KDP晶体不同加工表面损伤检测与损伤机理分析
|
摘要
KDP(磷酸二氢钾,KH_2PO_4)晶体,因其具有较大的电光和非线性光学系数、高的激光损伤阈值、低的光学吸收系数、高的光学均匀性和良好的透过波段等特点而被广泛应用于激光变频、电光调制和光快速开关以及惯性约束核聚变等高技术领域。随着科学技术的不断发展,要求这种功能晶体器件的尺寸规格越来越大,厚度要求越来越薄,加工精度和表面完整性也越来越高。然而,由于KDP晶体具有易潮解、硬度低以及各向异性等特性,是目前公认的难加工材料之一。KDP晶体的加工通常包括切割、车削、磨削、抛光等。磨削是KDP晶体常用的加工方法之一,但由于磨削过程中影响表面质量的因素较多,为有效的提高磨削加工质量,对KDP晶体磨削去除机理及磨削产生的表面及亚表面损伤的检测是十分必要的。
本文在阅读大量参考文献的基础上,参考硬脆材料的研究方法,对KDP晶体的加工损伤进行了研究。利用光学显微镜及SEM等设备对由切割、研磨、抛光及磨削等加工后的KDP晶体表面进行观测;利用截面法、择优蚀刻法及角度抛光法对切割、研磨及磨削加工后的KDP晶体亚表面损伤进行了研究。同时,研究了各向异性及进给量对磨削表面层质量的影响,并通过划痕实验对KDP晶体磨削加工损伤机理进行了实验研究。
通过以上研究得到如下结论:不同加工方法加工出的试件表面质量及亚表面损伤均有所不同;不同晶向上磨削表面质量及划痕表面层损伤均存在差异。由金刚石线切割产生的裂纹深度为85.59μm,利用#3000砂纸研磨后的晶体损伤深度为19.32μm。通过选择合适的抛光液及清洗方法,抛光表面粗糙度达到1.556nm。采用#600砂轮自旋转磨削,当进给量分别为10μm/min和40μm/min时,磨削所产生的亚表面最大损伤深度值分别为7.41μm和8.96μm。采用平面磨削时,沿(001)晶面不同晶向磨削后的晶体表面质量也呈现出一定的各向异性。KDP晶体(001)晶面划痕实验表明,随着径向力的增加,划痕表面从塑性去除为主转变到脆性去除为主;亚表面首先产生大量位错然后出现中位及横向裂纹,从而导致晶体损伤深度的增加及材料的脆性去除。同时,不同晶向上表面裂纹扩展方向、摩擦系数以及亚表面裂纹形状、损伤深度、位错腐蚀坑形状均存在较大的差异。
KDP(Potassium dihydrogen phosphate,KH_2PO_4) crystal,based on its biggish electro-optic and non-linear optical coefficient,higher laser damage threshold,lower optical absorption coefficient,higher optical uniformity and suitably transparent wave band,is widely used in high tech fields,such as laser frequency conversion,electro-optic modulation, optical speediness switch,inertia control fusion and so on.With the development of science and technology,KDP crystal requires larger and thinner,machining accuracy and surface integrity also requires higher.However,it's well-known that KDP crystal is one of most difficult machining materials because it has several disadvantages such as soft,fragile, hygroscopic and anisotropy.Such as cutting,turning,grinding and polishing are common methods in KDP crystal mahining.Grinding is one of machining method in KDP crystal processing.Because grinding is a complicated mechanical process,many factors can influence the surface quality,so it is necessary to study the removal mechanisms of KDP crystal grinding and the damage detection of machined surface in order to improve the quality of grinding.
Based on lots of references read and reference the method used on hard and brittle materials,the machining damage of KDP crystal was investigate in this paper.Such as optical microscope and SEM were used to detect the surface machined by cutting,lapping,polishing and grinding;cross section,selective etching and angle polishing were used to study the subsurface damage generated by cutting lapping and grinding.Besides,the influence of anisotropy and feed to quality of grinding surface were studied,scratch experiment was taken to investigate the damage mechanism of KDP crystal.
