激光振动传感器的研究与开发
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摘要
本论文是关于振动传感器的研究与开发的论述,激光振动传感器是利用激光入射到振动的质量块表面,经反射,入射光和反射光干涉后形成驻波。在入射点运用激光接收器探测激光驻波的光强,通过光强的强弱变化就可以探测出振动情况。研究激光振动传感器是为了获得抗电磁干扰、抗腐蚀、耐高温、体积小、重量轻、灵活方便性能更优的新型振动传感器。研究与比较其他类型的振动传感器,本传感器选用标准的CMOS工艺与MEMS工艺相结合,以激光作为探测工具,以硅工艺中的硅材料作为敏感惯性材料。研究开发的过程中采用ANSYS仿真确定悬臂梁的回滞能力和振动范围,利用MATLAB对激光形成的驻波进行仿真,方便结果的处理。前期的研究与开发工作,主要是确定出此传感器的测振方式和具体结构,并从中得到了测振方法,此传感器的最大创新点有两个。一是用激光作为探测工具,不需要光纤,这样既简化了传感器结构,又可以提高测量精度;二是将标准的CMOS工艺与先进的MEMS工艺相结合,可以用硅材料作为敏感元件的材料,性能更高。
This paper is the research and development on the vibration sensors. The laser vibration sensor is using laser to measure vibration, when the incident laser is reflected by the reflector surface of the quality block, the laser light of reflection and incident laser form standing wave after the intervention. In the incident point detect the intensity of standing wave laser light using laser receiver, by the changes of the strength of light intensity the vibration situation can be detected. Research on laser vibration sensor is to obtain a new type of vibration sensors that possess resistance to electromagnetic interference, and corrosion-resistant, heat-resistance, small size, light weight, better performance. Research and compared with other types of vibration sensor, the sensor select the integration of standard CMOS process with MEMS technology ,not only select laser as a tool but also select silicon material in the process as sensitive inertia material. Research and development in the processing, use simulation of ANSYS to determine the ability of delaying and the vibration scope of the cantilever vibration, using MATLAB simulating laser standing wave to get the outcome of the treatment. Early research and development work, mainly determine the approaches of measuring vibration and the concrete structure, and get a method of measurement vibration. The greatest innovation of this sensor has two points. First, using a laser as detection tools, do not need fiber, this not only simplifies sensor structure, but also improve the measurement accuracy. Second, the standard CMOS technology and the advanced MEMS technology are combined; silicon material can be used as a sensor material, and get higher performance.
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