脉冲电源在印制板电镀中的应用
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摘要
随着电子工业的飞速发展,表面贴装技术可以使电子产品降低价格、缩小体积、使产品微型化、提高产品的可靠性。由于印制电路板体积的缩小,势必要加密导线、缩小线距、增加层次。承担电路板多层间导电作用的导通孔也设计得越来越密,孔径越来越小。这对双面及多层电路板制造过程中的关键工序—镀铜提出了更高的要求。根据我国目前的印制板电镀工艺现状,研究一种电镀速度快、镀层均匀、穿孔能力强、控制精度好的新型节能型电镀电源—脉冲电镀电源具有很强的现实意义。
本文首先介绍了脉冲电镀的原理、脉冲参数选择依据以及脉冲参数对镀层质量的影响,在此基础上又对反向脉冲电镀作了简单介绍。通过对脉冲电镀的原理分析可知,在脉宽、周期、占空比、电流幅度选择合适的情况下,脉冲电镀能使镀层结晶细密、纯度高、均匀性好、延展性强、抗腐蚀性能强。
本文研制的脉冲电源采用开关电源作为直流供电电源,进行恒压/恒流调节;采用直流斩波原理对直流电进行斩波控制从而得到一系列脉宽可调的正负脉冲;通过单片机进行调节输出电压/电流的大小、脉冲的宽度和频率。该脉冲电源输出的是正反向脉宽可调的脉冲(可变换为完全正向脉冲),在反向脉冲电镀的阳极电流部分实质上是一个“退镀”过程,类似电抛光,即将阴极电流脉冲中所获得沉积层的毛刺溶解除去,改善复杂形状镀层的厚度分布,从而起到整平作用。该电源具有体积小、重量轻、高效、节能、电流/电压恒定自动调整功能、正反向脉宽可调、电镀效果好等特点,特别适合高校实验室、工程训练中心、企业研发中心使用。
该脉冲电源用于印制板镀铜上,印制板表面铜层与孔壁铜层“厚度比”能趋近1∶1,深孔镀层出现的不良“狗骨”现象能得到改善。与直流电镀相比,在相同镀铜厚度的要求下可节省时间30%左右;板面镀铜厚度分布更均匀,平滑性得到改善。
Along with electronics industry swift development, the electronic products price reduces, volume reduces, reliable enhancement. As a result of the printed circuit boards volume reduction, will probably inevitably the encrypt wire、the reduction line-spacing、increase the layers. The through hole of electricity is design more and more densely, aperture getting smaller. This is a higher request to the copper-plating of printed circuit board. According to plating situation of our country present printed circuit board, studies one kind of pulsing power supply , it's plating speed is quick、coating is even、perforation ability is strong、control precision is good and so on has very strong significance.
This article first introduced pulse plating principle, pulse parameter choice basis as well as pulse parameter influence to coating; then the article introduce reverse pulse plating. By analyzing the pulse plating principle we know that in the pulse width、cyclical、seizes spatial ratio、electric current size appropriate situation, the pulse plating can cause to crystal to be closer、purity is higher、uniformity is better、ductility is stronger、corrosion resistance is stronger .
This article develops the pulse power source uses the switching power supply as a DC power supply, achieve constant voltage / constant current regulation;Through cuts the wave to the current, thus obtains a series of pulse width adjustable positive and negative pulse; Through monolithic integrated circuit adjustment output voltage/current size and pulse width、frequency. What this pulse power source outputs is pulse which is the forward and reverse pulse width adjustable (May transform for the completely direct pulse), Actual is one "Dissolved coating" in the reverse pulse plating's anode current part, similar: Electricity polishing. Namely: Dissolved bulge part, Causes coating to be smooth, thus plays the leveling role. This power source has the volume to be smaller, weight to be lighter, efficiency to be higher, energy consumption to be lower, electric current/voltage constant automatic control function, forward and reverse pulse width adjustable, plating effect good and so on characteristics, university laboratory, project training center, enterprise R&D center is especially suitable.
When the pulse power source is uses in board copper-plating, the board surface copper level and the opening wall copper level "Thickness ratio" can draw close 1 : 1, often presents "the dog bone" phenomenon in deep hole surface to be improved. Compares with direct-current power source, the pulse power source can save time about 30%; The board surface copper-plates thickness distribution to be evener, smoothness is improved.