The results indicated that:the surface quality and subsurface damage were different on differents machined surface;both the surface quality and the scratch damage of surface layer were different with the change of crystal orientation.The depth of subsurface damage of cutting by diamond wire and lapping by #3000 abrasive papers was 85.59μm and 19.32μm, respectively.When the polishing slurry and the cleaning method of polished surface were suitable,surface roughness reached 1.556nm.When KDP crystal was machined by rotational grinding with #600 grinding wheel,the subsurface damage depth was 7.41μm and 8.96μm corresponding to the feed was 10μm and 40μm.Anisotropy was showed by the ground surface quality machined in different orientation in method of surface grinding on(001) crystal plane.Scratch experiment on(001) plane of KDP crystal showed that:with the increase of radial force,surface deformation changed from the region of mainly plastic to the region of mainly brittle along the scratch;subsurface damage changed from dislocation to middle crack and transverse crack so that the damage of crystal was increased and made material removal in brittle mode.The orientation of scratch crack propagate,friction coefficient on surface and the shape of crack,depth of damage,etching pit of dislocation in subsurface were different with the change of scratch direction.
本文在阅读大量参考文献的基础上,参考硬脆材料的研究方法,对KDP晶体的加工损伤进行了研究。利用光学显微镜及SEM等设备对由切割、研磨、抛光及磨削等加工后的KDP晶体表面进行观测;利用截面法、择优蚀刻法及角度抛光法对切割、研磨及磨削加工后的KDP晶体亚表面损伤进行了研究。同时,研究了各向异性及进给量对磨削表面层质量的影响,并通过划痕实验对KDP晶体磨削加工损伤机理进行了实验研究。
通过以上研究得到如下结论:不同加工方法加工出的试件表面质量及亚表面损伤均有所不同;不同晶向上磨削表面质量及划痕表面层损伤均存在差异。由金刚石线切割产生的裂纹深度为85.59μm,利用#3000砂纸研磨后的晶体损伤深度为19.32μm。通过选择合适的抛光液及清洗方法,抛光表面粗糙度达到1.556nm。采用#600砂轮自旋转磨削,当进给量分别为10μm/min和40μm/min时,磨削所产生的亚表面最大损伤深度值分别为7.41μm和8.96μm。采用平面磨削时,沿(001)晶面不同晶向磨削后的晶体表面质量也呈现出一定的各向异性。KDP晶体(001)晶面划痕实验表明,随着径向力的增加,划痕表面从塑性去除为主转变到脆性去除为主;亚表面首先产生大量位错然后出现中位及横向裂纹,从而导致晶体损伤深度的增加及材料的脆性去除。同时,不同晶向上表面裂纹扩展方向、摩擦系数以及亚表面裂纹形状、损伤深度、位错腐蚀坑形状均存在较大的差异。
KDP(Potassium dihydrogen phosphate,KH_2PO_4) crystal,based on its biggish electro-optic and non-linear optical coefficient,higher laser damage threshold,lower optical absorption coefficient,higher optical uniformity and suitably transparent wave band,is widely used in high tech fields,such as laser frequency conversion,electro-optic modulation, optical speediness switch,inertia control fusion and so on.With the development of science and technology,KDP crystal requires larger and thinner,machining accuracy and surface integrity also requires higher.However,it's well-known that KDP crystal is one of most difficult machining materials because it has several disadvantages such as soft,fragile, hygroscopic and anisotropy.Such as cutting,turning,grinding and polishing are common methods in KDP crystal mahining.Grinding is one of machining method in KDP crystal processing.Because grinding is a complicated mechanical process,many factors can influence the surface quality,so it is necessary to study the removal mechanisms of KDP crystal grinding and the damage detection of machined surface in order to improve the quality of grinding.
Based on lots of references read and reference the method used on hard and brittle materials,the machining damage of KDP crystal was investigate in this paper.Such as optical microscope and SEM were used to detect the surface machined by cutting,lapping,polishing and grinding;cross section,selective etching and angle polishing were used to study the subsurface damage generated by cutting lapping and grinding.Besides,the influence of anisotropy and feed to quality of grinding surface were studied,scratch experiment was taken to investigate the damage mechanism of KDP crystal.
