微量胶接剂的点样技术研究
|
摘要
随着微电子产业和微机电系统的迅猛发展,元器件尺寸越来越小,对联结技术提出了更为苛刻的要求。产品的微小型化和多功能的集成,使得微小型产品在材料和技术上都是集成的、复杂的,因此微装配技术发挥着重要的作用。在微装配方法中微型零件的联结技术采用胶接剂粘结技术替代通用的螺纹等普通零件的联结方法。由于胶接技术不会破坏零件表面且联结后粘结表面应力分布均匀,已经成为微型零件的重要联结技术之一。微量胶接剂点样是微型零件胶接技术中的核心技术,它是一种通过可控的方式点样胶接剂的点样技术。
本文从研究现有的点样方法出发,针对微量胶接剂的点样要求设计了实验装置。实验装置主要包括点样机械结构和自动挤胶控制两部分。本文分别采用高气压压缩气体和低气压压缩气体进行实验。当采用高气压压缩气体并增加小孔与玻璃基板的距离,难以准确控制胶点的点样位置。而采用低气压压缩气体进行实验并减小小孔与玻璃基板的距离,虽然可以实现胶点位置的准确点样,但是胶点的外形一致性差。
对两次实验进行总结,利用实验中发现的胶接剂在点样针上流动并且在气体作用消失后具有触变回复现象,结合胶接剂的非牛顿流体特性、触变性和胶接浸润吸附理论。提出了一种新的切实可行的气动辅助针式点样方法。该点样方法克服了原有的针式转印技术点样胶点一致性差的缺点,并实现了在不更换点样针的情况下,通过改变点样针浸没胶接剂的深度和浸没胶接剂的时间,达到控制胶点直径大小变化的目的,而且能够满足胶点一致性良好的要求。
With the high-speed development of Micro Electronic Mechanical System and micro electronics, the size of apparatus is becoming smaller and smaller. The requirement of coupling is not easy to deal with. The technology plays an important role in micro assembly system which is compositive and complex in materials. The method of bonding mini accessory is used in micro assembly system instead of traditional screw joint structure. Because bonding technology can not destroy the surface of accessory, the stress between joint interface is average, the bonding technology has become one of the most important connect methods. The micro dispensing technology is dispensing adhesive in a controlled way which is a key technology in micro accessory bonding.
After studying dispensing system in existence, a system is developed to deal with micro dispensing. It includes mechanical system and control system. Do the research with high air pressure and low air pressure. It is hard to jetting exactly when in the condition of using high air pressure and long distance between hole and glass. The shape is unacceptable when using low air pressure and short distance between hole and glass.
In conclusion, by analysing non-newton characters, thixotropy character and infiltration theory, we find out that adhesive will flow along the dispensing needle. We propose a new method of dispensing adhesive. The new method overcome the disadvantage of dot is not consistent in original way. By using the method proposed in this paper, it is easy to different size of dot without changing dispensing needle. It comes true by changing the depth of dipping into adhesive and the time of dipping. The shape and consistent is also acceptable.
本文从研究现有的点样方法出发,针对微量胶接剂的点样要求设计了实验装置。实验装置主要包括点样机械结构和自动挤胶控制两部分。本文分别采用高气压压缩气体和低气压压缩气体进行实验。当采用高气压压缩气体并增加小孔与玻璃基板的距离,难以准确控制胶点的点样位置。而采用低气压压缩气体进行实验并减小小孔与玻璃基板的距离,虽然可以实现胶点位置的准确点样,但是胶点的外形一致性差。
对两次实验进行总结,利用实验中发现的胶接剂在点样针上流动并且在气体作用消失后具有触变回复现象,结合胶接剂的非牛顿流体特性、触变性和胶接浸润吸附理论。提出了一种新的切实可行的气动辅助针式点样方法。该点样方法克服了原有的针式转印技术点样胶点一致性差的缺点,并实现了在不更换点样针的情况下,通过改变点样针浸没胶接剂的深度和浸没胶接剂的时间,达到控制胶点直径大小变化的目的,而且能够满足胶点一致性良好的要求。
With the high-speed development of Micro Electronic Mechanical System and micro electronics, the size of apparatus is becoming smaller and smaller. The requirement of coupling is not easy to deal with. The technology plays an important role in micro assembly system which is compositive and complex in materials. The method of bonding mini accessory is used in micro assembly system instead of traditional screw joint structure. Because bonding technology can not destroy the surface of accessory, the stress between joint interface is average, the bonding technology has become one of the most important connect methods. The micro dispensing technology is dispensing adhesive in a controlled way which is a key technology in micro accessory bonding.