本文首先介绍了脉冲电镀的原理、脉冲参数选择依据以及脉冲参数对镀层质量的影响,在此基础上又对反向脉冲电镀作了简单介绍。通过对脉冲电镀的原理分析可知,在脉宽、周期、占空比、电流幅度选择合适的情况下,脉冲电镀能使镀层结晶细密、纯度高、均匀性好、延展性强、抗腐蚀性能强。
本文研制的脉冲电源采用开关电源作为直流供电电源,进行恒压/恒流调节;采用直流斩波原理对直流电进行斩波控制从而得到一系列脉宽可调的正负脉冲;通过单片机进行调节输出电压/电流的大小、脉冲的宽度和频率。该脉冲电源输出的是正反向脉宽可调的脉冲(可变换为完全正向脉冲),在反向脉冲电镀的阳极电流部分实质上是一个“退镀”过程,类似电抛光,即将阴极电流脉冲中所获得沉积层的毛刺溶解除去,改善复杂形状镀层的厚度分布,从而起到整平作用。该电源具有体积小、重量轻、高效、节能、电流/电压恒定自动调整功能、正反向脉宽可调、电镀效果好等特点,特别适合高校实验室、工程训练中心、企业研发中心使用。
该脉冲电源用于印制板镀铜上,印制板表面铜层与孔壁铜层“厚度比”能趋近1∶1,深孔镀层出现的不良“狗骨”现象能得到改善。与直流电镀相比,在相同镀铜厚度的要求下可节省时间30%左右;板面镀铜厚度分布更均匀,平滑性得到改善。
Along with electronics industry swift development, the electronic products price reduces, volume reduces, reliable enhancement. As a result of the printed circuit boards volume reduction, will probably inevitably the encrypt wire、the reduction line-spacing、increase the layers. The through hole of electricity is design more and more densely, aperture getting smaller. This is a higher request to the copper-plating of printed circuit board. According to plating situation of our country present printed circuit board, studies one kind of pulsing power supply , it's plating speed is quick、coating is even、perforation ability is strong、control precision is good and so on has very strong significance.
This article first introduced pulse plating principle, pulse parameter choice basis as well as pulse parameter influence to coating; then the article introduce reverse pulse plating. By analyzing the pulse plating principle we know that in the pulse width、cyclical、seizes spatial ratio、electric current size appropriate situation, the pulse plating can cause to crystal to be closer、purity is higher、uniformity is better、ductility is stronger、corrosion resistance is stronger .
This article develops the pulse power source uses the switching power supply as a DC power supply, achieve constant voltage / constant current regulation;Through cuts the wave to the current, thus obtains a series of pulse width adjustable positive and negative pulse; Through monolithic integrated circuit adjustment output voltage/current size and pulse width、frequency. What this pulse power source outputs is pulse which is the forward and reverse pulse width adjustable (May transform for the completely direct pulse), Actual is one "Dissolved coating" in the reverse pulse plating's anode current part, similar: Electricity polishing. Namely: Dissolved bulge part, Causes coating to be smooth, thus plays the leveling role. This power source has the volume to be smaller, weight to be lighter, efficiency to be higher, energy consumption to be lower, electric current/voltage constant automatic control function, forward and reverse pulse width adjustable, plating effect good and so on characteristics, university laboratory, project training center, enterprise R&D center is especially suitable.
When the pulse power source is uses in board copper-plating, the board surface copper level and the opening wall copper level "Thickness ratio" can draw close 1 : 1, often presents "the dog bone" phenomenon in deep hole surface to be improved. Compares with direct-current power source, the pulse power source can save time about 30%; The board surface copper-plates thickness distribution to be evener, smoothness is improved.
引文
[1]朱瑞安,郭振常.脉冲电镀.电子工业出版社,1986
[2]冯立明.电镀工艺与设备.化学工艺出版社,1998
[3]钱苗根.现代表面技术.机械工业出版社,1999
[4]J.CI.Puippe and N.Ibl,Zurich.Limitatuon of UsefulRange Conditions in Pulse Plating due capasity Effects.second International Symposium on Pulse Plating,Oct.1981(7)
[5]A.J.Avila "new Developoments in pulsed current",Engel hard industries,second international symposium onpulse plating,octo 1981(6)
[6]A.J.Avila and M.J.Brown,"Designfactors in pulse plating",plating,19760
[7]P&SF Safff report,"Pulse plating is coming of age" plating,1982(2)
[8]韩苗兴,何永夫.电镀用脉冲电源的应用推广.2002《表面安装技术》第五期
[9]曾华良,吴仲达.电镀工艺手册.机械工业出版社,2000
[10]A.J.Avila.The sine Wave Pulse Plate.First internatinal symposium on Pulse Plating,Aprirl,1979(19)
[11]电镀手册编写组编电镀手册(上册)。北京:国防工业出版社,1977.10.