The results indicated that:the surface quality and subsurface damage were different on differents machined surface;both the surface quality and the scratch damage of surface layer were different with the change of crystal orientation.The depth of subsurface damage of cutting by diamond wire and lapping by #3000 abrasive papers was 85.59μm and 19.32μm, respectively.When the polishing slurry and the cleaning method of polished surface were suitable,surface roughness reached 1.556nm.When KDP crystal was machined by rotational grinding with #600 grinding wheel,the subsurface damage depth was 7.41μm and 8.96μm corresponding to the feed was 10μm and 40μm.Anisotropy was showed by the ground surface quality machined in different orientation in method of surface grinding on(001) crystal plane.Scratch experiment on(001) plane of KDP crystal showed that:with the increase of radial force,surface deformation changed from the region of mainly plastic to the region of mainly brittle along the scratch;subsurface damage changed from dislocation to middle crack and transverse crack so that the damage of crystal was increased and made material removal in brittle mode.The orientation of scratch crack propagate,friction coefficient on surface and the shape of crack,depth of damage,etching pit of dislocation in subsurface were different with the change of scratch direction.
引文
[1]王占国.半导体材料的现状和发展趋势.人工晶体学报.1997,3-4:284-290.
[2]Christopher J S.The National Ignition Facility:The world' s largest optical system.Proceedings of SPIE.2007,6834:683402-1-683402-9.
[3]凌玲.半导体材料的发展现状,新材料产业.2003(6):6-10.
[4]中国电子工业年鉴编委会.中国电子工业年鉴.北京:北京电子工业出版社,2002.
[5]苏根博,曾金波,贺友平等.大截面KDP晶体在激光核聚变研究中的应用.硅酸盐学报.1997,25(6):717-719.
[6]范滇元,贺贤士.惯性约束聚变能源与激光驱动器.大自然探索.1999。18(1):31-35.
[7]George H M,Edward I M,Craig R.W.The National Ignition Facility:enabling fusion ignition for the 21st century.Nuclear Fusion.2004,44:S228-S238.
[8]Paisner J A,Boyes J D,Kumpan S A et al.Conceptual design of the national ignition facility.Proceedings of SPIE.1997,2633:2-12.
[9]叶青.法国惯性约束聚变计划概述.激光与光电子学进展.2000,415:4-6.
[10]Fedder R H,Geraghty P,Locke Set al.NIF Pockels Cell and Frequency Conversion Crystals.Proceedings of SPIE.2004,534:121-126.
[11]Campbell J H,Maney R T,Jatherton Let al.Large-aperture,High-damage-threshold optics for beamlet.Lawrence Livermore National Laboratory.UCRL-LR-105821-95-1,1995:1-10.
[12]Barkauskas M,Melninkaitis A,Miksys D et al.Characterization of KDP crystals used in large aperture doublers and triplers.Proceedings of SPIE.2007,6403:64031V-1-64031V-10.
[13]Barkauskas M,Melninkaitis A,Sinkevicius M et al.Linear and nonlinear absorption and defects formation in KDP crystals used for large aperture doublers and triplers.Proceedings of SPIE.2005,5949:59491T-1-59491T-9.
[14]Atherton J,Montesanti R,Aikens D等.国家点火装置光学元件的制造.强激光技术进展.1999,3:12-18.
[15]杨力.先进光学制造技术.北京:科学出版社,2001.
[16]朱健强.神光Ⅱ高功率激光实验装置研制.中国科学院院刊.2005,20(01):42-44.
[17]王淦昌.激光惯性约束核聚变(ICF)最新进展简述.核科学与工程,1997,17(3):266-269.
[18]李仲谨等.无机精细化学品.北京:化学工业出版社,2005.
[19]Pritula I,Kosinova A,Kolybayeva M.Optical,structural and microhardness properties of KDP crystals grown from urea-doped solutions.Materials Research Bulletin.2008,43(10):2778-2789.
[20]Eremina T A,Kuznetsov V A,Okhrimenko T M et al.Structures of impurity defects in KDP and their influence on quality of crystals.Proceedings of SPIE.2003,5136:153-158.
[21]Andrews S R,Cowley R A.X-ray scattering from critical fluctuations and domain walls in KDP and DKDP.Journal of Physics C:Solid State Physics.1986,19(4):615-635.
[22]Nelmes R J,Meyer G M,Tibballs J E.The crystal structure of tetragonal KH_2PO_4,and KD_2PO_4 as a function of temperature.Journal of Physics C:Solid State Physics.1982,15(13):59-75.
