高g微阵列加速度传感系统机械加固技术研究
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摘要
高g加速度传感器已经在很多场合得到了应用,尤其是在军事领域的应用,如控制侵彻弹药引信在预定层数起爆,监测核爆破的冲击过程,侵彻武器研制过程中的冲击过载测试等。近几年来,随着针对硬目标的侵彻武器研究的大范围发展,具备测量高g值的加速度传感器需求变得尤为重要[1]。
本论文来源于预研项目“高g微阵列加速度传感系统技术研究”。本课题主要从事微阵列加速度传感系统的封装机械加固技术研究,从而完成高g微阵列加速度传感器技术研究中重要的技术指标——测量1.5×105g~2.0×105g加速度值,即加速度传感器在承受1.5×105g~2.0×105g的加速度冲击情况下,正常地工作并准确地输出信号。本论文研究内容包括如下四部分:
第一部分:分析传感器的封装外壳,为了达到项目指标,提出新的外壳封装形式,并进行加工试验,确定外壳封装形式;
第二部分:分析影响超声波热压焊接强度的因素,针对影响超声波热压焊接的主要四个工艺参数:焊接温度、焊接压力、焊接时间和超声功率,主要研究焊接温度与焊接压力对焊接强度之间的关系。通过分析,提出不同地工艺参数,进行加工试验,将加工好的传感器进行冲击试验,找出更佳的工艺参数;
第三部分:将加工好的传感器进行冲击试验,通过冲击试验结果测试传感器性能,并提出改进方案;
第四部分:通过有限元分析,模拟仿真超声波热压焊接过程,分析焊接温度与压力对焊接强度的影响。将仿真数据和试验数据比较,提出更优的加工工艺参数,以提高高g微阵列加速度传感器性能。
High-g accelerometer is used in many fields, especially in military field, accelerometer is adopted in fuse system to control the penetration missiles to explode in the setting floor, monitor the impact process of nuclear blasting, and test the shock overload during the missile penetrating target. In the recent years, it’s very important for the penetration missile with accelerometer which can measure high-g acceleration for the demand of penetrating hard target.
This thesis is based on a pre-research project,“A research of high-g micro-array accelerometer system”. This study is engaged in the mechanized reinforcement of high-g micro-array accelerometer system to finish one of the project technical index, which makes the accelerometer measure 1.5×105g~2.0×105g acceleration and insures the accelerometer work steadily with accurate signal. In this paper, there are four parts. Firstly, based on the analysis of packaging, new packaging forms are presented to achieve the technical index. After machining and testing new accelerometers, a good packaging form is determined.
Secondly, qualitatively analyze the factors which influent the welding strength of ultrasonic welding, four main factors are obtained, there are welding temperature, welding pressure, welding time and welding power. In this study, the relationship between welding strength and welding temperature and relationship between welding strength and welding pressure are concerned. Different machining process parameters are proposed. After machining and testing new accelerometers, an array optical machining parameters are obtained.
Thirdly, impact testing is adopted to test new accelerometers’properties. After testing and analyzing testing results, new packaging plan is proposed.
Lastly, ultrasonic welding process is simulated by using finite element method. And relationship between welding strength and welding temperature and relationship between welding strength and welding pressure are achieved. Comparing experimental results with simulation results, a better array machining process parameters is given to improve the high-g accelerometer’s properties.
本论文来源于预研项目“高g微阵列加速度传感系统技术研究”。本课题主要从事微阵列加速度传感系统的封装机械加固技术研究,从而完成高g微阵列加速度传感器技术研究中重要的技术指标——测量1.5×105g~2.0×105g加速度值,即加速度传感器在承受1.5×105g~2.0×105g的加速度冲击情况下,正常地工作并准确地输出信号。本论文研究内容包括如下四部分:
第一部分:分析传感器的封装外壳,为了达到项目指标,提出新的外壳封装形式,并进行加工试验,确定外壳封装形式;
第二部分:分析影响超声波热压焊接强度的因素,针对影响超声波热压焊接的主要四个工艺参数:焊接温度、焊接压力、焊接时间和超声功率,主要研究焊接温度与焊接压力对焊接强度之间的关系。通过分析,提出不同地工艺参数,进行加工试验,将加工好的传感器进行冲击试验,找出更佳的工艺参数;
第三部分:将加工好的传感器进行冲击试验,通过冲击试验结果测试传感器性能,并提出改进方案;
第四部分:通过有限元分析,模拟仿真超声波热压焊接过程,分析焊接温度与压力对焊接强度的影响。将仿真数据和试验数据比较,提出更优的加工工艺参数,以提高高g微阵列加速度传感器性能。
High-g accelerometer is used in many fields, especially in military field, accelerometer is adopted in fuse system to control the penetration missiles to explode in the setting floor, monitor the impact process of nuclear blasting, and test the shock overload during the missile penetrating target. In the recent years, it’s very important for the penetration missile with accelerometer which can measure high-g acceleration for the demand of penetrating hard target.