[12]K.I.Popov,M.D.Mdksimovic and M V.Simicic.The Prevention of Spongy Deposit Formation on inert Substrates.Surface technology,1984(22)
[13]K.I.Popov,M.D.Mdksimovic and B.M.ocokoljic,Yugoslavj a,"The Efect of the Pulsting Currnet on the Surface Roughness and the Poroslity of Metal Deposits",Surface technology 1980(11).
[14]K.I.Popov,M.D.Mdksimovic and S.S Djokic.Maximum Practical Deposition Rate.Surface technology,1981(14)
[15]K.I.Popov,M.D.Mdksimovic and R.M.Stevanovic.The Effect Of Pause-to-Pulse Ratio on Microthrowing Power of Metal Deposition.Surface technology,1984(22)
[16]侯振义.直流开关电源技术及应用.电子工业出版社,2006
[17]李先允.电力电子技术.中国电力出版社,2006.9
[18]张加胜.电力电子技术.石油大学出版社,2004.10
[19]郑国川,李洪英.实用开关电源技术.福建科学技术出版社,2004
[20]陈国呈.新型力电子变换技术.中国电力出版社,2004
[21]潘孟春,胡媛媛.电力电子技术实践教程.国防科技大学出版社,2005
[22]楚斌.IR2110功率驱动芯片应用.《电子工程师》第30卷第10期,2004.10
[23]程志平等.脉冲电源电路的设计.《电气时代》,2005年第10期
[24]马潮,詹卫前,耿德根等.Atmega8原理及应用手册[M].清华大学出版社,2003
[25]邓正平.钛合金脉冲镀银工艺实践[J].电镀与精饰,2002(3)
[26]H.Y.CLeh,H.B.Linford and C.C.wan;Plating and Surface Finishing,1997(66)
[27]于军等.TL494脉宽调制器集成电路的研究.吉林化工学院学报.第22卷第3期,2005.6
[28]柳旭英,于佐东.利用TLC5620构成12位D/A和A/D电路河海大学常州分校学报第19卷第3期,2005.9
[29]胡汉才.单片机原理及系统设计.清华大学出版社,2002
[30]王宇野,周晨松.单片机在脉冲电镀电源中的应用《电脑学习》第6期,2000.12
[31]滕红丽等.由一片TLC5620构成两路模/数、两路数/模转换电路的设计.《测控技术》,2005年第24卷第2期
[32]姚小乔.脉冲式电镀在电路板上的应用[J].电路板资讯(台湾),1996(90)
[33]W.L.Chen,W.C.Din9,Z.D.XU,D.F.MU,The Influence of Major Plating Variables on Through-hole Uniformity for Acid Copper Plating,Cicuitree,Septeber 2001
[34]Roald Blake,Pulse plating,PC FAB 2000.1
[35]关宇东等.高速换向脉冲电镀电源研制《电镀与环保》第15卷第11期,1995.1
[36]Michael Barbetta,Kim Barker,Don Hoppe,Craig Srrehlow,Pulse Plating in the Real World-Circuitree,1999(3)
[37]Andy Lesko,PCFab(Printed Circuit Fabrication),1999(7)
[38]Richard Mazzoli,PC Fab(Printed Circuit Fabrication),2000(1)
[39]黄鹏飞.脉冲电镀的正向电流密度对深镀能力的影响 《印制电路信息》,2006.1
[40]王兆安等.电力电子变流技术(第三版).机械工业出版社,1993.9
[41]张立主.脉冲镀和脉冲焊电源.机械工业出版社,1988.06
[42]张胜涛等.电镀工程.化学工业出版社,2002
[43]N.Ibl,Zurich,some Theoretical Aspects of pulse Electrolysis.surface Technology,1980(10)
[45]沙占友、孟志永、王彦朋等.单片机外围电路设计.电子工业出版社,2006
[2]冯立明.电镀工艺与设备.化学工艺出版社,1998
[3]钱苗根.现代表面技术.机械工业出版社,1999
[4]J.CI.Puippe and N.Ibl,Zurich.Limitatuon of UsefulRange Conditions in Pulse Plating due capasity Effects.second International Symposium on Pulse Plating,Oct.1981(7)
[5]A.J.Avila "new Developoments in pulsed current",Engel hard industries,second international symposium onpulse plating,octo 1981(6)
[6]A.J.Avila and M.J.Brown,"Designfactors in pulse plating",plating,19760
[7]P&SF Safff report,"Pulse plating is coming of age" plating,1982(2)
[8]韩苗兴,何永夫.电镀用脉冲电源的应用推广.2002《表面安装技术》第五期
[9]曾华良,吴仲达.电镀工艺手册.机械工业出版社,2000
[10]A.J.Avila.The sine Wave Pulse Plate.First internatinal symposium on Pulse Plating,Aprirl,1979(19)
[11]电镀手册编写组编电镀手册(上册)。北京:国防工业出版社,1977.10.