[23]王坤鹏,房昌水,张建秀等.KDP(KD~*P)晶体结构研究进展.人工晶体学报.2004,33(2):262-265.
[24]谢英明,李新政,郑滨等.KDP(KH_2PO_4)晶体材料的研究进展.河北工业科技.2006,23(6):377-379.
[25]曹先锁.KDP晶体磨削加工表层损伤的检测与分析(硕士学位论文).大连:大连理工大学,2007.
[26]仲维卓,于锡铃,罗豪甦等.KDP晶体生长基元与形成机理.中国科学(E辑).1998,28(4):320-324.
[27]张克从.近代晶体学基础(上).北京:科学出版社,1987.
[28]Asakuma Y,Jee L,Nishimura M et al.Quantum estimation of impurity effect for KDP crystal growth.Journal of Molecular Structure:THEOCHEM.2008,851(1-3):225-231.
[29]Kumaresan P,Babu S M,Anbarasan P M.Effect of irradiation of swift heavy ions on dyes-doped KDP crystals for laser applications.Journal of Crystal Growth.2008,310(7-9):1999-2004.
[30]Ye Liwang,Li Zhengdong,Su Genbo et al.Study on the optical properties of rapidly grown KDP crystals.Optics Communications.2007,275:399-403.
[31]王波,房昌水,王圣来等.KDP/DKDP晶体生长的研究进展.人工晶体学报.2007,36(2):247-252.
[32]Li Guohui,He Youping,Su Genbo et al.Study on rapid growth of KH_2PO_4 and its characterization.Crystal Research Technology.2005,40(3):217-221.
[33]Xu Dongli,Xue Dongfeng.Chemical bond analysis of the crystal growth of KDP and ADP.Journal of Crystal Growth.2006,286(1):108-113.
[34]Antunes J M,Cavaleiro A,Menezes L F et al.Ultra-microhardness testing procedure with Vickers indenter.Surface and Coatings Technology.2002,149(1):27-35.
[35]Zarudi I,Zhang L C,Swain M V.Behavior of monocrystalline silicon under cyclic microindentations with a spherical indenter.Applied Physics Letters.2003,82(7):1027-1029.
[36]Lim Y Y,Audhri M M.The effect of the indenter load on the nanohardness of ductile metals:an experimental study on polycrystalline work-hardened and annealed oxygen-free copper.Philosophical Magazine A.1999,79(12):2979-3000.
[37]Sengupta S,Sengupta S P.Microhardness studies in gel-grown ADP and KDP single crystals.Bulletin of Materials Science.1992,15(4):333-338.
[38]Shanmugham M,Gnanam F D,Ramasamy P.Growth of KDP-ADP mixed crystals in gel electrical conductivity and microhardness measurements.Journal of Materials Science Letters.1986,5:174-176.
[39]Rajesh N P,Kannan V,Raghavan P Set al.Optical and microhardness studies of KDP crystals grown from aqueous solutions with organic additives.Materials Letters.2002,52(4-5):326-328.
[40]王景贺.KDP晶体力学特性对超光滑表面形成的影响研究(博士学位论文).哈尔滨:哈尔滨工业大学,2006.
[41]史济来.努普硬度试验的特点及其应用.江苏计量.1993,9(6):30-32.
[42]王庆山.努氏硬度及其与维氏硬度的换算.机车车辆工艺.2001,2:43-44.
[43]Lahaye P,Chomont C,Dumont P et al.Using a Design of Experiment method to improve KDP crystals machining process.SPIE.1999,3739:388-394.
[44]杨福兴.KDP晶体超精密加工技术的研究.制造技术及机床,2003,9:63-99.
[45]Yoshiharu N,Masanori K,Masahiro N.Single point diamond turning of KDP inorganic optical crystal for laser fusion.Journal of the Japan SocietyPrecisionEngineering.1998,64(10):1487-1491.
[46]Arrasmith S R,Kozhinova I A,Gregg L L et al.Details of the polishing spot in magnetorheological finishing(MRF).Proceedings of SPIE.1999,3782:92-100.
[47]Yoshiharu N,Kunio Y,Hidetsugu Y.Ultraprecisiongrinding of optical materials for high-power lasers.Proceedings of SPIE.1998,3244:320-330.
