FDM温度控制系统的硬件结构设计
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摘要
当前快速成形(RP)技术领域,基于喷射技术的“新一代RP技术”已经取代基于激光技术的“传统的RP技术”成为了主流;快速制造的概念已经提出并得到了广泛地使用。熔融沉积成型(FDM)就是当前使用最广泛的一种基于喷射技术的RP技术。
本文主要对FDM温度控制系统进行了深入的分析和研究。温度测控在食品卫生、医疗化工等工业领域具有广泛的应用。随着传感器技术、微电子技术、单片机技术的不断发展,为智能温度测控系统测控功能的完善、测控精度的提高和抗干扰能力的增强等提供了条件。本系统采用的AT89C52单片机是一高性能的8位机,具有丰富的硬件资源和非常强的抗干扰能力,特别适合构成智能测控仪表和工业测控系统。本系统对AT89C52单片机硬件资源进行了开发,采用集成温度传感器AD590实现对温度信号的检测,充分利用单片机的硬件资源,以非常小的硬件投入,实现了对温度信号的精确检测与控制。
文中首先阐述了温度控制的必要性,温度是工业对象中的主要被控参数之一,在冶金、化工、机械、食品等各类工业中,广泛使用各种加热炉、烘箱、恒温箱等,它们均需对温度进行控制,成型室及喷头温度对成型件精度都有很大影响。然后详细讲解了所设计的可控硅调功温度控制系统,系统采用AT89C52单片机作微控制器构建数字温度控制器,调节双向可控硅的导通角,控制电压波形,实现负载两端有效电压可变,以控制加热棒的加热功率,使温度保持在设定值。系统主要包括:数据的采集,处理,输出,系统和上位机的通讯,人机交互部分。该系统成本低,精度高,实现方便。
该系统加热器温度控制采用模糊PID控制。模糊PID控制的采用能够在控制过程中根据预先设定好的控制规律不停地自动调整控制量以使被控系统朝着设定的平衡状态过渡。
In the present field of Rapid Prototyping, the "New RP Technology" based on jetting technology is replacing the "Conventional RP Technology" based on laser technology as the mainstream of the Rapid Prototyping Technology. Fused Deposition Modeling (FDM) is the most popular Rapid Prototyping technology based on jetting technology.
This paper mainly does research deeply on the temperature control system of FDM system. Temperature controlling is widely to food, sanitation, medical treatment, chemistry and industry. Along with the development of sensor technology, micro-electronics technology and singlechip technolog, brainpower temperature controlling system is perfected, precision of measurement and controlling is enhanced and the ability of anti-jamming is swelled. Singlechip AT89C52 in this paper is a high-powered 8-bit chip. It has plenty of hardware resource and strong ability for anti-jamming. It is specially suitable for making brainpower measurement instrument and industry controlling system. The hardware resource of singlechip AT89C52 is fully exploited in this paper. This system realizes precise measurement and controlling of temperature signal with a little hardware resource.
First, the need of temperature control is expounded. Temperature is a main control parameter in industrial object. Various calefaction stoves, ovens and constant temperature boxes which all need control temperature are widely used in many industry such as metallurgy, chemistry, mechanism and foodstuff. Moulding room and spout temperature awfully affect the precision of moulding pieces. Then the temperature control system using controllable silicon is explain in detail. This system adopts singlechip AT89C52 which acts as microcontroller. It can regulate the angle of double-direction controllable silicon and control voltage wave shape. So the virtual voltage of load can be changed and the calefaction power of calefaction stick can be controlled. Therefore the temperature can retain the enactment value. This system mainly consists of collection of data, disposal, output, communication of system and computer and communication of human and machine. This system has some advantages such as low cost, high precision and convenience realization.
This system adopts blury PID control. The adoption of blury PID control can ceaselessly autoregulates basing initialized control rule, thus the controlled system will move to the initialized balance state.