This thesis is based on a pre-research project,“A research of high-g micro-array accelerometer system”. This study is engaged in the mechanized reinforcement of high-g micro-array accelerometer system to finish one of the project technical index, which makes the accelerometer measure 1.5×105g~2.0×105g acceleration and insures the accelerometer work steadily with accurate signal. In this paper, there are four parts. Firstly, based on the analysis of packaging, new packaging forms are presented to achieve the technical index. After machining and testing new accelerometers, a good packaging form is determined.
Secondly, qualitatively analyze the factors which influent the welding strength of ultrasonic welding, four main factors are obtained, there are welding temperature, welding pressure, welding time and welding power. In this study, the relationship between welding strength and welding temperature and relationship between welding strength and welding pressure are concerned. Different machining process parameters are proposed. After machining and testing new accelerometers, an array optical machining parameters are obtained.
Thirdly, impact testing is adopted to test new accelerometers’properties. After testing and analyzing testing results, new packaging plan is proposed.
Lastly, ultrasonic welding process is simulated by using finite element method. And relationship between welding strength and welding temperature and relationship between welding strength and welding pressure are achieved. Comparing experimental results with simulation results, a better array machining process parameters is given to improve the high-g accelerometer’s properties.
引文
[1]宋萍,李科杰,石庚辰,等.高g值MEMS加速度传感器敏感元件的结构分析.探测与控制学报,2002,24(4):14
[2]石军霞,郝丽萍.国外钻地武器的技术特点及发展趋势.导弹与航天运载技术,2003(4):49-52
[3] VT Srikar, SD Senturia. The Design and Analysis of Shock Resistant Microsystems (MEMS). The 11th International Conference on Solid State Sensors and Actuators, 2001, 1370-1373
[4] Piezoresistive accelerometer model 7270A, Endevco technical data sheet, www.endevco.com
[5]蒋玉齐,罗乐.高量程MEMS加速度计封装研究:[博士学位论文].上海:中国科学院上海微系统与信息技术研究所,2004,27
[6]杨平.微电子设备与器件封装加固技术.北京:国防工业出版社,2005,316
[7]王长虹,金鸿章.阵列式硅压力加速度传感器研究:[硕士学位论文].哈尔滨:哈尔滨工程大学,2003
[8]孔德义,陶永春,梅涛,等.一种用于探测爆炸物微粒的MEMS敏感阵列.杭州:第五届全球智能控制与自动化大会,2004,3611-3614
[9]于晓梅,张大成,李婷,等.阵列式微机械悬臂梁的研制及其特性分析.半导体学报,2003,24(8):861-865
[10]于晓梅,张大成,王丛舜,等.U形阵列式微机械悬臂梁的研究.物理学报,2004, 53(1):31-36,
[11]陈鲁疆,熊继军.复合量程压阻式加速度传感器阵列的研究:[硕士学位论文].太原:中北大学,2006,12-13
[12] Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao. Transient Simulation of Wire Pull Test on Cu/Low-K Wafers. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29(3):631-638
[13] Yong Liu, Senior, Scott Irving, et al. Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31(1):61-71
[14] X.F.Ang, G.G.Zhang, J.Wei, et al. Temperature and pressure dependence inthermocompression gold stud bonding. Thin Solid Films 504, 2006, 379-383
