humidity, high temperature constant, humidity cycle under low temperature and humidity cycle under medium temperature constant. A lot of solder specimens'testing results have been processed by origin software. The results show that: 1. changes in solder joints'resistance strain become greater with enlargement of cycle temperature range; 2. in the process of elevation and decrease of temperature, a phenomenon of hysteresis loop appears in the curve of resistance strain and area of hysteresis loop become greater with enlargement of cycle temperature range; 3. summit of solder joints'resistance and resistance strain has a rising trend as the number of cycle index is incremental, which accords with creep theory; 4. in the short term, solder joints'resistance and resistance strain don't change in relation to humidity change, the reason is that etch pits and flaws in the solder joints aren't formed by corrosion and influence of humidity isn't very obvious. A deep relationship among resistance strain, corrosion rate, growth rate of internal crack and time was deduced according to relation expression between solder joints'damage and resistor strain, then curve of constant temperature resistance strain over time was drew in the condition of temperature and humidity. Compared constant temperature resistance strain curve over time under the load of thermal and humidity to constant temperature resistance strain curve over time under the load of temperature alone and resistance strain curve over time under the load of humidity alone, the first circumstance gets into accelerated stage of damage in advance, which reduce solder joint life and according to failure mechanism of lead-free solder joints. At last, further research and assumption are put forward according to drawback in this paper.
引文
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