After studying dispensing system in existence, a system is developed to deal with micro dispensing. It includes mechanical system and control system. Do the research with high air pressure and low air pressure. It is hard to jetting exactly when in the condition of using high air pressure and long distance between hole and glass. The shape is unacceptable when using low air pressure and short distance between hole and glass.
In conclusion, by analysing non-newton characters, thixotropy character and infiltration theory, we find out that adhesive will flow along the dispensing needle. We propose a new method of dispensing adhesive. The new method overcome the disadvantage of dot is not consistent in original way. By using the method proposed in this paper, it is easy to different size of dot without changing dispensing needle. It comes true by changing the depth of dipping into adhesive and the time of dipping. The shape and consistent is also acceptable.
引文
[1]汤友森.胶接技术在机械产品中的应用.粘接,1989,10(6):38-40.
[2]王玉珂.胶接技术的发展及应用.航空制造工程,1991,(7):15-17.
[3]王晓东,宋洪侠,HESSELBACH J.微型零件胶粘接的微装配技术.制造业自动化,2004,(9):16-19.
[4]马维民,Jurgen Hesselbach.微胶接装配中胶接区表面结构实验.北京航空航天大学学报,2007,33(3):361-365.
[5]邓圭玲,钟掘.点状胶液接触式转移机理的流体动力学模型.中南大学学报:自然科学版,2006,37(1):84-90.
[6]Li Jianping,Deng Guiling.Technology development and basic theory study of fluid dispensing-A review.Proceedings of the Sixth IEEE CPMTConference on High Density Microsystem Design and Packaging and Component Failure Analysis,Shanghai 2004:198-215.
[7]KIM K.H.,PARK K.C.,MAD.Y.Structural,electrical and optical properties of aluminum doped zinc oxide films prepared by radio frequency magnetron sputtering.Journal of Applied Physics,1997,81(12):7764-7772.
[8]WENDT R,ELLMER K.Desorption of Zn from a growing ZnO:Al-film deposited by magnetron sputtering.Surface and Coating Technology,1997,93(5):27-31.
[9]JAE H.C.,HITOSHI T.,TOMOJ K.Initial preferred growth in zinc oxide thin films on Si and amorphous substrates by a pulsed laser deposition.Journal of Crystal Growth,2001,226(4):493-500.
[10]SILVA RF,ZANIQUELLI MED.Aluminium-doped zinc oxide films prepared by an inorganic sol-gel route.Thin Solid Films,2004.449(1):86-93.
[11]王晓东,刘冲,王立鼎.微型夹钳的最新研究.科技通讯(上海),2004,10(1):1-8.
[12]Hesselbach,Juergen,Poker,et al.Assembly of a miniature linear actuator using vision feedback.Microrobotics and Microassembly II,Boston,2000,4194:13-20.
[13]范琳,袁桐,杨士勇.微电子封装技术与聚合物封装材料的发展趋势.新材料产业,2005(8):39-46.
[14]况延香,朱颂春.SMT中的先进微电子封装技术概况.电子工艺技术,2004,25(4):178-182.
[15]高尚通,杨克武.新型微电子封装技术.电子与封装,2004,4(1):10-15.
[16]Chris Marinelli,Barry Burns.Adhesives/Epoxies & Dispensing,SMT Surface Mount Technology Magazine,2000,14(5):90-94.