[48]Yoshiharu N,Masanori K.Ultraprecision grinding of potassium dihydrogen phosphate crystals for getting optical surfaces.Proceedings of SPIE.1999,3578:692-693.
[49]Shen Jian,Liu Shouhua,Yi Kui et al.Subsurface damage in optical substrates.Optik.2005,116(6):288-294.
[50]李改灵,吴宇列,王卓等.光学材料亚表面损伤深度破坏性测量技术的实验研究.航空精密制造技术,2006,42(6):19-22.
[51]张艳珍,孙洵,蒋晓东等.KDP晶体体缺陷和损伤的观测方法研究.人工晶体学报.2006,35(3):545-549.
[52]Rajesh N P.Optical and microhardness studies of KDP crystals grown from aqueous solutions with organic additives.Materials Letters.2002,52(4):326-328.
[53]王昆鹏,张建秀,房昌水等.KDP晶体本征中性点缺陷的第—性研究.强激光与粒子束.2005,17(10):1523-1527.
[54]Bouzakis K D,Michailidis N,Hadjiyiannis Set al.The effect of specimen roughness and indenter tip geometry on the determination accuracy of thin hard coatings stress-strain laws by nanoindentation.Materials Characterization.2003,49(2):149-156.
[55]Agarwal S,Rap P V.Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding.International Journal of Machine Tools & Manufacture.2008,48(6):698-710.
[56]Nabarro F R N.Dislocations in solids.Amsterdam:North-Holland Pub.Co.,1979.
[57]王宇,蔡亚梅,滕霖.超光滑表面清洗技术现状及发展趋势.航空精密制造技术.2003,39(2):1-9.
[58]滕晓辑.KDP晶体潮解机理及材料溶解可加工性试验研究(硕士学位论文).大连:大连理工大学,2008.
[59]史兴宽,任敬心.超光滑表面清洗技术的最新进展.航空精密制术。1997,33(1):9-12.
[60]Lee T C,Chan C W.Mechanism of the ultrasonic machining of ceramic composites,Journal of Material Processing Technology.1997,71(2):195-201.
[61]张晋宽,滕霖,王宇.超光滑表面清洗技术发展研究.航空精密制技.2007,43(2):11-14.
[62]钟迪生.光学元件表面的清洗.激光与红外.1985,4:15-18.
[63]官月英.LBO晶体加工研究.人工晶体学报.1997,26(3-4):394.
[64]Xu D L,Xue D F,Ratajczak H.Morphology and structure studies of KDP and ADP crystallites in the water and ethanol solutions.Journal of Molecular Structure.2005,740(1-3):37-45.
[65]Xu D L.Xue D F.Morphology control of KDP crystallites.Physica B.2005.370:84-89.
[66]董志刚,田业冰,康仁科等.硅片超精密磨床的发展状况.新技术与新设备.2004,113:54-66.
[67]片桐匡教,鞋波羲治.超精密平面研削にょる無机非缘性光孥结晶KDP の光学面创成.精密工学会誌.1999,65(6):888-892.
[68]Lawn B R,Swain M V.Microfracture beneath point indentations in brittle solids.Journal of Material Science.1975,10(1):113-122.
[69]Richard A,Schultz,Martin C et al.Single crystal cleavage of brittle materials.International Journal of Fracture.1994,65(4):291-312.
[70]Riedle J,Gumbsch P,Fischmeister H F.Cleavage Anisotropy in Tungsten Single Crystals.Physical Review Letters.1996,76(19):3594-3597.
[71]J.弗里埃德尔.位错(增订版).北京:科学出版社,1984.
[72]Fang T,Lambropoulos J C.Microhardness and Indentation Fracture of Potassium Dihydrogen Phosphate(KDP).Journal of the American Ceramic Society.2002,85(11):174-178.
[73]曹先锁,吴东江,王奔等.KDP晶体各向异性力学性能分析.人工晶体学报.2008,37(3):704-709.
[74]张银霞.单晶硅片超精密磨削加工表面层损伤的研究:(博士学位论文).大连:大连理工大学,2006.
[75]朱洪涛,林滨,吴辉等.陶瓷磨削机理及其对表面/亚表面损伤的影响.精密制造与自动化.2004,第2期:15-18.
[76]邓朝晖,张璧,周志雄等.陶瓷磨削的表面/亚表面损伤.湖南大学学报.2002,29(5):61-71.
