磁头臂组件封装的全自动钎焊设备研制
摘要
随着硬盘在信息产业中的重要性的空前提升和微电子技术的不断发展,硬盘的各种性能指标得到了不断提高,作为硬盘的重要组成部分,HSA磁头臂组件在生产中以人工焊接G-Pin/VC-Pin导通磁头和软线路板的技术不能满足硬盘生产效率的要求,迫切需要改造和换代,企业迫切需要开发一种新的满足磁头臂组件微焊接问题要求的自动化钎焊设备。
目前在国内外市场上用于HSA导通磁头和软线路板工序的自动化设备才刚刚起步,有关研究也尚未见报道。本文从选取焊接方式着手,选取采用软钎焊技术并提出磁头臂组件全自动钎焊机的研制要求,研究一种低成本、高效率的HSA全自动钎焊机。HSA全自动钎焊机的系统组成包括运动定位功能模块、视觉对准获取模块、激光加工控制模块、用户交互四个功能模块。
进行了产品样机的结构设计,详细研究分析机构设计原理和结构实现并在全自动钎焊机CAD设计工程中运用参数化设计思想。
对焊接关键部位焊嘴和质量影响主要因素锡球进行了热力分析,根据焊接过程非线性的特点,确定基本的求解方法;本文对关键加工工艺部位焊嘴进行热力分析,利用MARC软件进行热力计算分析。
最后实验数据对优化激光焊接的工艺参数,提高焊接质量有着积极的参考意义。通过模拟和实验的手段找出优化锡球钎焊的方法,分析影响锡球焊接质量的因素,并从工艺实验中验证改进效果,达到改进焊接效果的目的。
With the importance of the unprecedented improvement and continuous development of the hard drive in microelectronic technology, the various performance indicators of the hard drive has been continuously improved. As an important component of the hard disk, The technology of the artificial soldering G-Pin/VC-Pin turn heads and soft circuit board in HSA production can not meet the requirements of efficiency in the hard disk production. An urgent need to transform and regenerate, and the urgent need for businesses to develop a new micro-welding problem to meet the HSA requirements of automated soldering equipment.
The main thesis include:SMT discussed in detail the development of a comprehensive overview of laser technology and its classification and the subject of soldering techniques used in the selection of proposed development of HSA automatic brazing machine requirements.HSA is designed automatic soldering machine's overall program to study the JSBB technical principles and HSA automatic brazing machine motion positioning system consists of functional modules, visual alignment acquisition module, laser processing control module, user interaction four functional blocks. Carried out the structural design of the product prototype, discusses parametric design ideas in HSA automatic soldering machine in the use of CAD design engineering.
The key parts of the soldering nozzle soldering and quality of the main factors affecting solder ball thermal analysis carried out, based on the soldering geometrical nonlinearity, material nonlinearity and deformation characteristics of non-linear analysis to determine the basic solution method; In this paper, the key to Processing part of welding nozzle for coupled thermo-mechanical analysis, using MARC software coupled thermo-mechanical analysis of a mathematical model calculations, boundary conditions, carried out analysis of heat conduction and thermal stress analysis.
This thesis analyzes the impact of solder ball welding quality factors, through simulation and experiment to find the means to optimize the solder ball soldering method, and have been verified by experiment from the process to improve results, achieving the purpose of improving the welding effect.