本文主要对FDM温度控制系统进行了深入的分析和研究。温度测控在食品卫生、医疗化工等工业领域具有广泛的应用。随着传感器技术、微电子技术、单片机技术的不断发展,为智能温度测控系统测控功能的完善、测控精度的提高和抗干扰能力的增强等提供了条件。本系统采用的AT89C52单片机是一高性能的8位机,具有丰富的硬件资源和非常强的抗干扰能力,特别适合构成智能测控仪表和工业测控系统。本系统对AT89C52单片机硬件资源进行了开发,采用集成温度传感器AD590实现对温度信号的检测,充分利用单片机的硬件资源,以非常小的硬件投入,实现了对温度信号的精确检测与控制。
文中首先阐述了温度控制的必要性,温度是工业对象中的主要被控参数之一,在冶金、化工、机械、食品等各类工业中,广泛使用各种加热炉、烘箱、恒温箱等,它们均需对温度进行控制,成型室及喷头温度对成型件精度都有很大影响。然后详细讲解了所设计的可控硅调功温度控制系统,系统采用AT89C52单片机作微控制器构建数字温度控制器,调节双向可控硅的导通角,控制电压波形,实现负载两端有效电压可变,以控制加热棒的加热功率,使温度保持在设定值。系统主要包括:数据的采集,处理,输出,系统和上位机的通讯,人机交互部分。该系统成本低,精度高,实现方便。
该系统加热器温度控制采用模糊PID控制。模糊PID控制的采用能够在控制过程中根据预先设定好的控制规律不停地自动调整控制量以使被控系统朝着设定的平衡状态过渡。
In the present field of Rapid Prototyping, the "New RP Technology" based on jetting technology is replacing the "Conventional RP Technology" based on laser technology as the mainstream of the Rapid Prototyping Technology. Fused Deposition Modeling (FDM) is the most popular Rapid Prototyping technology based on jetting technology.
This paper mainly does research deeply on the temperature control system of FDM system. Temperature controlling is widely to food, sanitation, medical treatment, chemistry and industry. Along with the development of sensor technology, micro-electronics technology and singlechip technolog, brainpower temperature controlling system is perfected, precision of measurement and controlling is enhanced and the ability of anti-jamming is swelled. Singlechip AT89C52 in this paper is a high-powered 8-bit chip. It has plenty of hardware resource and strong ability for anti-jamming. It is specially suitable for making brainpower measurement instrument and industry controlling system. The hardware resource of singlechip AT89C52 is fully exploited in this paper. This system realizes precise measurement and controlling of temperature signal with a little hardware resource.
First, the need of temperature control is expounded. Temperature is a main control parameter in industrial object. Various calefaction stoves, ovens and constant temperature boxes which all need control temperature are widely used in many industry such as metallurgy, chemistry, mechanism and foodstuff. Moulding room and spout temperature awfully affect the precision of moulding pieces. Then the temperature control system using controllable silicon is explain in detail. This system adopts singlechip AT89C52 which acts as microcontroller. It can regulate the angle of double-direction controllable silicon and control voltage wave shape. So the virtual voltage of load can be changed and the calefaction power of calefaction stick can be controlled. Therefore the temperature can retain the enactment value. This system mainly consists of collection of data, disposal, output, communication of system and computer and communication of human and machine. This system has some advantages such as low cost, high precision and convenience realization.
This system adopts blury PID control. The adoption of blury PID control can ceaselessly autoregulates basing initialized control rule, thus the controlled system will move to the initialized balance state.
引文
[1]颜士伟.快速成型技术发展状况及展望.中国汽车制造,2005,(4):8-9.
[2] Karl Kuzman,Blaz Nardin,Majan Kovac,et al.The integration of rapid prototyping and CAE in mould manufacturing.Journal of material processing technology,2001, 111,(1):279～280.
[3]林峰.分层实体制造工艺原理研究及系统开发:[博士学位论文].北京:清华大学,1997
[4]于雷,赵静.典型快速成形工艺及成型机选用.长春工程学院学报(自然科学版),2003,4(4):20-23.
[5]常用于FDM的塑胶材料.http://psdnpidcorgtw/ike/doclib/2004/2004doclib /2004ike310/2004IKE310310asp ,2004.
[6] Scott Crump S..Make RP models in end-product material.Design Engineering (Toronto),2003,49(5):20-21.
[7]林柳兰,莫健华.快速成形材料及应用.模具,2003,(8):55.
[8] Masood S.H.,Song W.Q..Thermal characteristics of a new metal/polymer material for FDM rapid prototyping process.Assembly Automation,2005,25(4): 309-315.
[9] Egodawatta A.K.,Hanison D.K.,Desilia A.K.M.Etal.Fifth National Conference on Rapid Design, Prototyping, and Manufacturing,2004:13-22.