[77]邓朝晖,刘建,曹德芳等.纳米结构陶瓷图层精密磨削的材料去除机理及磨削加工技术.金刚石与磨料磨具工程.2003,6:5-11.
[78]Desa O,Bahadur S.Material removal and subsurface damage studies in dry and lubricated single-point scratch tests on alumina and silicon nitride.Wear.1999,225-229(2):1264-1275.
[79]Zhang B,Zheng X L,Tokura H et al.Grinding induced damage in ceramics.Journal of Materials Processing Technology.2003,132(1-3):353-364.
[80]吴东江,曹先锁,王强国等.KDP晶体加工表面的亚表面损伤检测与分析.光学精密工程,2007,15(11):1715-1720.
[81]张胜利.超精密磨削硅片表层损伤检测的试验研究:(硕士学位论文).大连:大连理工大学.2005.
[82]Bulsaraa V H,Chandrasekarb S.Direct Observation of Contact Damage Around Scratches in Brittle Solids.Proceedings of SPIE.1997,3060:76-88.
[83]Ashida K,Morita N,Yoshida Y.Study on nano-machining process using mechanism of a friction force microscope.JSME International Journal Series C.2001,44(1):244-253.
[84]黄依森,赵庆兰,曾金波.大截面KDP晶体的生长与位错的检测.硅酸盐学报.1990,18(2):158-164.
[85]Masayoshi N,Tsunetaka S,Toshiro E.Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope.Surface and Coatings Technology.2003,169-170(2):743-747.
[86]Quinn,Terence F J.Physical analysis for tribology.New York:Cambridge University Press,2005.
[87]Guin C H,Katrich M D,Savinkov A I,et al.Plastic Strain and Dislocation Structure of the KDP Group Crystals.Kristall and Technik.1980,15(4):479-488.
[88]王景贺,陈明君,董申等.KDP晶体单点金刚石切削脆塑转变机理的研究.光电工程.2005,32(7):67-88.
[89]Swanson P L,Fairbanks C J,Lawn B R et al.Crack-interfacegrain bridging as a fracture resistance mechanism in ceramics.Ⅰ:Experimental study on alumina.Journal of the American Ceramic Society.1987,70(4):279-289.
[90]Tvergaard V,Hutchinson J W.The relation between crack growth resistance and fracture process parameters in e]astic-plastic solids.Journal of the Mechanics and Physics of Solids.1992,40(6):1377-1397.
[91]陈金长,黄依森,魏培才.KDP晶体中位错的研究.物理学报.1985,34(3):377-380.
[92]Wheeler E K,Mcwhirter J T,Whitman P K,et al.Scatter loss from environmental degradation of KDP crystals.Proceedings of SPIE.1999,3902:451-459.
[2]Christopher J S.The National Ignition Facility:The world' s largest optical system.Proceedings of SPIE.2007,6834:683402-1-683402-9.
[3]凌玲.半导体材料的发展现状,新材料产业.2003(6):6-10.
[4]中国电子工业年鉴编委会.中国电子工业年鉴.北京:北京电子工业出版社,2002.
[5]苏根博,曾金波,贺友平等.大截面KDP晶体在激光核聚变研究中的应用.硅酸盐学报.1997,25(6):717-719.
[6]范滇元,贺贤士.惯性约束聚变能源与激光驱动器.大自然探索.1999。18(1):31-35.
[7]George H M,Edward I M,Craig R.W.The National Ignition Facility:enabling fusion ignition for the 21st century.Nuclear Fusion.2004,44:S228-S238.
[8]Paisner J A,Boyes J D,Kumpan S A et al.Conceptual design of the national ignition facility.Proceedings of SPIE.1997,2633:2-12.
[9]叶青.法国惯性约束聚变计划概述.激光与光电子学进展.2000,415:4-6.
[10]Fedder R H,Geraghty P,Locke Set al.NIF Pockels Cell and Frequency Conversion Crystals.Proceedings of SPIE.2004,534:121-126.
[11]Campbell J H,Maney R T,Jatherton Let al.Large-aperture,High-damage-threshold optics for beamlet.Lawrence Livermore National Laboratory.UCRL-LR-105821-95-1,1995:1-10.