目前在国内外市场上用于HSA导通磁头和软线路板工序的自动化设备才刚刚起步,有关研究也尚未见报道。本文从选取焊接方式着手,选取采用软钎焊技术并提出磁头臂组件全自动钎焊机的研制要求,研究一种低成本、高效率的HSA全自动钎焊机。HSA全自动钎焊机的系统组成包括运动定位功能模块、视觉对准获取模块、激光加工控制模块、用户交互四个功能模块。
进行了产品样机的结构设计,详细研究分析机构设计原理和结构实现并在全自动钎焊机CAD设计工程中运用参数化设计思想。
对焊接关键部位焊嘴和质量影响主要因素锡球进行了热力分析,根据焊接过程非线性的特点,确定基本的求解方法;本文对关键加工工艺部位焊嘴进行热力分析,利用MARC软件进行热力计算分析。
最后实验数据对优化激光焊接的工艺参数,提高焊接质量有着积极的参考意义。通过模拟和实验的手段找出优化锡球钎焊的方法,分析影响锡球焊接质量的因素,并从工艺实验中验证改进效果,达到改进焊接效果的目的。
With the importance of the unprecedented improvement and continuous development of the hard drive in microelectronic technology, the various performance indicators of the hard drive has been continuously improved. As an important component of the hard disk, The technology of the artificial soldering G-Pin/VC-Pin turn heads and soft circuit board in HSA production can not meet the requirements of efficiency in the hard disk production. An urgent need to transform and regenerate, and the urgent need for businesses to develop a new micro-welding problem to meet the HSA requirements of automated soldering equipment.
The main thesis include:SMT discussed in detail the development of a comprehensive overview of laser technology and its classification and the subject of soldering techniques used in the selection of proposed development of HSA automatic brazing machine requirements.HSA is designed automatic soldering machine's overall program to study the JSBB technical principles and HSA automatic brazing machine motion positioning system consists of functional modules, visual alignment acquisition module, laser processing control module, user interaction four functional blocks. Carried out the structural design of the product prototype, discusses parametric design ideas in HSA automatic soldering machine in the use of CAD design engineering.
The key parts of the soldering nozzle soldering and quality of the main factors affecting solder ball thermal analysis carried out, based on the soldering geometrical nonlinearity, material nonlinearity and deformation characteristics of non-linear analysis to determine the basic solution method; In this paper, the key to Processing part of welding nozzle for coupled thermo-mechanical analysis, using MARC software coupled thermo-mechanical analysis of a mathematical model calculations, boundary conditions, carried out analysis of heat conduction and thermal stress analysis.
This thesis analyzes the impact of solder ball welding quality factors, through simulation and experiment to find the means to optimize the solder ball soldering method, and have been verified by experiment from the process to improve results, achieving the purpose of improving the welding effect.
引文
1 Stauffera L.Wurscha A,Gachtera B.A Surface-mounted Device Assembly Technique for Small Optics Based on Laser Reflow Soldering.Optics and Lasers in Engineering. 2005, 43(4):365~372
2 Gillner A, Holtkamp J,Hartmann C, et al.Laser Applications in Microtechnology. Journal of Material Processing Technology.2005, 167(3):494~498
3 Flanagan A, Conneely A, Glynn TJ, et al. Laser soldering and Inspection of Fine Pitch Electronic Components.Journal of Material Processing Technology.1996,56(3):531~541
4周振丰.焊接冶金与金属焊接性.机械工业出版社.1987:48~52
5 J.H. Lau, K.-L.Chen. Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball G rid Array Package Journalof Electronic Packaging, ASME,1997
6 Polijanczuk, A.V, Whitehead, D.G,“Semiconductor Lasers for Microsoldering,”IEEE Colloquium on Advances in Interconnection Technology, London, Apr. 1991:6/1~6/4
7 Laferriere. P., Fukumoto. A.,Laser-diode Based Soldering System with VisionCapabilities, 17th IEEE Electronics Manufacturing Technology Symposium, Austin, TX,Oct. 1995:324~328
8 Laser Solder Ball Jet System SB2-Jet, Pac Tech Brochure
9孔祥谦.热应力有限单元法分析.上海:上海交通大学出版社,1999:21~23
10 I.Harari, S.Frey, L.P.Franca.A note on a recent study of stabilized finite element computation for heat conduction.Computational Mechanics, 2002, 28(1):63~65
11 Cannarozzi A A. A mixed variational method for linear coupled thermoelastic analysis. Int. J. Solids Struct. 2001 , 38:717～739
12 Altay A. Some variational principles for linear coupled thremoelasticity. Int. J.Solids Struct. ,1996,33 3 937～3 948
13 Atkinson C. Exact solution of a Model Problem for the Coupled Thermoelastic equation with non2small tempera2 ture changes. J.Thermal Stress., 1991, 14:215～225
