显微红外光学成像系统的设计
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摘要
红外热成像技术是现代影像学中的一门新兴技术。与x射线、B超、CT、核磁共振等显像技术的成像原理不同,它不主动发射任何射线,只是被动地接受热源所发射出的红外线,经过处理,绘制出热源的影像。它的最大特点就是不用接触待检测物体。因此,对于一些高危行业,比如核工业中元器件的检测就变得非常容易了。
本文旨在利用红外热成像技术和纤维技术的有机结合,建立一个显微红外光学成像系统,通过该系统,我们可以将大规模集成电路板中数以万计的微小元器件的影像传输到计算机中,经过计算机的分析处理,就可以很容易的分析出集成电路板的工作状态,找出故障的元器件。这样,大规模集成电路板上元器件故障的快速检测就变的非常容易了。
The technology of IR and thermal image is an emerging technology in modern imaging technology.The principle of the technology of IR and thermal image is not the same as x-ray, B-chao, CT, magnetic resonance imaging technology. It does not take the initiative to launch any ray, only a passive acceptance of heat emitted by the infra-red, after treatment, drawing heat out of the image. Its greatest feature is the contacts do not have to be Detected objects. .Therefore, regarding some high-risk professions, for instance in the nuclear industry the primary device examination became extremely easy.
This paper aims to make use of infrared thermal imaging technology and the organic integration of fiber technology, the establishment of a micro-infrared optical imaging system, Through the system, we can board in large-scale integrated circuits with tens of thousands of tiny components of the image transfer to your computer, After computer analysis of treatment, we can easily analyze the state of integrated circuit boards and identify the failure of components. In this way, large-scale integrated circuit components on-board fault detection Express changed very easily.
本文旨在利用红外热成像技术和纤维技术的有机结合,建立一个显微红外光学成像系统,通过该系统,我们可以将大规模集成电路板中数以万计的微小元器件的影像传输到计算机中,经过计算机的分析处理,就可以很容易的分析出集成电路板的工作状态,找出故障的元器件。这样,大规模集成电路板上元器件故障的快速检测就变的非常容易了。
The technology of IR and thermal image is an emerging technology in modern imaging technology.The principle of the technology of IR and thermal image is not the same as x-ray, B-chao, CT, magnetic resonance imaging technology. It does not take the initiative to launch any ray, only a passive acceptance of heat emitted by the infra-red, after treatment, drawing heat out of the image. Its greatest feature is the contacts do not have to be Detected objects. .Therefore, regarding some high-risk professions, for instance in the nuclear industry the primary device examination became extremely easy.
This paper aims to make use of infrared thermal imaging technology and the organic integration of fiber technology, the establishment of a micro-infrared optical imaging system, Through the system, we can board in large-scale integrated circuits with tens of thousands of tiny components of the image transfer to your computer, After computer analysis of treatment, we can easily analyze the state of integrated circuit boards and identify the failure of components. In this way, large-scale integrated circuit components on-board fault detection Express changed very easily.
引文
[1]安毓英,刘继芳,李庆辉.光电子技术[J].北京电子工业出版社,2002(3).
[2]万九卿,李行善.印制电路板的红外热像诊断技术[J].电子测量与仪器学报,2003(2).
[3]张广喜.印刷电路板红外热图的定量分析[J].激光与红外,1999(2).
[4]范超.红外电路板故障检测仪的数字图像采集[J].中国测试技术. 1998(1).
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[6] J.P.Wright.Progress in applications of infrared thermographic testing of electronic assemblies[J]. Appl. Opt ,1977, 21: 220– 224.
[7] David A Moss,Michael Keese,Rainer Pepperkok. IR microspectroscopy of live cells[J]. Vib Spectrosc,2005,38:185.
[8]周金梅,邢廷文,林妩媚.红外焦平面阵列非均匀性校正的精度分析[N].光子学报, 2002-12-27,(5)
[9]孙志君.红外焦平面阵列技术的发展现状与趋势[J].光机电信息,2004(2).
[10] Philip Heraud, Bayden R Wood,Mark J Tobin, eta1.Mapping of nutrient—induced biochemical changes in living algal cells using synchrotron infrared microspectroscopy[J].FEMS Microbiol Lett,2005,249(2):219.
[11]余怀之.红外光学材料[M].北京:国防工业出版社, 2007.
[12] Liu Kanzhi,Man Angela,Anthony Shaw R,et a1.Molecular determination of liver fibrosis by synchrotron infrared microspectroscop y[J].Biochim Biophys Acta,2006,1 758:960
[13] Lisa M Miller,Paul Dumas.Chemical imaging of biologicaltissue with synchrotron infrared light[J].Biochim Biophys Acta,2006,1758:846.
[14] M.P.Wirick.IR testing of PCBs and hybrids[J].Proceedings of SPIE Symposium,1980.
[15]吴宗凡,柳美琳,张绍举等.红外与微光技术[M].北京:国防工业出版社, 1998.