[10]颜永年,张人佶,卢清萍等.多功能快速原型制造系统(M-RPMS) .昆明理工大学学报,2001,(8):24~28.
[11]谭永生.FDM快速成型技术及其应用.专题综述,2000,(1):26-28.
[12]何新英,陶明元,叶春生.FDM工艺成形过程中影响成形件精度的因素分析.机械与电子,2004,(9):77-78.
[13]邹国林,郭东明,贾振元.FDM工艺出丝过程影响因素分析.制造技术与机床,2002,(10):33-34.
[14]李兰,孙大芳.单片机实现的电加热炉温控系统.沈阳工业大学学报,1999,(2):60-62.
[15] Zero Voltage Switch CA3059.Datasheet[EB/OL].http://onsemi.com,2001.
[16]王学文.高精度数显式恒温控制器的研制.医疗卫生装备,2000,(5):49-50.
[17]崔刚,陈文楷.基于CPLD的温度控制系统.现代电子技术,2005,(21):68-69.
[18] Iven B.Defining adaptive and learning systems.IEEE Trans Syst.Man.Cybernt, 1987, 20:77-88.
[19]陶永华,尹怡欣,葛芦生.新型PID控制及其应用.第1版.北京:机械工业出版社,1999.95-99.
[20] Li Ren-Houetal.Fuzzy logic controller based on genetic algorithms.Fuzzy Sets Systems,1996,83(1):1-10.
[21]涂时亮,张有德.单片微机控制技术.第1版.北京:复旦大学出版社,1994.91-95.
[22]游冠军,胡益华,陆申龙等.集成温度传感器AD590的电路原理及其在测温和温控中的应用,大学物理实验.2000,(9):1-4.
[23] ANALOG DEVICES.AD590.Datasheet.
[24]党淑雯,郑耀林.集成温度传感器AD590及其在热电偶冷端补偿中的应用.仪器仪表用户,2004,(4):40-41.
[25]刘锋,李跃波.AD624集成放大器及其在应变测试仪中的应用.电子工程师, 1999,(5):30-31.
[26]涂水林,张景海.多通道多输入范围12位ADC MAX197及其应用.电测与仪表,2001,(3):37-39.
[27]张俊涛,王长安.12bA/D转换器MAX197及其应用.现代电子技术,2004, (19):76-77.
[28] National Semiconductor.LM1117.Datasheet.
[29]李华.MCS-51系列单片机实用接口技术.第1版.北京:北京航空航天大学出版社,1993.387-392.
[30] ANALOG DEVICES.AD667.Datasheet.
[31] MOTOROLA.MOC3021.Datasheet.
[32] SIEMENS.TCA785.Datasheet.
[33]孙茂松.TCA785集成触发器及应用.唐山高等专科学校学报,2000,(1):85-88.
[34]吴中华.集成电路移相触发器.TCA785的工作原理及应用.辽宁师专学报, 2001,(6):71-74.
[35]房毅卓.双向可控硅在702型温控仪上的应用.盐湖研究,1998,(2):113-114.
[36]刘艳玲.采用MAX232实现MCS-51单片机与PC机的通信.天津理工学院学报,1999,(6):57-58.
[37] MAXIM.MAX232.Datasheet.
[38] ATMEL.AT89C52.Datasheet.
[39]何立民.MCS–51系列单片机应用系统设计.第1版.北京:北京航空航天大学出版社,1990.40-42.
[40]罗海天,雷晓平,杨定安.AT89C52单片机在可控硅调功温控系统中的应用.无线电通信技术,1999,(2):36-37.
[41]徐嗣鑫.基于模糊推理的自校正控制器现装及展望.信息与控制,1992,(5): 284-287.
[2] Karl Kuzman,Blaz Nardin,Majan Kovac,et al.The integration of rapid prototyping and CAE in mould manufacturing.Journal of material processing technology,2001, 111,(1):279～280.
[3]林峰.分层实体制造工艺原理研究及系统开发:[博士学位论文].北京:清华大学,1997
[4]于雷,赵静.典型快速成形工艺及成型机选用.长春工程学院学报(自然科学版),2003,4(4):20-23.
[5]常用于FDM的塑胶材料.http://psdnpidcorgtw/ike/doclib/2004/2004doclib /2004ike310/2004IKE310310asp ,2004.
