改性树脂结合剂金刚石线锯丝研制
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摘要
固结磨料金刚石线锯丝因其切缝窄,切片质量好,切割效率高,污染小,使用寿命长,且可以加工更难加工的脆硬材料等优点而越来越受到关注。而作为固结磨料金刚石线锯丝之一的树脂结合剂金刚石线锯丝,更是因为制作工艺简单,制造周期短,成本低,加工表面质量优于电镀金刚石线锯丝,而有望在硬脆材料切割领域得到应用。但树脂结合剂金刚石线锯丝存在磨粒把持强度低、耐磨性及耐热性差的缺点,导致锯丝很容易就失效了。本论文对树脂结合剂进行了改性研究,分析了结合剂中各种成分对结合剂性能的影响,并改进了锯丝的制作工艺。本文所做的主要工作和取得的成果有：
首先在理论上分析了改性树脂结合剂的可行性,并通过分析树脂结合剂线锯丝存在的问题,提出了使用高性能树脂、高性能液体橡胶、纳米粒子以及偶联剂等的方法来提高树脂结合剂的粘接性、韧性、耐磨性和耐热性。
采用正交试验的方法,分析了各种组分对结合剂性能影响的规律,并得出了各种组分的一个最佳配比。研究了树脂结合剂金刚石线锯丝的制作工艺,包括锯丝基体和磨料的选择与处理,采用超声波分散方法配制结合剂和自制的涂附装置来进行树脂结合剂线锯丝的制作。
以一定长度内锯丝的切割面积作为评价方法,金刚石磨料的用量取5个试验水平,按照锯丝制作的工艺流程,采用优化得到的树脂配比制作5根锯丝,通过切割试验研究了金刚石磨料的用量对锯丝寿命的影响。
树脂磨粒层沿锯丝轴向上厚度要一致,以保证加工工件的表面质量；树脂磨粒层在锯丝径向上要均匀,避免磨粒在锯丝基体上分布不均而造成锯丝过早磨损。为达到上述目的,研究制作了锯丝涂附装置,提高了锯丝制作的质量。
利用各组分配比优化后的结合剂和经过改进的工艺来制作树脂结合剂金刚石线锯丝,并对其进行质量评价。宏观和微观检测表明锯丝外观形貌和固化状态良好；尺寸检测表明锯丝的轴向和径向均匀一致性较好,外径极差小于0.004mm；利用自制的锯丝在往复金刚石线旋转点切割机上对硅晶体进行切割试验,结果表明锯丝的加工性能良好,加工表面质量优于电镀线锯丝的加工表面质量。
Fixed abrasive diamond wire saw is more and more attention because of its thin kerf loss,better wafer quality,high cutting efficiency,environment friendly,ability to machine hard and brittle materials,and so on.Resin bonded diamond wire saw,one of fixed abrasive diamond wire saws,will be used to process hard and brittle materials because of its simple manufacture technics,short manufacturing cycle,low cost,and better processing quality than electroplated diamond wire saw.However,resin bonded diamond wire saw easily becomes ineffective because of its poor adhesive ability,abrasion-resistance and heat-resistance.Modified research of resin adhesive was analysed in this paper.The impact of various elements to resin adhesive was researched.The manufacture technics of resin bonded diamond wire saw was also developed in this paper.
First,the feasibility of modified resin was analysed theoretically.By analysing the problem of resin bonded diamond wire saw,high-performance resin,high-performance liquid rubber,nanometer particles and silane coupling agent were used to enhance heat-resistance,abrasion-resistance,toughness and high adhesive ability.
The impact of various elements to resin adhesive was optimized by using orthogonal experiment.Manufacture technics of resinoid diamond wire was researched.Core wire and diamond abrasive were chosen and surface disposed.Resin adhesive was confected by using ultrasonic dispersion method.Resin bonded diamond wire saw was manufactured by using self-regulating coating tool.
Five test levels of diamond abrasive were taken.The research how the amount of diamonds impact the performance of resin bonded diamond wire saw was finished.Using a certain length of the wire saw cutting area evaluated the performance of the wire saw.
Resin layer along the wire axis should be well-proportioned to ensure the surface quality of workpiece.Resin layer in the radial wire should be consistent to avoid wire's abrasion early.A self-regulating coating tool was used to increase the quality of the wire.
The developed resin bonded diamond wire saw was evaluated in this paper,and it was found that resin bonded diamond wire saw had stable diametral dimension and axial dimension,good appearance.The difference of diametral dimension was less than 0.004mm.Excellent slicing performance and good surface quality were obtained when we sliced silicon crystal using resin bonded diamond wire saw.