[15] Tai-Ran Hsu.微机电系统封装(姚军译).北京:清华大学出版社,2006
[16]张艳凤,姜德龙.MEMS压阻式加速度传感器的研究:[硕士学位论文].长春:长春理工大学,2004,7
[17]林忠华,冯勇建.高量程微加速度传感器的研制:[硕士学位论文].厦门:厦门大学,2005,11-12
[18]石庚辰.微机电系统技术.北京:国防工业出版社,2002
[19]刘晓明,朱钟淦.微机电系统设计与制造.北京:国防工业出版社,2006
[20]上海科技在线学习:http://www.stcsm.gov.cn
[21]李炳乾,朱长纯,刘君华.微电子机械系统研究进展.国外电子元器件,2001(1):4-8
[22]徐小云,颜国正,丁国清.微电子系统(MEMS)及其应用研究.测控技术,2002,21(8):1-5
[23] L.T.Ngyugen. Reliability of Post molded IC Packages. Transactions of the ASME, Journal of Electronic Packaging, 1993, Vol.115:346-355
[24] A.Bossche, C.V.B.Cotofana, J.R.Molliger. MEMS Packaging: State of the art and future trends, 1998, Vol.3328:166-173
[25]凌科.全球微机电系统市场新轨迹.电子产品世界,1999(9):10-11
[26] Tai-Ran Hsu. Packaging Design of Microsystems and Meso-Scale Devices. IEEE Transaction on Advanced Packaging. 2000, 23(4):596-601
[27]李书军,高东岳.TAB封装工艺简介.微处理机,1995(1):43-45
[28]孟庆浩,尹志华.载带自动键合(TAB)引线技术.半导体杂志,1997,22(4):32-39
[29]张钦哉.倒装片及其封装技术的现状和趋向.电子与自动化,2000(1):12-13
[30]李福泉,王春青.倒装芯片凸点制作方法.电子工艺技术,2003,24(2):62-66
[31]杨文建,李小平.超细间距引线键合工艺的试验研究:[硕士学位论文].武汉:华中科技大学,2005,21
[32]徐慧,张忠典.铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性:[硕士学位论文].哈尔滨:哈尔滨工业大学,2006,16
[33] MaxumPLU超高速金球焊接机.http://www.knschina.com
[34]李俊哲.细间距封装技术发展与应用探讨电子产品世界.2003(3):63-65
[35] G.Myburg. Catching up to Flip Chip Technology. Connections Magazine, 2001, Vol.1:36
[36]金德宣,张小梅.微电子焊接与封装.电子科技大学,1993,17
[37]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响.中国机械工程.2005,16(10):919-923
[38]高荣芝,韩雷.键合压力对粗铝丝引线键合强度的实验研究.压电与声光,2007,29(3):366-369
[39]王福亮,李军辉,韩雷,等.键合时间对粗铝丝超声引线键合强度的影响.焊接学报,2006,27(5):47-51
[40]隆志力,韩雷,吴运新,等.温度因素对热超声键合强度的影响实验研究.封装测试技术,2005,30(6):41-44
[41] MEDDING J, MAYER M. In situ ball bond shear measurement using wire bonder head. IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium. 2003, 59-63
[42]杜黎光,罗乐.丝焊互连的高温可靠性和相关问题的研究:[博士学位论文].上海:中国科学院上海冶金所,2001,24-25
[43]单辉祖.材料力学(Ⅰ).北京:高等教育出版社.1999,194
[44]姜同川.正交试验设计.山东科学技术出版社,1985,106-114
[45]唐建平,卢芳云.霍普金森杆实验数据采集与数据处理程序设计:[硕士学位论文].合肥:国防科技大学,2002,6
[46]盛党红.标定高g值加速度传感器的方法.实用测试技术,1999(6):35
[47]王巍,张志杰.利用Hopkinson杆对高量程传感器进行校准的理论分析.科技情报开发与经济,2005,15(8):290
[48]顾永莲,杨邦朝.球栅阵列封装焊点的失效分析及热应力模拟:[硕士学位论文].成都:电子科技大学,2005,29-31
[49]倪栋,段进.通用有限元分析-ANSYS7.0实例分解.电子工业出版社,2003
[50]小飒工作室.最新经典ANSYS及Workbench教程.北京:电子工业出版社,2004,333
[2]石军霞,郝丽萍.国外钻地武器的技术特点及发展趋势.导弹与航天运载技术,2003(4):49-52
[3] VT Srikar, SD Senturia. The Design and Analysis of Shock Resistant Microsystems (MEMS). The 11th International Conference on Solid State Sensors and Actuators, 2001, 1370-1373
[4] Piezoresistive accelerometer model 7270A, Endevco technical data sheet, www.endevco.com
[5]蒋玉齐,罗乐.高量程MEMS加速度计封装研究:[博士学位论文].上海:中国科学院上海微系统与信息技术研究所,2004,27
[6]杨平.微电子设备与器件封装加固技术.北京:国防工业出版社,2005,316
[7]王长虹,金鸿章.阵列式硅压力加速度传感器研究:[硕士学位论文].哈尔滨:哈尔滨工程大学,2003
[8]孔德义,陶永春,梅涛,等.一种用于探测爆炸物微粒的MEMS敏感阵列.杭州:第五届全球智能控制与自动化大会,2004,3611-3614
