旋锻法制备WCu合金线材的工艺研究
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摘要
针对WCu假合金组元间熔点相差较大、体积含量相当、彼此又难于形成中间相等特点,采用常规的拉拔、挤压、锻造等工艺难以获得线材的现状。本文采用松装熔渗的方法获得了大长径比WCu合金坯材,并通过旋锻将其加工成直径4mm的线材。研究中通过电子扫描、X射线衍射等手段分析研究了不同温度、不同变形量WCu合金线材的显微组织和物理性能等,并在实验中完善了WCu合金旋锻加工的工艺。结果表明：
1.采用热旋锻技术可以制备钨铜合金线材,其最佳的旋锻工艺是坯材旋锻初始温度为700-750℃,坯材变形量在达到25%之前,每组锻模的加工量为0.4mm；变形量超过25%之后,每组锻模的加工量为0.3mm。
2.利用本文开发的旋锻工艺,可制备出直径为4mm、长度为800mm、相对密度为98.16%、硬度为252HV、电导率为39.2%IACS,组织均匀、表面光洁的WCu25合金线材。
3.长径比大于50的WCu25坯材是通过松装熔渗法获得的。其过程是称取一定量粒度组成的钨铜混合粉末,装入石墨模具中,加适当压力使得粉末之间接触紧密,加足够的补充铜块放入烧结炉中于1350℃下,H2气氛中进行熔渗烧结获得。
4.在一定的变形量范围内,旋锻可以有效的提高组织均匀性,细化晶粒,消除WCu合金中的Cu富集以及孔洞等缺陷,当变形量达到30%-40%时,可以使铜相在合金内部形成细密、连贯的网络状结构。WCu线材的电导率在各个旋锻温度下随着变形量的变化都是先升高后降低。WCu线材的强度随着变形量的增大而提高。变形量在0-30%范围内,延伸率随着变形量的增加而减小；变形量超过30%后,延伸率变化不大；在750℃下,变形量达到50%时,WCu25线材的抗拉强度达到601MPa。
According to the properties, such as the big difference of melting point among Pseudo-alloy elements, and with the equivalent volume, these elements are difficult to form mesophase, thereby adopting conventional technologies like drawing, extrusion; forging is hard to get alloy wire. In this paper, using loose packing infiltration method successfully obtained WCu alloy billet with large aspect ratio, and processing into wire of diameter 4mm by swaging technology. In the research, using electronic scanning, XRD methods, analyzing the Microstructure and physical properties of WCu alloy wire under different temperature and deformation, meanwhile Optimizing the WCu swaging process in the experiment. The result present:
1. Using the swaging technology prepare WCu pseudo alloy wire material. The optimal process is initial temperature 700℃-750℃. Before the deformation of billet reaches 25%, the processing capacity is 0.4mm; After the 25%, the processing capacity is 0.3mm.
2. Taking advantage of the swaging technology, we successfully developed the alloy wire with diameter 4mm, length 800mm, relative density 98.16%, hardness 252HV, electrical conductibility 39.2%IACS, homogeneous microstructures, clean surface.
3. WCu25 billet with slenderness ratio exceeding 100 times is obtained by loosing packing infiltration. The process is putting certain amount and grain composition WCu25 mixed power into graphite mold, then giving appropriate press make the power closely contact, and adding enough supplementary copper into the sintering furnace to complete the infiltration sintering under the H2 atmosphere.
4. In the appropriate deformation extent, swaging can effectively improve microstructure homogeneity, refining grain, and remove the defects like the Cu enrichment and holes in the WCu alloy. As the deformation reached 30%～40%, swaging is able to make Cu phase form detailed context and network-like closely connected structure. The electrical conductibility at every swaging temperature is increased first and then fall with the change of deformation. At Under 750℃,when the deformation reaches 50%, the Strength of WCu wire material enhance with the increase of deformation.
1.采用热旋锻技术可以制备钨铜合金线材,其最佳的旋锻工艺是坯材旋锻初始温度为700-750℃,坯材变形量在达到25%之前,每组锻模的加工量为0.4mm；变形量超过25%之后,每组锻模的加工量为0.3mm。
2.利用本文开发的旋锻工艺,可制备出直径为4mm、长度为800mm、相对密度为98.16%、硬度为252HV、电导率为39.2%IACS,组织均匀、表面光洁的WCu25合金线材。
3.长径比大于50的WCu25坯材是通过松装熔渗法获得的。其过程是称取一定量粒度组成的钨铜混合粉末,装入石墨模具中,加适当压力使得粉末之间接触紧密,加足够的补充铜块放入烧结炉中于1350℃下,H2气氛中进行熔渗烧结获得。
4.在一定的变形量范围内,旋锻可以有效的提高组织均匀性,细化晶粒,消除WCu合金中的Cu富集以及孔洞等缺陷,当变形量达到30%-40%时,可以使铜相在合金内部形成细密、连贯的网络状结构。WCu线材的电导率在各个旋锻温度下随着变形量的变化都是先升高后降低。WCu线材的强度随着变形量的增大而提高。变形量在0-30%范围内,延伸率随着变形量的增加而减小；变形量超过30%后,延伸率变化不大；在750℃下,变形量达到50%时,WCu25线材的抗拉强度达到601MPa。
According to the properties, such as the big difference of melting point among Pseudo-alloy elements, and with the equivalent volume, these elements are difficult to form mesophase, thereby adopting conventional technologies like drawing, extrusion; forging is hard to get alloy wire. In this paper, using loose packing infiltration method successfully obtained WCu alloy billet with large aspect ratio, and processing into wire of diameter 4mm by swaging technology. In the research, using electronic scanning, XRD methods, analyzing the Microstructure and physical properties of WCu alloy wire under different temperature and deformation, meanwhile Optimizing the WCu swaging process in the experiment. The result present:
1. Using the swaging technology prepare WCu pseudo alloy wire material. The optimal process is initial temperature 700℃-750℃. Before the deformation of billet reaches 25%, the processing capacity is 0.4mm; After the 25%, the processing capacity is 0.3mm.
2. Taking advantage of the swaging technology, we successfully developed the alloy wire with diameter 4mm, length 800mm, relative density 98.16%, hardness 252HV, electrical conductibility 39.2%IACS, homogeneous microstructures, clean surface.
3. WCu25 billet with slenderness ratio exceeding 100 times is obtained by loosing packing infiltration. The process is putting certain amount and grain composition WCu25 mixed power into graphite mold, then giving appropriate press make the power closely contact, and adding enough supplementary copper into the sintering furnace to complete the infiltration sintering under the H2 atmosphere.
4. In the appropriate deformation extent, swaging can effectively improve microstructure homogeneity, refining grain, and remove the defects like the Cu enrichment and holes in the WCu alloy. As the deformation reached 30%～40%, swaging is able to make Cu phase form detailed context and network-like closely connected structure. The electrical conductibility at every swaging temperature is increased first and then fall with the change of deformation. At Under 750℃,when the deformation reaches 50%, the Strength of WCu wire material enhance with the increase of deformation.
引文
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