14 Zienjiewicz. The finite element method in structural and continuum mechanicsNew York : McGraw - Hill Book Co. , 1967.
15武传松.焊接热过程数值分析.哈尔滨工业大学出版社, 1990:25~34:19~21
16陈楚.数值分析在焊接中的应用.上海交通大学出版社, 1985:80~82:27~32
17林得超.焊接过程应力应变特征及其控制的数值模拟.西安交通大学博士学位论文. 1997:23~25
18陈楚,汪建华,杨洪庆.非线性焊接热传导的有限元分析和计算.焊接学报. 1983, (3):139~148
19田艳红,王春青.料球激光重熔温度数值模拟.焊接学报. 2001, 22(2):75~78
20田艳红,王春青.微电子封装与组装中的再流焊技术研究进展.焊接. 2002, (6):5~9
21王洪纲.热弹性力学概论.北京:清华大学出版社,1988:57~60
22 Parida J , Das A K. Thermal stress in a thin circular disc of orthotropic material due to an instantaneous point heat source. Acta Mechanica , 1972 , 13 (3):205～214
23 Sugano Y. Transient Thermal stresses in a transversely isotropic finite circular cylinder due to an arbitrary internal heat generation. Int J Engng Sci, 1979, 17(8):927～939
24 Kardomateas G A. Transient thermal stresses in cylindrically orthotropic composite tubes. Journal of Applied Mechanics, 1989, 56(2):411～417
25 Kardomateas GA. The initial phase of transient thermal stresses due to generaboundary thermal loads in orthotropic hollow cylinders. Journal of Applied Mechanics , 1990 , 57 (3):719～724
26 Noda N , Shiznoka , Ashida F. A three2dimensional treatment of transient thermal stresses in a transversely isotropic semi2infinite circular cylinder subjected to an asymmetric temperature on the cylindrical surface , Acta Mechanica,1986 , 58 (3):75～191
27 Ho C H. Stress focusing effect in a uniformly heated cylindrical rod. Journal of Applied Mechanics , 1976 , 43 (3):64～468
28沈毅.三维曲面插值在发动机涡轮叶片有限元温度场计算中的应用.航空发动机,2002.(2):43~45
29周继烈,程耀东.结构陶瓷激光加工的热应力分析.浙江大学学报,2004,38(9)sept.29~31
30李胜袛,二辊斜轧实心圆管坯三维有限元分析及中心孔腔形成机制.金属学报,1999(12):1277~1279
31 Cho H , Kardomateas GA , Valle C S. Elastodynamic solution for thethermalshock stresses in an orthotropic thick cylindrical shell. Journal of Applied Mechanics , 1998 , 65 (1):84～192
32 Ding H J , Wang H M, Chen WQ. A theoretical solution of cylindrically isotropic cylindrical tube for axisymmetric plane strain dynamic thermoelastic problem. ACTA Mechanica Solida Sinica , 2001 , 14 (4):57～363
33 I.Fidan,R.Kraft. Inline Troubleshooting for Electronics Manufacturing Systems. Proceedings of the 2000 IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium.2000,10:38~343
34 I.Fidan. The Design, Implementation, and Performance Analysis of a Prototype SMD Automated Rework Cell. Ph.D Thesis, Rensselaer Polytechnic Institute. 1996,7:23~134
35 I. Fidan, S. Derby. Surface-Mount Rework Operations. Circuits Assembly. 1995,6(7):6~38
36 I.Fidan, R. Kraft, L. Ruff, and S. Derby. Designed Experiments to Investigate the Solder Joint Quality Output of a prototype Automated Surface Mount Replacement System. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 1998,6:72~182