首先在理论上分析了改性树脂结合剂的可行性,并通过分析树脂结合剂线锯丝存在的问题,提出了使用高性能树脂、高性能液体橡胶、纳米粒子以及偶联剂等的方法来提高树脂结合剂的粘接性、韧性、耐磨性和耐热性。
采用正交试验的方法,分析了各种组分对结合剂性能影响的规律,并得出了各种组分的一个最佳配比。研究了树脂结合剂金刚石线锯丝的制作工艺,包括锯丝基体和磨料的选择与处理,采用超声波分散方法配制结合剂和自制的涂附装置来进行树脂结合剂线锯丝的制作。
以一定长度内锯丝的切割面积作为评价方法,金刚石磨料的用量取5个试验水平,按照锯丝制作的工艺流程,采用优化得到的树脂配比制作5根锯丝,通过切割试验研究了金刚石磨料的用量对锯丝寿命的影响。
树脂磨粒层沿锯丝轴向上厚度要一致,以保证加工工件的表面质量；树脂磨粒层在锯丝径向上要均匀,避免磨粒在锯丝基体上分布不均而造成锯丝过早磨损。为达到上述目的,研究制作了锯丝涂附装置,提高了锯丝制作的质量。
利用各组分配比优化后的结合剂和经过改进的工艺来制作树脂结合剂金刚石线锯丝,并对其进行质量评价。宏观和微观检测表明锯丝外观形貌和固化状态良好；尺寸检测表明锯丝的轴向和径向均匀一致性较好,外径极差小于0.004mm；利用自制的锯丝在往复金刚石线旋转点切割机上对硅晶体进行切割试验,结果表明锯丝的加工性能良好,加工表面质量优于电镀线锯丝的加工表面质量。
Fixed abrasive diamond wire saw is more and more attention because of its thin kerf loss,better wafer quality,high cutting efficiency,environment friendly,ability to machine hard and brittle materials,and so on.Resin bonded diamond wire saw,one of fixed abrasive diamond wire saws,will be used to process hard and brittle materials because of its simple manufacture technics,short manufacturing cycle,low cost,and better processing quality than electroplated diamond wire saw.However,resin bonded diamond wire saw easily becomes ineffective because of its poor adhesive ability,abrasion-resistance and heat-resistance.Modified research of resin adhesive was analysed in this paper.The impact of various elements to resin adhesive was researched.The manufacture technics of resin bonded diamond wire saw was also developed in this paper.
First,the feasibility of modified resin was analysed theoretically.By analysing the problem of resin bonded diamond wire saw,high-performance resin,high-performance liquid rubber,nanometer particles and silane coupling agent were used to enhance heat-resistance,abrasion-resistance,toughness and high adhesive ability.
The impact of various elements to resin adhesive was optimized by using orthogonal experiment.Manufacture technics of resinoid diamond wire was researched.Core wire and diamond abrasive were chosen and surface disposed.Resin adhesive was confected by using ultrasonic dispersion method.Resin bonded diamond wire saw was manufactured by using self-regulating coating tool.
Five test levels of diamond abrasive were taken.The research how the amount of diamonds impact the performance of resin bonded diamond wire saw was finished.Using a certain length of the wire saw cutting area evaluated the performance of the wire saw.
Resin layer along the wire axis should be well-proportioned to ensure the surface quality of workpiece.Resin layer in the radial wire should be consistent to avoid wire's abrasion early.A self-regulating coating tool was used to increase the quality of the wire.
The developed resin bonded diamond wire saw was evaluated in this paper,and it was found that resin bonded diamond wire saw had stable diametral dimension and axial dimension,good appearance.The difference of diametral dimension was less than 0.004mm.Excellent slicing performance and good surface quality were obtained when we sliced silicon crystal using resin bonded diamond wire saw.
