难熔金属与硅间界面反应的热力学研究
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摘要
难熔金属硅化物在现代集成电路封装中具有重要意义。因此,研究难熔金属与硅之间的界面反应,以便预测和控制界面硅化物的形成,不仅具有重要的理论意义,而且有利于指导封装工艺的制订。本文结合国家自然科学基金项目(NO:50671122),采用CALPHAD技术对Pt-Si、V-Si、Ag-Pt等相关体系热力学进行研究,并外推计算Pt-V-Si和Ag-Pt-Si这两个三元体系相关系。主要研究工作如下:
     1.优化和计算了Pt-Si和V-Si两个二元系。其中液相与端际相采用替代溶液模型,V_3Si相采用亚点阵模型,其余化合物均采用化学计量比模型。结合文献报道的Pt-V二元系热力学数据,外推计算了Pt-V-Si三元系,和液相面投影图以及一系列的等温截面。
     2.优化和计算了Ag-Pt二元系,其中液相与端际相采用替代溶液模型,所有化合物均为化学计量比模型。结合本文优化的Pt-Si二元系和文献报道的Ag-Si二元系的实验数据,外推计算了Ag-Pt-Si三元系,和液相面投影图与一系列的等温截面。
     3.利用获得的热力学数据,合理地解释了文献报道的V/Si界面反应的实验现象。
The refractory metal silicides are of great significance in morden electronic packing.Thus,investigation of the interfacial reaction between refractory metal and silicon,in order to predict and control the microstructure evolution during the interfacial reaction,has important theoretical significance,and can help guiding fomulating of packing technology.In this work,based on the project supported by National Science Foundation of China(No.50671122),the thermodynamic of the interfacial reactions between refractory metal and silicon were investigated through the CALPHAD method.This work was comprised of three parts as follows:
     1.The Pt-Si and V-Si binary systems were optimized.Ordinary subitutional solution model were employed to describe Liquid,Bcc and Fcc phases,V_3Si phase was described by compound energy formalism,and all the other intermetallic phases were treated as stoichiometric phases.Calculated results were well consistent with that of experimental.Combined with the optimized parameters in the literature for the Pt-V binary system,the Pt-V-Si ternary system was extrapolated.The liquid project and several isothermal sections were calculated.
     2.The Ag-Pt binary systems were optimized.Ordinary subitutional solutions were adopted to model Liquid and Fcc terminal solution,and Ag_(15)Pt_(17)phases was treated as stoichiometric compound.Calculated phase diagram and thermodynamic data were both consistent with the experimental work.Combined with the optimized parameters of the Ag-Si binary system in the literature and Pt-Si binary system in this work,the Ag-Pt-Si ternary system was extrapolated.The liquid project and several isothermal sections were calculated.
     3.By using the thermodynamic parameters of the V-Si binary system, formation of IMC(s)in binary reaction couples V/Si at different temperatures has been successfully explained.
引文
[1].王占国,陈立泉,屠海令等,中国材料工程大典,第11卷,信息功能材料工程(上),北京,化学工业出版社,2005.
    [2].J.O.Olowolafe,M.A.Nicolet,and J.W.Mayer,Influence of the nature of the Si substrate on nickel silicide formed from thin Ni films,Thin Solid Films.,38(1976),143-150.
    [3].E.A.Guliants,W.A.Anderson,L.P.Guo,et al.,Transmission electron microscopy study of Ni silicides formed during metal-induced silicon growth,Thin Solid Films.,385(2001),74-80.
    [4].L.A.Clevenger,and C.V.Thompson,Nucleation-limited phase selection during reactions in nickel/amorphous-silicon multilayer thin films,J.Appl.Phys.,67(1990),1325-1333.
    [5].J.C.Chen,G.H.Shen,L.J.Chen,Interfacial reactions of Gd thin films on(111)and(001)Si,App.Surf.Sci.,142(1999),291-294.
    [6].T.P.Roge,F.Palmino,C.Savall,et al.,STM investigation of 2-and 3-dimensional Er disilicide grown epitaxially on Si(111),Surface.Sci.,355(1996),13-20.
    [7].H.Miura,E.Ma,and C.V.Thompson,Initial sequence and kinetics of silicide formation in cobalt/amorphous-silicon multilayer thin films,J.Appl.Phys.,70(1991),4287-4294.