37 J. Pan, G. L. Tonkay. Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch QFP. Proceedings of the 24th IEEE/CPMT international Electronics Manufacturing Technology Symposium. 1999, 10:94~101
38 K. Oyama. Overview of Placement and Bonding Technology for 1005 Components and 3mm-pitch LSIs: an Equipment Perspective. Surface Mount Technology Recent Japanese Development, IEEE Press. 1993,7:77~108
39 J. Lyman. Surface-Mounted Placement Software. Electronic Design. 1989,4:104~105
40 B. Derdall. Surface Mount Automated Rework Tool. NEPCON West Proceedings. 1991,3:1313~1317
41 Rao Srinivas. Obstacles to CSP Assembly. Circuits Assembly. 1998.4:44~50
42 Y. L. Wang, Z. H. Xiong, X. J. Zou, H. Ding, Experimental Optimization of Process Parameters for Diode Laser Soldering of BGA, IEEE CPMT International Conference on High Density Micro-system Design, Packaging and Component Failure Analysis, Shanghai, June, 2006, 171-176
43吴嘉诚.制造业六西格玛应用手册.中国人民大学出版社,2004:10~12
44 Katsuji, Takasu. Automated SMT Process Development for CSP. The TechnicalConference at Chip Scale International 98. 1998,5:115~120
45 Katsuji, Takasu. Machine Accuracy Assessment for Advanced Package Replacement. NEPCON West. 1999,2:21~25
46 Katsuji, Takasu. CSP Self-Centering Assessment Using Offset Normalization Methodology. Journal of Surface Mount Technology. 1999,7:27~33
2 Gillner A, Holtkamp J,Hartmann C, et al.Laser Applications in Microtechnology. Journal of Material Processing Technology.2005, 167(3):494~498
3 Flanagan A, Conneely A, Glynn TJ, et al. Laser soldering and Inspection of Fine Pitch Electronic Components.Journal of Material Processing Technology.1996,56(3):531~541
4周振丰.焊接冶金与金属焊接性.机械工业出版社.1987:48~52
5 J.H. Lau, K.-L.Chen. Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball G rid Array Package Journalof Electronic Packaging, ASME,1997
6 Polijanczuk, A.V, Whitehead, D.G,“Semiconductor Lasers for Microsoldering,”IEEE Colloquium on Advances in Interconnection Technology, London, Apr. 1991:6/1~6/4
7 Laferriere. P., Fukumoto. A.,Laser-diode Based Soldering System with VisionCapabilities, 17th IEEE Electronics Manufacturing Technology Symposium, Austin, TX,Oct. 1995:324~328
8 Laser Solder Ball Jet System SB2-Jet, Pac Tech Brochure
9孔祥谦.热应力有限单元法分析.上海:上海交通大学出版社,1999:21~23
10 I.Harari, S.Frey, L.P.Franca.A note on a recent study of stabilized finite element computation for heat conduction.Computational Mechanics, 2002, 28(1):63~65
11 Cannarozzi A A. A mixed variational method for linear coupled thermoelastic analysis. Int. J. Solids Struct. 2001 , 38:717～739
12 Altay A. Some variational principles for linear coupled thremoelasticity. Int. J.Solids Struct. ,1996,33 3 937～3 948
13 Atkinson C. Exact solution of a Model Problem for the Coupled Thermoelastic equation with non2small tempera2 ture changes. J.Thermal Stress., 1991, 14:215～225