引文
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2 J. Sugarawara, H. Hara, A. Mizoguchi. Development of Fixed-Abrasive-Grain Wire Saw with Less Cutting Loss. SEI Technical Review.2004, (58):7-11
3 王仲康.IC业材料切割设备发展状况.电子工业专用设备.2002,31(1)：21-23
4 陈秀芳, 李娟, 马德营, 等.金刚石线锯切割大直径SiC单晶.功能材料.2005,(10)：1575-1577
5 T. Hitoshi, N. Suquru, Y. Masanori. Cutting Performance of Diamond Plated Wire Tools.Journal of the Japan Society of Precision Engineering.1992,58(12):2013-2018
6 C.W. Hardin, J. Qu, A.J. Shih. Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers. Materials and Manufacturing Processes.2004, 19(2):355-367
7 侯志坚, 葛培琪, 张进生, 等.环形树脂结合剂金刚石线锯研制.金刚石与磨料磨具工程.2008,(2)：13-15
8 T. Enomoto, Y. Shimazaki, Y. Tani, et al. Development of a Resinoid Diamond Wire Containing Metal Power for Slicing a Slicing Ingot.1999,48(1):273-276
9 千叶康雅.电镀金刚石线切工具高速生产.超硬材料与宝石.2003,15(4)：36-40
10 http://www.allied-material.co.jp
11 周锐, 李剑峰, 李方义, 等.金刚石线锯的研究现状与进展.现代制造工程.2004,(6)：112-115
12 向波,贺跃辉,谢志刚,等.电镀金刚石线锯的研究现状.材料导报.2007,(8)：25-29
13 S. Wei, I. Kao. Vibration Analysis of Wiresaw Manufacturing Process and Wafer Surface Measurements. Journal of Sound and Vibration.2000,231(5):1383-1395
14 葛培琪.固结磨料金刚石锯丝制造技术.金刚石与磨料磨具工程.2006,(6)：12-13
15 沈岳文.游离磨粒线切割加工对硅晶圆品质之影响.台湾国立云林科技大学硕士论文.2003：20-58
16 I. Kao, V. Prasad, M. Bhagavat. Wafer Slicing and Wiresaw Manufacturing Technology. The NSF Grantees Conference 1997
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18 孙建章, 吕玉山, 李艳杰.电镀金刚石长丝锯制造的实验研究.机械设计与制造.1999,(6)：56-57
19 J. Sugarawara, M. Yamakawa, A. Mizoguchi. Development of Fixed-Abrasive Grain Wire Saw. SEI Technical Review.2001, (52):87-90
20 石川宪一.金刚石电沉积绞合线锯的开发.超硬材料与宝石.2004,16(54)：34-38
21 诹访部仁.金刚石细线锯的开发与加工性能.超硬材料工程.2008,20(4)：52-57
22 F. Schmid, M.B. Smith, C.P. Khattak. Kerf Reduction Using Shaped Wire. Conference Record of the IEEP Photovoltaic Specialists Conference.1993:205-208
23 W.I. Clark, A.J. Shih, C.W. Hardin, et al. Fixed Abrasive Diamond Wire Machining—Part Ⅰ:Process Monitoring and Wire Tension Force. International Journal of Machine Tools and Manufacture.2003,43(5):523-532
24 Y. Chiba, Y. Tani, T. Enomoto, et al. Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools. CIRP Annals-Manufacturing Technology.2003,52(1):281-284
25 高伟, 刘镇昌.用复合电镀法制造环形电镀金刚石线锯.金刚石与磨料磨具工程.2004,(2)：48-51
26 http://www.diamondwiretech.com/diamond_wire/diamond_wire.html
27 http://www.electronics.saint-gobain.com
28 http://www.welldiamondwiresaws.com
29 C.W. Wise, W.D. Cook, A.A. Goodwin. CTBN Rubber Phase Precipitation in Model Epoxy Resins. Polymer.2000,41(12):4625-4633
30 G. Tripathi, D. Srivastava. Effect of Carboxyl-terminated Poly (butadiene-co-acrylonitrile)(CTBN) Concentration on Thermal and Mechanical Properties of Binary Blends of Diglycidyl Ether of Bisphenol-A(DGEBA) Epoxy Resin. Materials Science and Engineering.2007, (443):262-269
31 张健, 韩孝族.液体橡胶增韧环氧树脂/咪唑体系的形态与力学性能.应用化学.2005,22(12)：1333-1337
32 Valeria D. Ramos, Helson M. da Costa, Vera L.P. Soares, et al. Modification of Epoxy Resin:a Comparison of Different Types of Elastomer. Polymer Testing. 2005,24(3):387-394
33 吴敏,施惠生.热固性酚醛树脂对环氧树脂的改性研究.房材与应用.2006,34(2)：15-17
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35 B. Wetzel, P. Rosso, F. Haupert, et al. Epoxy Nanocomposites-Fracture and Toughening Mechanisms. Engineering Fracture Mechanics.2006,73(16):2375-2398