    [8].I.Y.Hwang,J.H.Kim,S.K.Oh,et al.,Ultrathin cobalt silicide film formation on Si(100)~+,Surf.Interface Anal.,35(2003),184-187.
    [9].M.C.Li,X.K.Chen,W.Cai,et al.,Preparation of platinum silicide films by pulsed laser deposition and pulsed laser annealing,Mater.Chem.Phys.,72(2001),85-87.
    [10].G.Majni,M.Costato and F.Panini,Thin film compounds in planar Pt-Si reaction,J.Phys.Chem.Solids.,46(1985),631-641.
    [11].V.Venkataramana,S.Rajagopalanb,P.Manoravic,et al.,Formation of interface silicides at room temperature in pulsed laser deposited Ti thin films on Si(100),Mater.Res.Bull.,38(2003),1835-1840.
    [12].O.Chaix-Pluchery,B.Chenevier,I.Matko,et al.,Investigations of transient phase formation in Ti/Si thin film reaction,J.Appl.Phys.,96(2004),361-368.
    [13]. R.M. Walser and R.W. Bene, First phase nucleation in silicon-transition-metal planar interfaces, Appl. Phys. Lett., 28 (1976), 624-625.
    [14]. R.W. Bene, A kinetic model for solid-state silicide nucleation, J. Appl. Phys., 61 (1987), 1826-1833. [15]. T. Nishizawa and A. Chiba, Phenomenological consideration on inter-phaseequilibrium in a diffusion couple, J. Jpn. Inst. Met., 34 (1970), 629-637.
    [16]. U. Gosele and K.N. Tu, Growth kinetics of planar binary diffusion couples, J. Appl. Phys., 53 (1982), 3252-3260.
    [17]. W.L. Johnson, Thermodynamic and kinetic aspects of the crystal to glass transformation in metallic materials, Prog. Mater. Sci., 30 (1986), 81-134.
    [18]. RM. d'Heurle, Nucleation of a new phase from the interaction of two adjacent phases, J. Mater. Res., 3 (1988), 167-195.
    [19]. L.A. Clevenger and C.V. Thompson, Nucleation-limited phase selection during reactions in Ni/Si multilayer thin films, J. Appl. Phys., 67 (1990), 1325-1333.
    [20]. C.V. Thompson, On the role of diffusion in phase selection during reactions at interfaces, J. Mater. Res., 7 (1992), 367-373.
    [21]. B.J. Lee, N.M. Hwang and H.M. Lee, Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation, Acta Mater., 45 (1997), 1867-1874.
    [22]. D. Turnbull: in Solid State Physics, F. Seitz, D. Turnbull, eds., Academic Press, New York (NY): 1956.
    [23]. W.K. Choi and H.M. Lee, Prediction of primary IMC formation during interfacial reaction between Sn-based solder and Ni, Scripta Mater., 46 (2002), 777-781.
    [24]. C.V. Thompson, L.A. Clevenger, R.R. DeAvillez, et al., Thin film Structures and Phase Stability, Ed. Clemens BM and Johnson WL, Mater. Res. Soc. Symp. Proc, Pittsburgh, PA, 1990.
    [25]. R.J. Highmore, A.L. Greer, J.A. Leake et al., A transient nucleation model for solid state amorphisation, Mater. Lett., 6 (1988), 401-405.
    [26]. H.S. Liu, H. Wang, W.J. Zhu, X.M. Tao and Z.P. Jin, Prediction of formation of intermetallic compounds (IMCs) in the diffusion couples, J. Mater. Res., 22 (2007), 1502-1511.
    [27]. J.J. Van Larr, Z. Phys. Chem. B., 63 (1908), 216-220.
    [28]. J.L. Meijering, Retrograde Solubility Curves Especially in Alloy Solid Solutions, Philips. Res. Rep., 3 (1948), 281-302.
    [29]. L. Kaufman and H. Bernstein, Computer Calculation of Phase Diagrams (New York: Academic Press, 1970).
    
    [30]. 冯端,师昌绪,刘治国等著,材料科学导论,2001.
    
    [31]. A.T. Dinsdale, SGTE data for pure elements, CALPHAD, 15 (1991), 317-425.
    [32]. M. Hillert, Phase Equilibria, Phase Diagrams and Phase Transformations: Their Thermodynamic Basis, Cambridge University Press, 1998.
