超声激振的倒装焊缺陷诊断关键技术研究
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摘要
倒装焊作为一种应用广泛的微电子封装技术，具有对准精度高、互连线短、输入输出密度高等优势，是减小封装体积、提高封装密度的重要手段。随着倒装焊技术向高密度、微细间距发展，尺度效应和表面效应将更加明显，而无铅材料的引入也会使材料的热/应力失配更加严重，更易引起应力集中和损伤累积，导致焊点缺陷产生。加之倒装焊焊点隐藏在芯片和基底之间，微小焊点上的缺陷诊断也更为困难。为此，本论文以倒装焊焊点缺失、虚焊和裂纹等典型缺陷为研究对象，运用超声激振方法，对其缺陷诊断的关键技术进行了研究。具体内容如下：
针对倒装焊芯片焊点缺失，建立了薄板-弹簧理论模型，通过理论计算揭示了焊点缺失芯片的共振频率小于无缺陷芯片，且芯片共振频率会随焊点缺失数量增加而减小的规律。以COMSOL为工具，构建了倒装芯片的有限元模型，验证了焊点缺失会导致芯片共振频率下降的规律，并进一步揭示了焊点缺失处的振动速度会大于无缺陷处的现象，而这种振动速度的差异可以通过特征系数α来表征。基于空气耦合超声激励和激光多普勒测振原理，搭建了倒装焊缺陷检测系统，制作了具有焊点缺失缺陷的倒装芯片，并运用缺陷检测系统对其进行检测，实验结果证明利用芯片的共振频率可以识别倒装焊芯片是否存在焊点缺失缺陷，而缺陷的具体位置则可通过芯片的振动速度来确定。
针对倒装焊芯片虚焊缺陷，建立了相应的倒装芯片模型，通过有限元方法对芯片的模态特征进行了仿真分析，揭示了虚焊芯片与无缺陷芯片在模态振型和共振频率上的差异。利用缺陷检测系统，对倒装芯片在超声激励下的实时振动进行了测量，证明了虚焊产生会引起芯片模态振型的变化和共振频率的降低。对虚焊点和无缺陷点的速度频谱进行研究，发现虚焊缺陷会使芯片振动能量的分布发生变化，并可以利用频谱的均方根频率来表征。因此，通过倒装芯片的模态特征，如模态振型、共振频率可以识别倒装焊芯片是否存在虚焊缺陷，而缺陷的具体位置则可通过芯片的速度频谱及其均方根频率来确定。
采用热循环和加热加压方法，在倒装焊芯片焊点中引入裂纹缺陷进行研究。通过模态分析，揭示了裂纹芯片与无缺陷芯片在模态振型上的差异，该差异可以由振型图像特征如高宽比、特征角来表征。同时，提取芯片共振频率进行分析，发现裂纹产生会引起芯片共振频率的下降，证明了倒装焊焊点裂纹可以通过芯片模态特征如模态振型、共振频率来识别。进一步，利用LMD方法对裂纹焊点的振动信号进行分析，证明了裂纹点与无缺陷点平均包络谱的差异可以用形状因子来表征，而倒装焊裂纹焊点位置则可通过PF分量平均包络谱的差异来确定，从而实现裂纹焊点的定位。
本论文将超声激励和振动分析相结合，应用于倒装焊缺陷诊断的关键技术研究，实现了焊点典型缺陷的识别与定位。后续将进一步研究检测系统的改进、混合复杂缺陷的识别分类以及信号分析处理等，以完善缺陷诊断技术，实现倒装焊的在线检测。
Flip chip is a favourable interconnection technology for microelectronic packaging. Withthe advantage of preferable alignment accuracy, short interconnection lines and high I/Odensity, flip chip technology has been widely used to promote signal transmission speed anddecrease package volume. As flip chip technology trends to high density and fine pitch, scaleeffects and surface effects will be more noticeable and thermal/stress mismatch betweenmaterials will be more deteriorating, which can cause stress concentration and damageaccumulation, inducing the solder joint defects. In addition, the flip chip solder joints arehidden between the chip and substrate. It makes the solder joint fault diagnosis to be moredifficult. To overcome this difficulty, in this dissertation the key technologies of faultdiagnosis are researched for the typical defects of flip chip solder joints, such as missingsolder joint, open solder joint and crack. The main research contents are described as follows.