[12]Barkauskas M,Melninkaitis A,Miksys D et al.Characterization of KDP crystals used in large aperture doublers and triplers.Proceedings of SPIE.2007,6403:64031V-1-64031V-10.
[13]Barkauskas M,Melninkaitis A,Sinkevicius M et al.Linear and nonlinear absorption and defects formation in KDP crystals used for large aperture doublers and triplers.Proceedings of SPIE.2005,5949:59491T-1-59491T-9.
[14]Atherton J,Montesanti R,Aikens D等.国家点火装置光学元件的制造.强激光技术进展.1999,3:12-18.
[15]杨力.先进光学制造技术.北京:科学出版社,2001.
[16]朱健强.神光Ⅱ高功率激光实验装置研制.中国科学院院刊.2005,20(01):42-44.
[17]王淦昌.激光惯性约束核聚变(ICF)最新进展简述.核科学与工程,1997,17(3):266-269.
[18]李仲谨等.无机精细化学品.北京:化学工业出版社,2005.
[19]Pritula I,Kosinova A,Kolybayeva M.Optical,structural and microhardness properties of KDP crystals grown from urea-doped solutions.Materials Research Bulletin.2008,43(10):2778-2789.
[20]Eremina T A,Kuznetsov V A,Okhrimenko T M et al.Structures of impurity defects in KDP and their influence on quality of crystals.Proceedings of SPIE.2003,5136:153-158.
[21]Andrews S R,Cowley R A.X-ray scattering from critical fluctuations and domain walls in KDP and DKDP.Journal of Physics C:Solid State Physics.1986,19(4):615-635.
[22]Nelmes R J,Meyer G M,Tibballs J E.The crystal structure of tetragonal KH_2PO_4,and KD_2PO_4 as a function of temperature.Journal of Physics C:Solid State Physics.1982,15(13):59-75.
[23]王坤鹏,房昌水,张建秀等.KDP(KD~*P)晶体结构研究进展.人工晶体学报.2004,33(2):262-265.
[24]谢英明,李新政,郑滨等.KDP(KH_2PO_4)晶体材料的研究进展.河北工业科技.2006,23(6):377-379.
[25]曹先锁.KDP晶体磨削加工表层损伤的检测与分析(硕士学位论文).大连:大连理工大学,2007.
[26]仲维卓,于锡铃,罗豪甦等.KDP晶体生长基元与形成机理.中国科学(E辑).1998,28(4):320-324.
[27]张克从.近代晶体学基础(上).北京:科学出版社,1987.
[28]Asakuma Y,Jee L,Nishimura M et al.Quantum estimation of impurity effect for KDP crystal growth.Journal of Molecular Structure:THEOCHEM.2008,851(1-3):225-231.
[29]Kumaresan P,Babu S M,Anbarasan P M.Effect of irradiation of swift heavy ions on dyes-doped KDP crystals for laser applications.Journal of Crystal Growth.2008,310(7-9):1999-2004.
[30]Ye Liwang,Li Zhengdong,Su Genbo et al.Study on the optical properties of rapidly grown KDP crystals.Optics Communications.2007,275:399-403.
[31]王波,房昌水,王圣来等.KDP/DKDP晶体生长的研究进展.人工晶体学报.2007,36(2):247-252.
[32]Li Guohui,He Youping,Su Genbo et al.Study on rapid growth of KH_2PO_4 and its characterization.Crystal Research Technology.2005,40(3):217-221.
[33]Xu Dongli,Xue Dongfeng.Chemical bond analysis of the crystal growth of KDP and ADP.Journal of Crystal Growth.2006,286(1):108-113.
[34]Antunes J M,Cavaleiro A,Menezes L F et al.Ultra-microhardness testing procedure with Vickers indenter.Surface and Coatings Technology.2002,149(1):27-35.
[35]Zarudi I,Zhang L C,Swain M V.Behavior of monocrystalline silicon under cyclic microindentations with a spherical indenter.Applied Physics Letters.2003,82(7):1027-1029.
[36]Lim Y Y,Audhri M M.The effect of the indenter load on the nanohardness of ductile metals:an experimental study on polycrystalline work-hardened and annealed oxygen-free copper.Philosophical Magazine A.1999,79(12):2979-3000.
[37]Sengupta S,Sengupta S P.Microhardness studies in gel-grown ADP and KDP single crystals.Bulletin of Materials Science.1992,15(4):333-338.