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2 J. Sugarawara, H. Hara, A. Mizoguchi. Development of Fixed-Abrasive-Grain Wire Saw with Less Cutting Loss. SEI Technical Review.2004, (58):7-11
3 王仲康.IC业材料切割设备发展状况.电子工业专用设备.2002,31(1)：21-23
4 陈秀芳, 李娟, 马德营, 等.金刚石线锯切割大直径SiC单晶.功能材料.2005,(10)：1575-1577
5 T. Hitoshi, N. Suquru, Y. Masanori. Cutting Performance of Diamond Plated Wire Tools.Journal of the Japan Society of Precision Engineering.1992,58(12):2013-2018
6 C.W. Hardin, J. Qu, A.J. Shih. Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers. Materials and Manufacturing Processes.2004, 19(2):355-367
7 侯志坚, 葛培琪, 张进生, 等.环形树脂结合剂金刚石线锯研制.金刚石与磨料磨具工程.2008,(2)：13-15
8 T. Enomoto, Y. Shimazaki, Y. Tani, et al. Development of a Resinoid Diamond Wire Containing Metal Power for Slicing a Slicing Ingot.1999,48(1):273-276
9 千叶康雅.电镀金刚石线切工具高速生产.超硬材料与宝石.2003,15(4)：36-40
10 http://www.allied-material.co.jp
11 周锐, 李剑峰, 李方义, 等.金刚石线锯的研究现状与进展.现代制造工程.2004,(6)：112-115
12 向波,贺跃辉,谢志刚,等.电镀金刚石线锯的研究现状.材料导报.2007,(8)：25-29
13 S. Wei, I. Kao. Vibration Analysis of Wiresaw Manufacturing Process and Wafer Surface Measurements. Journal of Sound and Vibration.2000,231(5):1383-1395
14 葛培琪.固结磨料金刚石锯丝制造技术.金刚石与磨料磨具工程.2006,(6)：12-13
15 沈岳文.游离磨粒线切割加工对硅晶圆品质之影响.台湾国立云林科技大学硕士论文.2003：20-58
16 I. Kao, V. Prasad, M. Bhagavat. Wafer Slicing and Wiresaw Manufacturing Technology. The NSF Grantees Conference 1997
17 曾明,周玉梅,郭长文.固着磨料多线锯研究进展.超硬材料工程.2007,19(5)：1-5
18 孙建章, 吕玉山, 李艳杰.电镀金刚石长丝锯制造的实验研究.机械设计与制造.1999,(6)：56-57
19 J. Sugarawara, M. Yamakawa, A. Mizoguchi. Development of Fixed-Abrasive Grain Wire Saw. SEI Technical Review.2001, (52):87-90
20 石川宪一.金刚石电沉积绞合线锯的开发.超硬材料与宝石.2004,16(54)：34-38
21 诹访部仁.金刚石细线锯的开发与加工性能.超硬材料工程.2008,20(4)：52-57
22 F. Schmid, M.B. Smith, C.P. Khattak. Kerf Reduction Using Shaped Wire. Conference Record of the IEEP Photovoltaic Specialists Conference.1993:205-208
23 W.I. Clark, A.J. Shih, C.W. Hardin, et al. Fixed Abrasive Diamond Wire Machining—Part Ⅰ:Process Monitoring and Wire Tension Force. International Journal of Machine Tools and Manufacture.2003,43(5):523-532
24 Y. Chiba, Y. Tani, T. Enomoto, et al. Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools. CIRP Annals-Manufacturing Technology.2003,52(1):281-284
25 高伟, 刘镇昌.用复合电镀法制造环形电镀金刚石线锯.金刚石与磨料磨具工程.2004,(2)：48-51
26 http://www.diamondwiretech.com/diamond_wire/diamond_wire.html
27 http://www.electronics.saint-gobain.com
28 http://www.welldiamondwiresaws.com
29 C.W. Wise, W.D. Cook, A.A. Goodwin. CTBN Rubber Phase Precipitation in Model Epoxy Resins. Polymer.2000,41(12):4625-4633
30 G. Tripathi, D. Srivastava. Effect of Carboxyl-terminated Poly (butadiene-co-acrylonitrile)(CTBN) Concentration on Thermal and Mechanical Properties of Binary Blends of Diglycidyl Ether of Bisphenol-A(DGEBA) Epoxy Resin. Materials Science and Engineering.2007, (443):262-269
31 张健, 韩孝族.液体橡胶增韧环氧树脂/咪唑体系的形态与力学性能.应用化学.2005,22(12)：1333-1337
32 Valeria D. Ramos, Helson M. da Costa, Vera L.P. Soares, et al. Modification of Epoxy Resin:a Comparison of Different Types of Elastomer. Polymer Testing. 2005,24(3):387-394
33 吴敏,施惠生.热固性酚醛树脂对环氧树脂的改性研究.房材与应用.2006,34(2)：15-17
34 B.B. Johnsen, A.J. Kinloch, R.D. Mohammed, et al. Toughening Mechanisms of Nanoparticle-Modified Epoxy Polymers. Polymer.2007,48(2):530-541
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