To diagnose the missing solder joint defect, a sheet-springs theoretical model wasestablished. By calculating this model, it finds that the resonance frequencies of chips withmissing solder joints are smaller than the good chips, and the chip resonance frequenciesdecrease with the increase of missing solder joints. The flip chip finite element model wasconstructed by the COMSOL software. The finite element simulation analysis validates thatmissing solder joint induce the chip resonance frequency to decrease, and reveals thevibration velocity of missing solder joint location is large than the vibration velocity of non-defective location. This difference on vibration velocity can be represented by the featurecoefficient α. Based on the air-coupled ultrasonic excitation and laser Doppler vibrationmeasurement, the flip chip defect inspection system was constructed. The missing solderjoint defects were introduced to test chips by removing solder joints before bonding. Thesechips were inspected applying the flip chip defect inspection system. The inspection resultsdemonstrate that the missing solder joint defect can be recognized by the chip resonancefrequency, and the defect location can be located through the chip vibration velocity.
For the typical defect of open solder joint, the simulation model of flip chip with opensolder joint was established. The chip modal features were studied by simulation analysis,revealing the differences on modal shapes and resonance frequencies between the defectivechip and good chip. In the experimental investigation, the chip transient vibration underultrasonic excitation was measured by the defect inspection system. The experiment resultsprove that the occurrence of open solder joint in the flip chip is the source of the modalshape variation and resonance frequency decrease. Furthermore, the velocity spectrum of open solder joint site and non-defective site were investigated. It is found that the opensolder joints cause the distribution of chip vibration energy to change, which can berepresented by the root mean square frequency(RMSF) of spectrum. Therefore, the opensolder joint defect can be distinguished through the chip modal features, such as modalshapes and resonance frequencies, and the defect site can be located by the chip vibrationspectrum with its RMSF.
Cracks were introduced to flip chip solder joints by virtue of thermal cycling and addingpressure with heating. The flip chips with crack defects were investigated through modalanalysis, revealing the modal shape difference between cracks chip and good chip, whichcan be represented by the features of modal shape image, such as aspect ratio andcharacteristic angle. At the same time, the chip resonance frequencies were extracted foranalysis, finding that the cracks cause the chip resonance frequencies to decrease. Itdemonstrates that the cracks of solder joints can be recognized by the chip modal features,such as modal shape and resonance frequency. Then the vibration signals of crack solderjoints were analyzed applying LMD method. The analysis results prove that the averageenvelope spectrum differences of PF components between crack location and non-defectivelocation can be expressed by Shape Factor to determinate the crack solder joint location.
This thesis combines ultrasonic excitation and vibration analysis to the key technologyresearch of flip chip solder joint fault diagnosis, achieving the recognition and locating oftypical defects. In the future work, the researches on the improvement of experiment system,the recognition and classification of mixed defects, and the analysis of complex vibrationresponse signal are required to optimize the diagnosis method and achieve the developmentof flip chip online inspection system.
针对倒装焊芯片焊点缺失，建立了薄板-弹簧理论模型，通过理论计算揭示了焊点缺失芯片的共振频率小于无缺陷芯片，且芯片共振频率会随焊点缺失数量增加而减小的规律。以COMSOL为工具，构建了倒装芯片的有限元模型，验证了焊点缺失会导致芯片共振频率下降的规律，并进一步揭示了焊点缺失处的振动速度会大于无缺陷处的现象，而这种振动速度的差异可以通过特征系数α来表征。基于空气耦合超声激励和激光多普勒测振原理，搭建了倒装焊缺陷检测系统，制作了具有焊点缺失缺陷的倒装芯片，并运用缺陷检测系统对其进行检测，实验结果证明利用芯片的共振频率可以识别倒装焊芯片是否存在焊点缺失缺陷，而缺陷的具体位置则可通过芯片的振动速度来确定。
针对倒装焊芯片虚焊缺陷，建立了相应的倒装芯片模型，通过有限元方法对芯片的模态特征进行了仿真分析，揭示了虚焊芯片与无缺陷芯片在模态振型和共振频率上的差异。利用缺陷检测系统，对倒装芯片在超声激励下的实时振动进行了测量，证明了虚焊产生会引起芯片模态振型的变化和共振频率的降低。对虚焊点和无缺陷点的速度频谱进行研究，发现虚焊缺陷会使芯片振动能量的分布发生变化，并可以利用频谱的均方根频率来表征。因此，通过倒装芯片的模态特征，如模态振型、共振频率可以识别倒装焊芯片是否存在虚焊缺陷，而缺陷的具体位置则可通过芯片的速度频谱及其均方根频率来确定。
采用热循环和加热加压方法，在倒装焊芯片焊点中引入裂纹缺陷进行研究。通过模态分析，揭示了裂纹芯片与无缺陷芯片在模态振型上的差异，该差异可以由振型图像特征如高宽比、特征角来表征。同时，提取芯片共振频率进行分析，发现裂纹产生会引起芯片共振频率的下降，证明了倒装焊焊点裂纹可以通过芯片模态特征如模态振型、共振频率来识别。进一步，利用LMD方法对裂纹焊点的振动信号进行分析，证明了裂纹点与无缺陷点平均包络谱的差异可以用形状因子来表征，而倒装焊裂纹焊点位置则可通过PF分量平均包络谱的差异来确定，从而实现裂纹焊点的定位。
本论文将超声激励和振动分析相结合，应用于倒装焊缺陷诊断的关键技术研究，实现了焊点典型缺陷的识别与定位。后续将进一步研究检测系统的改进、混合复杂缺陷的识别分类以及信号分析处理等，以完善缺陷诊断技术，实现倒装焊的在线检测。