[17]赵翼翔,李涵雄,丁汉等.基于谱方法的点样过程建模.液压与气动,2004,(3):1-3.
[18]Chen X.B.,Schoenau G.,Zhang W,J.Modeling of time-pressure Fluid Dispensing Processes.IEEE Transactions on Electronics Packaging Manufacturing,2000,23(4):300-305.
[19]王瑞,周一界.时间压力型点胶技术影响因素分析.包装工程,2008,29(6):106-109.
[20]Chen X.B.,Ke H.Effects of fluid properties on dispensing processes for electronics packaging.IEEE Transactions on Electronics Packaging,2006,29(2):75-82.
[21]Chen X.B.,Schoenau G.,Zhang W.J.Modeling and control of dispensing processes for surface mount technology.IEEE/ASME Transactions on Mechatronics,2005,10(3):326-334.
[22]Li HanXiong,Liu,J.,Chen C.P.et al.h Simple Model-Based Approach for Fluid Dispensing Analysis and Control.IEEE/ASME Transactions on Mechatronics 2007,22(4):491-503.
[23]沈正湘,李涵雄,丁汉,韩雷.电子封装中的点胶过程中分析和控制.控制工程,2005,12(5):405-408.
[24]Van Den Bosch A,Debarros T.Step-by-step SMT Adhesives/Epoxies & Dispensing.SMT Surface Mount Technology Magazine 1997,11(5):102-107.
[25]Lewis A,Adamson S,Nielsen L.et al,Fluid Dispensing Capabilities for Assembly of MEMS.http://www.asymtek.com/news/articles
[26]Deng GuiLing,Cui HuiXi,Peng QuanFan,et al.Experiment study influences of some process parameters on dispensing dots consistency in contact dispensing process.Conference on High Density Microsystem Design and Packaging and Component Failure Analysis,HDP'05,Shanghai,2005.
[27]邓圭玲,彭全凡.螺杆泵胶液点胶高度对胶点大小一致性的影响.封装测试技术,2005,30(5):44-48.
[28]李章平,邓圭玲,精密点胶螺旋泵胶液流动分析与数值仿真.中国机械工程,2007,18(17):2102-2107.
[29]Ashley,Dan Adamson,Steven J.Advancements in Solder Paste Dispensing.SMT Surface Mount Technology,2008,22(7):10-14.
[30]Woods,Todd Adamson,Steven J.JET DISPENSING.SMT Surface Mount Technology,2005,19(1):26-30.
[31]Alan Lewis.Underfill Techniques:Automated Dispensing and Jetting.Advanced Packaging,2003,12(6):39-41.
[32]Horatio Quinones,Alec Babiarz,Christian Deck.Fluid Jetting for next generation package,http://www.asymtek.com/news/articles/2002_04_fluid_jetting_for_next_gener ation_packages.pdf.
[33]Quinones H.,Babiarz A.,Fang L.Jetting Technology for Microelectronics.http://www.asymtek.com/news/articles/2002_10_jetting_technology_for_microelectron ics.pdf.
[34]Lewis,Al.Jetting:Dispense Technology of Choice for Adhesives.SMT Surface Mount Technology,2006,20(3):18-19.
[35]Toleno,Brian.STEP 5:Adhesives/Epoxies & Dispensing.SMTSurface Mount Technology,2007,21(5):42-44.
[36]Ashley,Dan Lewis,A1 Successful Jetting in SMT.SMTSurface Mount Technology,2007,1(5):34-35.
[37]Read,Hugh Non-Contact Streaming Technology Enhances Dispensing.SMT Surface Mount Technology,2007,21(11):12-14.
[38]Liu Yanwei,Deng Guiling.The Influence of Fluid Viscosity of Fluid Jetting Dispensing.High Density packaging and Microsystem Integration,Shanghai,2007.