[16] David L W etzel,Gwvn P W illiams. Synchrotron infrared microspectroscopy of retinal layers[J]. Vib Spectrosc, 2002,30:101.
[17] R.V.Pearson.Printed circuit board detection and isolation using thermal imaging techniques [J]. Proceedings of SPIE, 1986,20:122– 125.
[18] Paul Dumas,Mark J tobin. A bright source for infrared microspectroscopy synchrotron radiation infrared spectroscopy[J]. Spectrosc Eur,2003,15(6):1.
[19] Ryan J$chexnaydre,Brian S Mitchel1.Synchrotron infrared microspectroscopy characterization of heterogeneities in solid-state blended polymers[J].Mater Lett,2007,61:2151.
[20] P.W.Hugo.The infrared automatic mass screening(IRAMS)system for printed circuit boardfault detection [J]. Proceedingsof SPIE, 1987,18:118– 123.
[21] Sommer A J.Handbook of vibrational spectroscopy.Chalmers J M ,Grifiths P R,et a1.Ed[J].Chichester,2002,1369.
[22] Todd I Smith.The source issue in infrared microsDectrosco—PY[J].Nucl Instrum M ethods Phys Res Sect A,2002,483:56.
[23]何丽.走向新世纪的红外热成像技术[J].激光与光电子学进展,2002(1).
[24] Koenig J L,Arvanitopoulos C n FT-IR microspectroscopic investigation of the interphase of epo xy resin—glass fiberreinforced compo sites[J].Applied Spe ctrosco py,1996,50(1):1—10.
[25] chatzi E G,Urban M W ,Ishida H,et a1.Determination of the accessibility of N—H groups of kevlar 49 fibres by photoacoustic FTIR spe ctroscopy[J]. Polymer, 1986, 27:l 850-1 854.
[26]李士贤.郑乐年.光学设计手册[M].北京:北京理工大学出版社, 1990.
[27]吴瑾光.近代傅立叶变换红外光谱技术及应用[M].西安:西安电子科技大学出版社,1994.
[28]向世明,倪国强.光电子成像器件原理[M].北京:国防工业出版社,1999.
[29] H.F. Spence.An artificial neural network printed circuit board diagnostic system based on infrared energy emissions[J]. IEEE AUTOTESTCON’91,,1991, 23:41– 45.
[30] L.G.Allred.A system for fault diagnosis in electronic circuits using thermal imaging[J]. IEEE AUTOTESTCON, 1992, pp:455– 458.
[31] L.G.Allred.Modified genetic algorithm for extracting thermal profiles from infrared image data [J]. Proceedings of SPIE,v1766,1992 ,pp:77 - 81.
[32] G. Serpen.Performance analysis of probabilistic potential function neural network classifier[J]. Intelligent Engineering SystemThrough Artificial Neural Networks,v7,Nov. pp. 471 - 476,1997.
[33] D.Wenzel.Thermal energy emission diagnostics enhancement to the advanced power supply test system [J]. IEEE AUTOTESTCON’98,pp. 1998.
[34]徐淦卿,陈钰,陈东杰.红外与物理技术[M].西安:西安电子科技大学出版社,1989.
[35] L.G.Allred.Minimal entropy reconstructions of thermal images for emissivity correction [J]. Proceedings of SPIE,v3700,pp.417 - 424,1999.
[36]萧泽新.工程光学设计[M].北京:电子工业出版社,2003. 111一113.
[37] PCI9054 data book, Version 2.1[J]. PLX Technology, 2000,1.
[38]卢福道.傅立叶变换红外显微镜及其应用[J].国外分析仪器,1995(3).
[39] Vasanthan N,R Salem D.Infrared spectroscopic analysis of crystallization in poly(ethylene naphthalate)[J].Polym EngSci,l999,8l:3II一3I2.
[40] Ken Kempfert, Bill Mc4,2arthy, AndFew Haefner.Advancements In IR M icrosarnpling of Layered Polymer Materials(PP)[J].Madison:Nicolet Instrument Corporation,2000.1—10.
[2]万九卿,李行善.印制电路板的红外热像诊断技术[J].电子测量与仪器学报,2003(2).
[3]张广喜.印刷电路板红外热图的定量分析[J].激光与红外,1999(2).
[4]范超.红外电路板故障检测仪的数字图像采集[J].中国测试技术. 1998(1).
[5] R.W. Jones.An infrared tester for printed circuit board and microcircuits[J]. Automation in Electronic Test Equipment,1969, 20: 767-769.
[6] J.P.Wright.Progress in applications of infrared thermographic testing of electronic assemblies[J]. Appl. Opt ,1977, 21: 220– 224.
[7] David A Moss,Michael Keese,Rainer Pepperkok. IR microspectroscopy of live cells[J]. Vib Spectrosc,2005,38:185.
[8]周金梅,邢廷文,林妩媚.红外焦平面阵列非均匀性校正的精度分析[N].光子学报, 2002-12-27,(5)
[9]孙志君.红外焦平面阵列技术的发展现状与趋势[J].光机电信息,2004(2).