Flip chip is a favourable interconnection technology for microelectronic packaging. Withthe advantage of preferable alignment accuracy, short interconnection lines and high I/Odensity, flip chip technology has been widely used to promote signal transmission speed anddecrease package volume. As flip chip technology trends to high density and fine pitch, scaleeffects and surface effects will be more noticeable and thermal/stress mismatch betweenmaterials will be more deteriorating, which can cause stress concentration and damageaccumulation, inducing the solder joint defects. In addition, the flip chip solder joints arehidden between the chip and substrate. It makes the solder joint fault diagnosis to be moredifficult. To overcome this difficulty, in this dissertation the key technologies of faultdiagnosis are researched for the typical defects of flip chip solder joints, such as missingsolder joint, open solder joint and crack. The main research contents are described as follows.
To diagnose the missing solder joint defect, a sheet-springs theoretical model wasestablished. By calculating this model, it finds that the resonance frequencies of chips withmissing solder joints are smaller than the good chips, and the chip resonance frequenciesdecrease with the increase of missing solder joints. The flip chip finite element model wasconstructed by the COMSOL software. The finite element simulation analysis validates thatmissing solder joint induce the chip resonance frequency to decrease, and reveals thevibration velocity of missing solder joint location is large than the vibration velocity of non-defective location. This difference on vibration velocity can be represented by the featurecoefficient α. Based on the air-coupled ultrasonic excitation and laser Doppler vibrationmeasurement, the flip chip defect inspection system was constructed. The missing solderjoint defects were introduced to test chips by removing solder joints before bonding. Thesechips were inspected applying the flip chip defect inspection system. The inspection resultsdemonstrate that the missing solder joint defect can be recognized by the chip resonancefrequency, and the defect location can be located through the chip vibration velocity.
For the typical defect of open solder joint, the simulation model of flip chip with opensolder joint was established. The chip modal features were studied by simulation analysis,revealing the differences on modal shapes and resonance frequencies between the defectivechip and good chip. In the experimental investigation, the chip transient vibration underultrasonic excitation was measured by the defect inspection system. The experiment resultsprove that the occurrence of open solder joint in the flip chip is the source of the modalshape variation and resonance frequency decrease. Furthermore, the velocity spectrum of open solder joint site and non-defective site were investigated. It is found that the opensolder joints cause the distribution of chip vibration energy to change, which can berepresented by the root mean square frequency(RMSF) of spectrum. Therefore, the opensolder joint defect can be distinguished through the chip modal features, such as modalshapes and resonance frequencies, and the defect site can be located by the chip vibrationspectrum with its RMSF.
Cracks were introduced to flip chip solder joints by virtue of thermal cycling and addingpressure with heating. The flip chips with crack defects were investigated through modalanalysis, revealing the modal shape difference between cracks chip and good chip, whichcan be represented by the features of modal shape image, such as aspect ratio andcharacteristic angle. At the same time, the chip resonance frequencies were extracted foranalysis, finding that the cracks cause the chip resonance frequencies to decrease. Itdemonstrates that the cracks of solder joints can be recognized by the chip modal features,such as modal shape and resonance frequency. Then the vibration signals of crack solderjoints were analyzed applying LMD method. The analysis results prove that the averageenvelope spectrum differences of PF components between crack location and non-defectivelocation can be expressed by Shape Factor to determinate the crack solder joint location.
This thesis combines ultrasonic excitation and vibration analysis to the key technologyresearch of flip chip solder joint fault diagnosis, achieving the recognition and locating oftypical defects. In the future work, the researches on the improvement of experiment system,the recognition and classification of mixed defects, and the analysis of complex vibrationresponse signal are required to optimize the diagnosis method and achieve the developmentof flip chip online inspection system.
引文
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