    [33]. O. Redlich and A. Kister, Algebraic Representation of Thermodynamic Properties and the Classification of Solutions, Ind.Eng.Chem., 40 (1948), 345-348.
    [34]. J.H. Hildebrand, Solubility. XII. Regular Solutions, J. Amer. Chem. Soc, 51 (1929), 66-80.
    [35]. H.K. Hardy, An equation for the solubility surface of ternary 'sub-regular' solutions, Acta Metall, 2 (1954), 348-349.
    [36]. M. Hillert and L.I. Staffansson, Regular-solution model for stoichiometric phases and ionic melts, Acta Chem. Scand., 24 (1970), 3618-3626.
    [37]. M. Hillert, B. Jasson and B. Sundman, Application of the Compound-Energy Model to Oxide Systems, Z. Metallkd., 79 (1988), 81-87.
    [38]. M. Hillert, The Compound Energy Formalism, J.Alloys Compds., 320 (2001), 161-176.
    [39]. L.S. Brooks, Vapour pressure of Po (438-745 ℃), J. Amer. Chem. Soc, 77 (1955), 11.
    [40]. O. Kubaschewski, C.B. Alcock, 《Metallurgical Thermochemistry》5~(th) edition, Pergamon Press London, Oxford, New York, 1979.
    [41]. F. Cacho, S. Orain, G. Gailletaud et al., A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies, Microelectr. Reliab., 47 (2007), 161-167.
    [42]. C. Fitz, M. Goldbach, A. Dupont, et al., Silicides as contact material for DRAM applications, Microelectr. Eng., 82 (2005), 460-466.
    [43]. N.S. Stoloff, C.T. Liu, S.C. Deevi, Emerging applications of intermetallics, Intermetallics, 8 (2000), 1313-1320.
    [44]. J. Vobecky and P. Hazdra, The application of platinum-silicide anode layer to decrease the static, Thin Solid Films, 433 (2003), 305-308.
    [45]. C.P. Wang, A.Q. Zheng and X.J. Liu, Thermodynamic assessment of the V-Ge and V-Pt systems, Intermetallics, (2008), doi:10.1016/j.intermet. 2008.01.002.
    [46]. J.F. Smith, The Si-V (Silicon-Vanadium) system, Bulletin of Alloy Phase Diagram, 2 (1981), 42-48.
    [47]. J.F. Smith, The Si-V (Silicon-Vanadium) system: Addendum, Bulletin of Alloy Phase Diagram, 6 (1985), 266-271.
    [48]. C. Zhang, J. Wang, Y. Du et al., An investigation on the thermodynamic stability of V_6Si_5, J. Mater. Sci. 42 (2007), 7046-7048.
    [49]. C. Zhang, Y. Du, W. Xiong, et al., Thermodynamic modeling of the V-Si system support by key experiments, CALPHAD, (2008), doi:10.1016/j.calphad. 2007.12.005.
    [50]. N.M. Voronov, A physicochemical Study of the system Platinum-Silicon, Izv. Sekt. Platiny, 13 (1936), 145-166.
    [51]. R. Gohle and K. Schubert, On the system Platinum-Silicon, Z. Metallkd., 55 (1964), 503-511.
    [52]. R.P. Ram and S. Bhan, On the constitution of Platinum-Silicon alloys, Z. Metallkd., 69 (1978), 524-529.
    [53]. R. Massara and P. Feschotte, Le systeme binaire Pt-Si, J. Alloys Comp., 201 (1993), 223-227.
    [54]. L.E. Tanner and H. Okamoto, The Pt-Si (Platinum-Silicon) system, J. Phase Euqil., 12 (1991), 571-574.
    
    [55]. H. Okamoto, Pt-Si, J. Phase Euqil., 16 (1995), 286-287.
    [56]. L. Topor and O.J. Kleppa, Thermochemistry of the system Pd-Si and Pt-Si at 1400 K, Z. Metallkd., 77 (1986), 65-71.
    [57]. A.W. Searcy and L.N. Finnie, Stability of solid phases in the ternary systems of silicon and carbon with rhenium and the six platinum metals, J. Am. Ceram. Soc, 45 (1962), 268-273.
    [58]. T.G. Chart, Thermochemical data for transition metal-silicon systems, High Temp.- High Press., 5 (1973), 241-252.