[10] Philip Heraud, Bayden R Wood,Mark J Tobin, eta1.Mapping of nutrient—induced biochemical changes in living algal cells using synchrotron infrared microspectroscopy[J].FEMS Microbiol Lett,2005,249(2):219.
[11]余怀之.红外光学材料[M].北京:国防工业出版社, 2007.
[12] Liu Kanzhi,Man Angela,Anthony Shaw R,et a1.Molecular determination of liver fibrosis by synchrotron infrared microspectroscop y[J].Biochim Biophys Acta,2006,1 758:960
[13] Lisa M Miller,Paul Dumas.Chemical imaging of biologicaltissue with synchrotron infrared light[J].Biochim Biophys Acta,2006,1758:846.
[14] M.P.Wirick.IR testing of PCBs and hybrids[J].Proceedings of SPIE Symposium,1980.
[15]吴宗凡,柳美琳,张绍举等.红外与微光技术[M].北京:国防工业出版社, 1998.
[16] David L W etzel,Gwvn P W illiams. Synchrotron infrared microspectroscopy of retinal layers[J]. Vib Spectrosc, 2002,30:101.
[17] R.V.Pearson.Printed circuit board detection and isolation using thermal imaging techniques [J]. Proceedings of SPIE, 1986,20:122– 125.
[18] Paul Dumas,Mark J tobin. A bright source for infrared microspectroscopy synchrotron radiation infrared spectroscopy[J]. Spectrosc Eur,2003,15(6):1.
[19] Ryan J$chexnaydre,Brian S Mitchel1.Synchrotron infrared microspectroscopy characterization of heterogeneities in solid-state blended polymers[J].Mater Lett,2007,61:2151.
[20] P.W.Hugo.The infrared automatic mass screening(IRAMS)system for printed circuit boardfault detection [J]. Proceedingsof SPIE, 1987,18:118– 123.
[21] Sommer A J.Handbook of vibrational spectroscopy.Chalmers J M ,Grifiths P R,et a1.Ed[J].Chichester,2002,1369.
[22] Todd I Smith.The source issue in infrared microsDectrosco—PY[J].Nucl Instrum M ethods Phys Res Sect A,2002,483:56.
[23]何丽.走向新世纪的红外热成像技术[J].激光与光电子学进展,2002(1).
[24] Koenig J L,Arvanitopoulos C n FT-IR microspectroscopic investigation of the interphase of epo xy resin—glass fiberreinforced compo sites[J].Applied Spe ctrosco py,1996,50(1):1—10.
[25] chatzi E G,Urban M W ,Ishida H,et a1.Determination of the accessibility of N—H groups of kevlar 49 fibres by photoacoustic FTIR spe ctroscopy[J]. Polymer, 1986, 27:l 850-1 854.
[26]李士贤.郑乐年.光学设计手册[M].北京:北京理工大学出版社, 1990.
[27]吴瑾光.近代傅立叶变换红外光谱技术及应用[M].西安:西安电子科技大学出版社,1994.
[28]向世明,倪国强.光电子成像器件原理[M].北京:国防工业出版社,1999.
[29] H.F. Spence.An artificial neural network printed circuit board diagnostic system based on infrared energy emissions[J]. IEEE AUTOTESTCON’91,,1991, 23:41– 45.
[30] L.G.Allred.A system for fault diagnosis in electronic circuits using thermal imaging[J]. IEEE AUTOTESTCON, 1992, pp:455– 458.
[31] L.G.Allred.Modified genetic algorithm for extracting thermal profiles from infrared image data [J]. Proceedings of SPIE,v1766,1992 ,pp:77 - 81.
[32] G. Serpen.Performance analysis of probabilistic potential function neural network classifier[J]. Intelligent Engineering SystemThrough Artificial Neural Networks,v7,Nov. pp. 471 - 476,1997.
[33] D.Wenzel.Thermal energy emission diagnostics enhancement to the advanced power supply test system [J]. IEEE AUTOTESTCON’98,pp. 1998.
[34]徐淦卿,陈钰,陈东杰.红外与物理技术[M].西安:西安电子科技大学出版社,1989.
[35] L.G.Allred.Minimal entropy reconstructions of thermal images for emissivity correction [J]. Proceedings of SPIE,v3700,pp.417 - 424,1999.
[36]萧泽新.工程光学设计[M].北京:电子工业出版社,2003. 111一113.
[37] PCI9054 data book, Version 2.1[J]. PLX Technology, 2000,1.
[38]卢福道.傅立叶变换红外显微镜及其应用[J].国外分析仪器,1995(3).
[39] Vasanthan N,R Salem D.Infrared spectroscopic analysis of crystallization in poly(ethylene naphthalate)[J].Polym EngSci,l999,8l:3II一3I2.
[40] Ken Kempfert, Bill Mc4,2arthy, AndFew Haefner.Advancements In IR M icrosarnpling of Layered Polymer Materials(PP)[J].Madison:Nicolet Instrument Corporation,2000.1—10.