[39]Chen X.B.,Kai J.,Hashemi M.Evaluation of Fluid Dispensing Systems Using Axiomatic Design Principles.Journal of Mechanical Design,2007,129(6):640-648.
[40]Chen X.B.Modeling of Rotary Screw Fluid Dispensing.Processes Journal of Electronic Packaging.2007.129(2):172-178.
[41]朱桂英,刘金海,朱天军等.二级减压气体流量精确控制方法,河北建筑科技学院学报,2004,21(2):60-61.
[42]Bush R.Matching Fluid Dispensers to Materials for Electronics Applications.Electronic packaging & production,1995,(37):56-62.
[43]Mikio Horie,FutoshiKabayashi.Development of mechanical systems for Micro-bonding by adhesive,JSME International Journal,1996,39(2):365-370.
[2]王玉珂.胶接技术的发展及应用.航空制造工程,1991,(7):15-17.
[3]王晓东,宋洪侠,HESSELBACH J.微型零件胶粘接的微装配技术.制造业自动化,2004,(9):16-19.
[4]马维民,Jurgen Hesselbach.微胶接装配中胶接区表面结构实验.北京航空航天大学学报,2007,33(3):361-365.
[5]邓圭玲,钟掘.点状胶液接触式转移机理的流体动力学模型.中南大学学报:自然科学版,2006,37(1):84-90.
[6]Li Jianping,Deng Guiling.Technology development and basic theory study of fluid dispensing-A review.Proceedings of the Sixth IEEE CPMTConference on High Density Microsystem Design and Packaging and Component Failure Analysis,Shanghai 2004:198-215.
[7]KIM K.H.,PARK K.C.,MAD.Y.Structural,electrical and optical properties of aluminum doped zinc oxide films prepared by radio frequency magnetron sputtering.Journal of Applied Physics,1997,81(12):7764-7772.
[8]WENDT R,ELLMER K.Desorption of Zn from a growing ZnO:Al-film deposited by magnetron sputtering.Surface and Coating Technology,1997,93(5):27-31.
[9]JAE H.C.,HITOSHI T.,TOMOJ K.Initial preferred growth in zinc oxide thin films on Si and amorphous substrates by a pulsed laser deposition.Journal of Crystal Growth,2001,226(4):493-500.
[10]SILVA RF,ZANIQUELLI MED.Aluminium-doped zinc oxide films prepared by an inorganic sol-gel route.Thin Solid Films,2004.449(1):86-93.
[11]王晓东,刘冲,王立鼎.微型夹钳的最新研究.科技通讯(上海),2004,10(1):1-8.
[12]Hesselbach,Juergen,Poker,et al.Assembly of a miniature linear actuator using vision feedback.Microrobotics and Microassembly II,Boston,2000,4194:13-20.
[13]范琳,袁桐,杨士勇.微电子封装技术与聚合物封装材料的发展趋势.新材料产业,2005(8):39-46.
[14]况延香,朱颂春.SMT中的先进微电子封装技术概况.电子工艺技术,2004,25(4):178-182.
[15]高尚通,杨克武.新型微电子封装技术.电子与封装,2004,4(1):10-15.
[16]Chris Marinelli,Barry Burns.Adhesives/Epoxies & Dispensing,SMT Surface Mount Technology Magazine,2000,14(5):90-94.
[17]赵翼翔,李涵雄,丁汉等.基于谱方法的点样过程建模.液压与气动,2004,(3):1-3.
[18]Chen X.B.,Schoenau G.,Zhang W,J.Modeling of time-pressure Fluid Dispensing Processes.IEEE Transactions on Electronics Packaging Manufacturing,2000,23(4):300-305.
[19]王瑞,周一界.时间压力型点胶技术影响因素分析.包装工程,2008,29(6):106-109.
[20]Chen X.B.,Ke H.Effects of fluid properties on dispensing processes for electronics packaging.IEEE Transactions on Electronics Packaging,2006,29(2):75-82.