[12]K.I.Popov,M.D.Mdksimovic and M V.Simicic.The Prevention of Spongy Deposit Formation on inert Substrates.Surface technology,1984(22)
[13]K.I.Popov,M.D.Mdksimovic and B.M.ocokoljic,Yugoslavj a,"The Efect of the Pulsting Currnet on the Surface Roughness and the Poroslity of Metal Deposits",Surface technology 1980(11).
[14]K.I.Popov,M.D.Mdksimovic and S.S Djokic.Maximum Practical Deposition Rate.Surface technology,1981(14)
[15]K.I.Popov,M.D.Mdksimovic and R.M.Stevanovic.The Effect Of Pause-to-Pulse Ratio on Microthrowing Power of Metal Deposition.Surface technology,1984(22)
[16]侯振义.直流开关电源技术及应用.电子工业出版社,2006
[17]李先允.电力电子技术.中国电力出版社,2006.9
[18]张加胜.电力电子技术.石油大学出版社,2004.10
[19]郑国川,李洪英.实用开关电源技术.福建科学技术出版社,2004
[20]陈国呈.新型力电子变换技术.中国电力出版社,2004
[21]潘孟春,胡媛媛.电力电子技术实践教程.国防科技大学出版社,2005
[22]楚斌.IR2110功率驱动芯片应用.《电子工程师》第30卷第10期,2004.10
[23]程志平等.脉冲电源电路的设计.《电气时代》,2005年第10期
[24]马潮,詹卫前,耿德根等.Atmega8原理及应用手册[M].清华大学出版社,2003
[25]邓正平.钛合金脉冲镀银工艺实践[J].电镀与精饰,2002(3)
[26]H.Y.CLeh,H.B.Linford and C.C.wan;Plating and Surface Finishing,1997(66)
[27]于军等.TL494脉宽调制器集成电路的研究.吉林化工学院学报.第22卷第3期,2005.6
[28]柳旭英,于佐东.利用TLC5620构成12位D/A和A/D电路河海大学常州分校学报第19卷第3期,2005.9
[29]胡汉才.单片机原理及系统设计.清华大学出版社,2002
[30]王宇野,周晨松.单片机在脉冲电镀电源中的应用《电脑学习》第6期,2000.12
[31]滕红丽等.由一片TLC5620构成两路模/数、两路数/模转换电路的设计.《测控技术》,2005年第24卷第2期
[32]姚小乔.脉冲式电镀在电路板上的应用[J].电路板资讯(台湾),1996(90)
[33]W.L.Chen,W.C.Din9,Z.D.XU,D.F.MU,The Influence of Major Plating Variables on Through-hole Uniformity for Acid Copper Plating,Cicuitree,Septeber 2001
[34]Roald Blake,Pulse plating,PC FAB 2000.1
[35]关宇东等.高速换向脉冲电镀电源研制《电镀与环保》第15卷第11期,1995.1
[36]Michael Barbetta,Kim Barker,Don Hoppe,Craig Srrehlow,Pulse Plating in the Real World-Circuitree,1999(3)
[37]Andy Lesko,PCFab(Printed Circuit Fabrication),1999(7)
[38]Richard Mazzoli,PC Fab(Printed Circuit Fabrication),2000(1)
[39]黄鹏飞.脉冲电镀的正向电流密度对深镀能力的影响 《印制电路信息》,2006.1
[40]王兆安等.电力电子变流技术(第三版).机械工业出版社,1993.9
[41]张立主.脉冲镀和脉冲焊电源.机械工业出版社,1988.06
[42]张胜涛等.电镀工程.化学工业出版社,2002
[43]N.Ibl,Zurich,some Theoretical Aspects of pulse Electrolysis.surface Technology,1980(10)
[45]沙占友、孟志永、王彦朋等.单片机外围电路设计.电子工业出版社,2006