[9]于晓梅,张大成,李婷,等.阵列式微机械悬臂梁的研制及其特性分析.半导体学报,2003,24(8):861-865
[10]于晓梅,张大成,王丛舜,等.U形阵列式微机械悬臂梁的研究.物理学报,2004, 53(1):31-36,
[11]陈鲁疆,熊继军.复合量程压阻式加速度传感器阵列的研究:[硕士学位论文].太原:中北大学,2006,12-13
[12] Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao. Transient Simulation of Wire Pull Test on Cu/Low-K Wafers. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29(3):631-638
[13] Yong Liu, Senior, Scott Irving, et al. Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31(1):61-71
[14] X.F.Ang, G.G.Zhang, J.Wei, et al. Temperature and pressure dependence inthermocompression gold stud bonding. Thin Solid Films 504, 2006, 379-383
[15] Tai-Ran Hsu.微机电系统封装(姚军译).北京:清华大学出版社,2006
[16]张艳凤,姜德龙.MEMS压阻式加速度传感器的研究:[硕士学位论文].长春:长春理工大学,2004,7
[17]林忠华,冯勇建.高量程微加速度传感器的研制:[硕士学位论文].厦门:厦门大学,2005,11-12
[18]石庚辰.微机电系统技术.北京:国防工业出版社,2002
[19]刘晓明,朱钟淦.微机电系统设计与制造.北京:国防工业出版社,2006
[20]上海科技在线学习:http://www.stcsm.gov.cn
[21]李炳乾,朱长纯,刘君华.微电子机械系统研究进展.国外电子元器件,2001(1):4-8
[22]徐小云,颜国正,丁国清.微电子系统(MEMS)及其应用研究.测控技术,2002,21(8):1-5
[23] L.T.Ngyugen. Reliability of Post molded IC Packages. Transactions of the ASME, Journal of Electronic Packaging, 1993, Vol.115:346-355
[24] A.Bossche, C.V.B.Cotofana, J.R.Molliger. MEMS Packaging: State of the art and future trends, 1998, Vol.3328:166-173
[25]凌科.全球微机电系统市场新轨迹.电子产品世界,1999(9):10-11
[26] Tai-Ran Hsu. Packaging Design of Microsystems and Meso-Scale Devices. IEEE Transaction on Advanced Packaging. 2000, 23(4):596-601
[27]李书军,高东岳.TAB封装工艺简介.微处理机,1995(1):43-45
[28]孟庆浩,尹志华.载带自动键合(TAB)引线技术.半导体杂志,1997,22(4):32-39
[29]张钦哉.倒装片及其封装技术的现状和趋向.电子与自动化,2000(1):12-13
[30]李福泉,王春青.倒装芯片凸点制作方法.电子工艺技术,2003,24(2):62-66
[31]杨文建,李小平.超细间距引线键合工艺的试验研究:[硕士学位论文].武汉:华中科技大学,2005,21
[32]徐慧,张忠典.铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性:[硕士学位论文].哈尔滨:哈尔滨工业大学,2006,16
[33] MaxumPLU超高速金球焊接机.http://www.knschina.com
[34]李俊哲.细间距封装技术发展与应用探讨电子产品世界.2003(3):63-65
[35] G.Myburg. Catching up to Flip Chip Technology. Connections Magazine, 2001, Vol.1:36
[36]金德宣,张小梅.微电子焊接与封装.电子科技大学,1993,17
[37]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响.中国机械工程.2005,16(10):919-923
[38]高荣芝,韩雷.键合压力对粗铝丝引线键合强度的实验研究.压电与声光,2007,29(3):366-369
[39]王福亮,李军辉,韩雷,等.键合时间对粗铝丝超声引线键合强度的影响.焊接学报,2006,27(5):47-51
[40]隆志力,韩雷,吴运新,等.温度因素对热超声键合强度的影响实验研究.封装测试技术,2005,30(6):41-44
[41] MEDDING J, MAYER M. In situ ball bond shear measurement using wire bonder head. IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium. 2003, 59-63
[42]杜黎光,罗乐.丝焊互连的高温可靠性和相关问题的研究:[博士学位论文].上海:中国科学院上海冶金所,2001,24-25
[43]单辉祖.材料力学(Ⅰ).北京:高等教育出版社.1999,194
[44]姜同川.正交试验设计.山东科学技术出版社,1985,106-114
[45]唐建平,卢芳云.霍普金森杆实验数据采集与数据处理程序设计:[硕士学位论文].合肥:国防科技大学,2002,6
[46]盛党红.标定高g值加速度传感器的方法.实用测试技术,1999(6):35
[47]王巍,张志杰.利用Hopkinson杆对高量程传感器进行校准的理论分析.科技情报开发与经济,2005,15(8):290
[48]顾永莲,杨邦朝.球栅阵列封装焊点的失效分析及热应力模拟:[硕士学位论文].成都:电子科技大学,2005,29-31
[49]倪栋,段进.通用有限元分析-ANSYS7.0实例分解.电子工业出版社,2003
[50]小飒工作室.最新经典ANSYS及Workbench教程.北京:电子工业出版社,2004,333