[21]Chen X.B.,Schoenau G.,Zhang W.J.Modeling and control of dispensing processes for surface mount technology.IEEE/ASME Transactions on Mechatronics,2005,10(3):326-334.
[22]Li HanXiong,Liu,J.,Chen C.P.et al.h Simple Model-Based Approach for Fluid Dispensing Analysis and Control.IEEE/ASME Transactions on Mechatronics 2007,22(4):491-503.
[23]沈正湘,李涵雄,丁汉,韩雷.电子封装中的点胶过程中分析和控制.控制工程,2005,12(5):405-408.
[24]Van Den Bosch A,Debarros T.Step-by-step SMT Adhesives/Epoxies & Dispensing.SMT Surface Mount Technology Magazine 1997,11(5):102-107.
[25]Lewis A,Adamson S,Nielsen L.et al,Fluid Dispensing Capabilities for Assembly of MEMS.http://www.asymtek.com/news/articles
[26]Deng GuiLing,Cui HuiXi,Peng QuanFan,et al.Experiment study influences of some process parameters on dispensing dots consistency in contact dispensing process.Conference on High Density Microsystem Design and Packaging and Component Failure Analysis,HDP'05,Shanghai,2005.
[27]邓圭玲,彭全凡.螺杆泵胶液点胶高度对胶点大小一致性的影响.封装测试技术,2005,30(5):44-48.
[28]李章平,邓圭玲,精密点胶螺旋泵胶液流动分析与数值仿真.中国机械工程,2007,18(17):2102-2107.
[29]Ashley,Dan Adamson,Steven J.Advancements in Solder Paste Dispensing.SMT Surface Mount Technology,2008,22(7):10-14.
[30]Woods,Todd Adamson,Steven J.JET DISPENSING.SMT Surface Mount Technology,2005,19(1):26-30.
[31]Alan Lewis.Underfill Techniques:Automated Dispensing and Jetting.Advanced Packaging,2003,12(6):39-41.
[32]Horatio Quinones,Alec Babiarz,Christian Deck.Fluid Jetting for next generation package,http://www.asymtek.com/news/articles/2002_04_fluid_jetting_for_next_gener ation_packages.pdf.
[33]Quinones H.,Babiarz A.,Fang L.Jetting Technology for Microelectronics.http://www.asymtek.com/news/articles/2002_10_jetting_technology_for_microelectron ics.pdf.
[34]Lewis,Al.Jetting:Dispense Technology of Choice for Adhesives.SMT Surface Mount Technology,2006,20(3):18-19.
[35]Toleno,Brian.STEP 5:Adhesives/Epoxies & Dispensing.SMTSurface Mount Technology,2007,21(5):42-44.
[36]Ashley,Dan Lewis,A1 Successful Jetting in SMT.SMTSurface Mount Technology,2007,1(5):34-35.
[37]Read,Hugh Non-Contact Streaming Technology Enhances Dispensing.SMT Surface Mount Technology,2007,21(11):12-14.
[38]Liu Yanwei,Deng Guiling.The Influence of Fluid Viscosity of Fluid Jetting Dispensing.High Density packaging and Microsystem Integration,Shanghai,2007.
[39]Chen X.B.,Kai J.,Hashemi M.Evaluation of Fluid Dispensing Systems Using Axiomatic Design Principles.Journal of Mechanical Design,2007,129(6):640-648.
[40]Chen X.B.Modeling of Rotary Screw Fluid Dispensing.Processes Journal of Electronic Packaging.2007.129(2):172-178.
[41]朱桂英,刘金海,朱天军等.二级减压气体流量精确控制方法,河北建筑科技学院学报,2004,21(2):60-61.
[42]Bush R.Matching Fluid Dispensers to Materials for Electronics Applications.Electronic packaging & production,1995,(37):56-62.
[43]Mikio Horie,FutoshiKabayashi.Development of mechanical systems for Micro-bonding by adhesive,JSME International Journal,1996,39(2):365-370.