    [59]. A. Pasturel and P. Hicter, On the heats of formation of solid germanides and silicides of transition metals, Physica, 124B (1984), 247-250.
    [60]. A. Pasturel, P. Hicter and F. Cyrot-Lackmann, On the heats of formation of transition metal-p metal alloys, J. Less-Common Met., 86 (1982), 181-186.
    [61]. A.K. Niessen and F.R. de Boer, The enthalpy of formation of solid borides, carbides, nitrides, silicides and phosphides of transition and noble metals, J. Less-Common Met, 82 (1981), 75-80.
    [62]. A.R. Miedema, P.E de Chatel and F.R. de Boer, Cohesion in alloys-fundamentals of a semi-empirical model, Physica B+C, 100 (1980), 1-28.
    [63]. M.E. Schlesinger, Thermodynamics of solid transition-metal silicides, Chem. Rev., 90 (1990), 607-628.
    [64]. W. Rostoker and A. Yamamoto, A survey of Vanadium binary systems, Trans. Am. Soc. Met, 46 (1954), 1136-1163.
    [65]. R. Kieffer, F. Benesovsky and H. Schmid, An investigation of the form of the V-Si and Nb-Si systems, Z. Metallkd., 47 (1956), 247-253.
    [66]. J. Hallais, J.P. Senateur and R.Fruchart, On a new silicide of Vanadium with formula V_6Si_5, C. R.Acad. Sci, 264 (1967), 1947-1959.
    [67]. P. Herpin, P. Spinat, J. Hallais et al. On the structure of the binary compounds V_6Si_5 and Ti_6Ge_5, C. R.Acad. Sci, 268 (1969), 1750-1753.
    [68]. P. Spinat, R. Fruchart and P. Herpin, Structure of the binary phases V_6Si_5 and Ti_6Ge_5, Bull. Soc. Fr. Mineral. Cristallogr, 93 (1970), 23-26.
    [69]. J. Hallais, Structural study of two new compounds, V_6Si_5 and Ti_6Si_5, Ann. Chim, 6 (1971) 321-329.
    [70]. Yu.A. Kocherzhinskii, O.G. Kullk and E. Shiskin, Phase diagram for the Vanadium-Silicon system, Dokl. Akad. Nauk SSSR, 209 (1973), 1347-1349.
    [71]. Yu.A. Kocherzhinskii, O.G. Kullk and E. Shiskin, in Strukt. Faz, Fazovye Prevrasch. Diagr. Sostoyaniyz Met. Sist, O.S. IVanov, Ed, Izd. Nauka, Moscow, 1974,p136-139.
    [72]. V.N. Eremenko, G.M. Lukashenko and V.R. Sidorko, Thermodynamic properties of the Vanadium silicide VSi_2 and V_6Si_5, Dopov. Akad. Nauk Ukr. RSR, Ser.B, 36 (1974), 712-713.
    [73]. V.N. Eremenko, G.M. Lukashenko and V.R. Sidorko, Thermodynamic properties of Vanadium, Chromium, and Manganese silicides at elevated temperatures, Rev. Int. Hautes Temp. Refract, 12 (1975), 237-240.
    [74]. V.N. Eremenko, G.M. Lukashenko, V.R. Sidorko et al., Thermodynamic properties of the Vanadium silicides V_5Si_3 and V_3Si, Dopov. Akad. Nauk Ukr. RSR, Ser.A, 38 (1976), 365-368.
    [75]. Yu.V. Efimov, The Silicon-Vanadium system, Zh. Neorg. Khim. 8 (1963), 1522-1524.
    [76]. H.A.C.M. Burning, Homogeneity regions and superconducting transition temperatures in the system V-V_3Si, Philips Res. Rep. 22 (1967), 349-354.
    [77]. J.L. Jorda and J. Muller, The V_3Si phase: Type of formation and homogeneity range, J. Less-Common Met. 84 (1982), 39-48.
    [78]. P.F. Freund and K.E. Spear, Assessment of the thermodynamic properties of Vanadium silicon utilizing ternary phase equilibria, J. Less-Common Met. 60 (1978), 185-193.
    [79]. F.R. de Boer, R. Boom and A.R. Miedema, Enthalpies of formation of liquid nd solid binary alloys based on 3d metals, I: Alloys of Scandium, Titanium and Vanadium, Physica 101B (1980), 294-319.