[6] Scott Crump S..Make RP models in end-product material.Design Engineering (Toronto),2003,49(5):20-21.
[7]林柳兰,莫健华.快速成形材料及应用.模具,2003,(8):55.
[8] Masood S.H.,Song W.Q..Thermal characteristics of a new metal/polymer material for FDM rapid prototyping process.Assembly Automation,2005,25(4): 309-315.
[9] Egodawatta A.K.,Hanison D.K.,Desilia A.K.M.Etal.Fifth National Conference on Rapid Design, Prototyping, and Manufacturing,2004:13-22.
[10]颜永年,张人佶,卢清萍等.多功能快速原型制造系统(M-RPMS) .昆明理工大学学报,2001,(8):24~28.
[11]谭永生.FDM快速成型技术及其应用.专题综述,2000,(1):26-28.
[12]何新英,陶明元,叶春生.FDM工艺成形过程中影响成形件精度的因素分析.机械与电子,2004,(9):77-78.
[13]邹国林,郭东明,贾振元.FDM工艺出丝过程影响因素分析.制造技术与机床,2002,(10):33-34.
[14]李兰,孙大芳.单片机实现的电加热炉温控系统.沈阳工业大学学报,1999,(2):60-62.
[15] Zero Voltage Switch CA3059.Datasheet[EB/OL].http://onsemi.com,2001.
[16]王学文.高精度数显式恒温控制器的研制.医疗卫生装备,2000,(5):49-50.
[17]崔刚,陈文楷.基于CPLD的温度控制系统.现代电子技术,2005,(21):68-69.
[18] Iven B.Defining adaptive and learning systems.IEEE Trans Syst.Man.Cybernt, 1987, 20:77-88.
[19]陶永华,尹怡欣,葛芦生.新型PID控制及其应用.第1版.北京:机械工业出版社,1999.95-99.
[20] Li Ren-Houetal.Fuzzy logic controller based on genetic algorithms.Fuzzy Sets Systems,1996,83(1):1-10.
[21]涂时亮,张有德.单片微机控制技术.第1版.北京:复旦大学出版社,1994.91-95.
[22]游冠军,胡益华,陆申龙等.集成温度传感器AD590的电路原理及其在测温和温控中的应用,大学物理实验.2000,(9):1-4.
[23] ANALOG DEVICES.AD590.Datasheet.
[24]党淑雯,郑耀林.集成温度传感器AD590及其在热电偶冷端补偿中的应用.仪器仪表用户,2004,(4):40-41.
[25]刘锋,李跃波.AD624集成放大器及其在应变测试仪中的应用.电子工程师, 1999,(5):30-31.
[26]涂水林,张景海.多通道多输入范围12位ADC MAX197及其应用.电测与仪表,2001,(3):37-39.
[27]张俊涛,王长安.12bA/D转换器MAX197及其应用.现代电子技术,2004, (19):76-77.
[28] National Semiconductor.LM1117.Datasheet.
[29]李华.MCS-51系列单片机实用接口技术.第1版.北京:北京航空航天大学出版社,1993.387-392.
[30] ANALOG DEVICES.AD667.Datasheet.
[31] MOTOROLA.MOC3021.Datasheet.
[32] SIEMENS.TCA785.Datasheet.
[33]孙茂松.TCA785集成触发器及应用.唐山高等专科学校学报,2000,(1):85-88.
[34]吴中华.集成电路移相触发器.TCA785的工作原理及应用.辽宁师专学报, 2001,(6):71-74.
[35]房毅卓.双向可控硅在702型温控仪上的应用.盐湖研究,1998,(2):113-114.
[36]刘艳玲.采用MAX232实现MCS-51单片机与PC机的通信.天津理工学院学报,1999,(6):57-58.
[37] MAXIM.MAX232.Datasheet.
[38] ATMEL.AT89C52.Datasheet.
[39]何立民.MCS–51系列单片机应用系统设计.第1版.北京:北京航空航天大学出版社,1990.40-42.
[40]罗海天,雷晓平,杨定安.AT89C52单片机在可控硅调功温控系统中的应用.无线电通信技术,1999,(2):36-37.
[41]徐嗣鑫.基于模糊推理的自校正控制器现装及展望.信息与控制,1992,(5): 284-287.