14 Zienjiewicz. The finite element method in structural and continuum mechanicsNew York : McGraw - Hill Book Co. , 1967.
15武传松.焊接热过程数值分析.哈尔滨工业大学出版社, 1990:25~34:19~21
16陈楚.数值分析在焊接中的应用.上海交通大学出版社, 1985:80~82:27~32
17林得超.焊接过程应力应变特征及其控制的数值模拟.西安交通大学博士学位论文. 1997:23~25
18陈楚,汪建华,杨洪庆.非线性焊接热传导的有限元分析和计算.焊接学报. 1983, (3):139~148
19田艳红,王春青.料球激光重熔温度数值模拟.焊接学报. 2001, 22(2):75~78
20田艳红,王春青.微电子封装与组装中的再流焊技术研究进展.焊接. 2002, (6):5~9
21王洪纲.热弹性力学概论.北京:清华大学出版社,1988:57~60
22 Parida J , Das A K. Thermal stress in a thin circular disc of orthotropic material due to an instantaneous point heat source. Acta Mechanica , 1972 , 13 (3):205～214
23 Sugano Y. Transient Thermal stresses in a transversely isotropic finite circular cylinder due to an arbitrary internal heat generation. Int J Engng Sci, 1979, 17(8):927～939
24 Kardomateas G A. Transient thermal stresses in cylindrically orthotropic composite tubes. Journal of Applied Mechanics, 1989, 56(2):411～417
25 Kardomateas GA. The initial phase of transient thermal stresses due to generaboundary thermal loads in orthotropic hollow cylinders. Journal of Applied Mechanics , 1990 , 57 (3):719～724
26 Noda N , Shiznoka , Ashida F. A three2dimensional treatment of transient thermal stresses in a transversely isotropic semi2infinite circular cylinder subjected to an asymmetric temperature on the cylindrical surface , Acta Mechanica,1986 , 58 (3):75～191
27 Ho C H. Stress focusing effect in a uniformly heated cylindrical rod. Journal of Applied Mechanics , 1976 , 43 (3):64～468
28沈毅.三维曲面插值在发动机涡轮叶片有限元温度场计算中的应用.航空发动机,2002.(2):43~45
29周继烈,程耀东.结构陶瓷激光加工的热应力分析.浙江大学学报,2004,38(9)sept.29~31
30李胜袛,二辊斜轧实心圆管坯三维有限元分析及中心孔腔形成机制.金属学报,1999(12):1277~1279
31 Cho H , Kardomateas GA , Valle C S. Elastodynamic solution for thethermalshock stresses in an orthotropic thick cylindrical shell. Journal of Applied Mechanics , 1998 , 65 (1):84～192
32 Ding H J , Wang H M, Chen WQ. A theoretical solution of cylindrically isotropic cylindrical tube for axisymmetric plane strain dynamic thermoelastic problem. ACTA Mechanica Solida Sinica , 2001 , 14 (4):57～363
33 I.Fidan,R.Kraft. Inline Troubleshooting for Electronics Manufacturing Systems. Proceedings of the 2000 IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium.2000,10:38~343
34 I.Fidan. The Design, Implementation, and Performance Analysis of a Prototype SMD Automated Rework Cell. Ph.D Thesis, Rensselaer Polytechnic Institute. 1996,7:23~134
35 I. Fidan, S. Derby. Surface-Mount Rework Operations. Circuits Assembly. 1995,6(7):6~38
36 I.Fidan, R. Kraft, L. Ruff, and S. Derby. Designed Experiments to Investigate the Solder Joint Quality Output of a prototype Automated Surface Mount Replacement System. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 1998,6:72~182
37 J. Pan, G. L. Tonkay. Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch QFP. Proceedings of the 24th IEEE/CPMT international Electronics Manufacturing Technology Symposium. 1999, 10:94~101
38 K. Oyama. Overview of Placement and Bonding Technology for 1005 Components and 3mm-pitch LSIs: an Equipment Perspective. Surface Mount Technology Recent Japanese Development, IEEE Press. 1993,7:77~108
39 J. Lyman. Surface-Mounted Placement Software. Electronic Design. 1989,4:104~105
40 B. Derdall. Surface Mount Automated Rework Tool. NEPCON West Proceedings. 1991,3:1313~1317
41 Rao Srinivas. Obstacles to CSP Assembly. Circuits Assembly. 1998.4:44~50
42 Y. L. Wang, Z. H. Xiong, X. J. Zou, H. Ding, Experimental Optimization of Process Parameters for Diode Laser Soldering of BGA, IEEE CPMT International Conference on High Density Micro-system Design, Packaging and Component Failure Analysis, Shanghai, June, 2006, 171-176
43吴嘉诚.制造业六西格玛应用手册.中国人民大学出版社,2004:10~12
44 Katsuji, Takasu. Automated SMT Process Development for CSP. The TechnicalConference at Chip Scale International 98. 1998,5:115~120
45 Katsuji, Takasu. Machine Accuracy Assessment for Advanced Package Replacement. NEPCON West. 1999,2:21~25
46 Katsuji, Takasu. CSP Self-Centering Assessment Using Offset Normalization Methodology. Journal of Surface Mount Technology. 1999,7:27~33