    [80]. E.K. Stroms and C.E. Myers, Thermodynamics and phase equilibria in the Vanadium-Silicon system, High Temp. Sci. 20 (1987), 87-96.
    [81]. L. Topor and O.J. Kleppa, Standard enthalpies of formation of TiSi_2 and VSi_2 by high-temperature calorimetry. Metall. Trans. A 17A (1986), 1217-1221.
    [82]. C.E. Myers and R.J. Kematick, Vaporization Thermodynamics in the Vanadium-rich portion of the Vanadium-Silicon system by high temperature Knudsen cell mass spectrometry, J. Electrochem. Soc, 134 (1987), 720-724.
    [83]. Yu.O. Esin, M.G. Valishev, A.F. Eremenko, et al., Izv. Akad. Nauk SSSR. Metally, 2 (1981), 95-96.
    [84]. J.O. Andersson, T. Helander, L.H. Hoglund, et. al.. Thermo-Calc & DICTRA, computational tools for materials science. CALPHAD, 2002,26(2): 273-312.
    [85]. T. Tokunaga, K. Nishio, H. Ohtani et al., Thermodynamic assessment of the Ni-Si system by incorporating ab initio energetic calculations into the CALPHAD approach, CALPHAD, 27 (2003), 161-168.
    [86]. Z.M. Du, C.P. Guo, X.J. Yang et al., A thermodynamic description of the Pd-Si-C system, Intermetallics, 14 (2006), 560-569.
    [87]. Y.P. Li, J. Chen, L. Yang, et al., Magnetron sputtering of nickel silicon alloy as thin film UBM for Pb-free flip-chip packaging, Advanced Metallization Conference(AMC),Advanced Metallization Conference,AMC 2005,2006,p 185-189.
    [88].黄廷荣.难熔金属硅化物及多层难熔金属化系统研究.半导体杂志,1992,17(4),1-9.
    [89].I.Karakaya and W.T.Thompson,The Ag-Pt(Silver-Platinum)system,8(1987),334-340.
    [90].Ph.Durussel and P.Feschotte,A revision of the binary system Ag-Pt,239(1996),226-230.
    [91].J.Wang,H.S.Liu,L.B.Liu et al.,Thermodynamic description of Au-Ag-Si ternary system,Trans.Nonferrous.Met.Soc.,17(2007),1405-1411.
    [92].R.Erni,T.Etter,H.Heinrich et al.,On the formation of a Silver-rich ordered phase in Ag-Pt solid solutions,Z.Metallkd.,92(2001),1194-1196.
    [93].M.H.F.Sluiter,C.Colinet and A.Pasturel,Ab initio calculation of the phase stability in Au-Pd and Ag-Pt alloys,Phys.Rev,B 73(2006),174204-1-17.
    [94].S.L.Chen,S.Daniel,F.Zhang,et.al..The PANDAT software package and its applications.CALPHAD,26(2002),175-188.
    [95].H.Miura,E.Ma,and C.V.Thompson,Initial sequence and kinetics of silicide formation in cobalt/amorphous-silicon multilayer thin films,J.Appl.Phys.,70(1991),4287-4294.
    [96].I.Y.Hwang,J.H.Kim,S.K.Oh,et al.,Ultrathin cobalt silicide film formation on Si(100)~+,Surf.Interface Anal.,35(2003),184-187.
    [97].H.Muta and D.Shinoda,Solid-Solid reactions in Pt-Si system,J.Appl.Phys.,43(1972),2913-2915.
    [98].T.Shimozaki,E.Yoshimura,Y.Wakamatsu,et al.,Reactive diffusion in bulk Pt/Si diffusion couple,Mater.Trans.,JIM,36(1995),1112-1117.
    [99].F.Maglia,U.Aneslmi-Yamburini,C.Milanese,et al.,Field activated combustion synthsis of the silicides of vanadium,J.Alloys Comp..319(2001),108-118.
    [100].P.A.Psaras,M.Eizenberg and K.N.Tu,Sequential silicide formation between vanadium and amorphous silicon thin-film bilayers,J.Appl.Phys.,56(1984),3439-3444.
    [101].R.J.Schutz and L.R.Testardi,The formation of vanadium silicides at thin-film interfaces,J.Appl.Phys.,50(1979),5773-5781.

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