[38]Shanmugham M,Gnanam F D,Ramasamy P.Growth of KDP-ADP mixed crystals in gel electrical conductivity and microhardness measurements.Journal of Materials Science Letters.1986,5:174-176.
[39]Rajesh N P,Kannan V,Raghavan P Set al.Optical and microhardness studies of KDP crystals grown from aqueous solutions with organic additives.Materials Letters.2002,52(4-5):326-328.
[40]王景贺.KDP晶体力学特性对超光滑表面形成的影响研究(博士学位论文).哈尔滨:哈尔滨工业大学,2006.
[41]史济来.努普硬度试验的特点及其应用.江苏计量.1993,9(6):30-32.
[42]王庆山.努氏硬度及其与维氏硬度的换算.机车车辆工艺.2001,2:43-44.
[43]Lahaye P,Chomont C,Dumont P et al.Using a Design of Experiment method to improve KDP crystals machining process.SPIE.1999,3739:388-394.
[44]杨福兴.KDP晶体超精密加工技术的研究.制造技术及机床,2003,9:63-99.
[45]Yoshiharu N,Masanori K,Masahiro N.Single point diamond turning of KDP inorganic optical crystal for laser fusion.Journal of the Japan SocietyPrecisionEngineering.1998,64(10):1487-1491.
[46]Arrasmith S R,Kozhinova I A,Gregg L L et al.Details of the polishing spot in magnetorheological finishing(MRF).Proceedings of SPIE.1999,3782:92-100.
[47]Yoshiharu N,Kunio Y,Hidetsugu Y.Ultraprecisiongrinding of optical materials for high-power lasers.Proceedings of SPIE.1998,3244:320-330.
[48]Yoshiharu N,Masanori K.Ultraprecision grinding of potassium dihydrogen phosphate crystals for getting optical surfaces.Proceedings of SPIE.1999,3578:692-693.
[49]Shen Jian,Liu Shouhua,Yi Kui et al.Subsurface damage in optical substrates.Optik.2005,116(6):288-294.
[50]李改灵,吴宇列,王卓等.光学材料亚表面损伤深度破坏性测量技术的实验研究.航空精密制造技术,2006,42(6):19-22.
[51]张艳珍,孙洵,蒋晓东等.KDP晶体体缺陷和损伤的观测方法研究.人工晶体学报.2006,35(3):545-549.
[52]Rajesh N P.Optical and microhardness studies of KDP crystals grown from aqueous solutions with organic additives.Materials Letters.2002,52(4):326-328.
[53]王昆鹏,张建秀,房昌水等.KDP晶体本征中性点缺陷的第—性研究.强激光与粒子束.2005,17(10):1523-1527.
[54]Bouzakis K D,Michailidis N,Hadjiyiannis Set al.The effect of specimen roughness and indenter tip geometry on the determination accuracy of thin hard coatings stress-strain laws by nanoindentation.Materials Characterization.2003,49(2):149-156.
[55]Agarwal S,Rap P V.Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding.International Journal of Machine Tools & Manufacture.2008,48(6):698-710.
[56]Nabarro F R N.Dislocations in solids.Amsterdam:North-Holland Pub.Co.,1979.
[57]王宇,蔡亚梅,滕霖.超光滑表面清洗技术现状及发展趋势.航空精密制造技术.2003,39(2):1-9.
[58]滕晓辑.KDP晶体潮解机理及材料溶解可加工性试验研究(硕士学位论文).大连:大连理工大学,2008.
[59]史兴宽,任敬心.超光滑表面清洗技术的最新进展.航空精密制术。1997,33(1):9-12.
[60]Lee T C,Chan C W.Mechanism of the ultrasonic machining of ceramic composites,Journal of Material Processing Technology.1997,71(2):195-201.
[61]张晋宽,滕霖,王宇.超光滑表面清洗技术发展研究.航空精密制技.2007,43(2):11-14.
[62]钟迪生.光学元件表面的清洗.激光与红外.1985,4:15-18.
[63]官月英.LBO晶体加工研究.人工晶体学报.1997,26(3-4):394.
[64]Xu D L,Xue D F,Ratajczak H.Morphology and structure studies of KDP and ADP crystallites in the water and ethanol solutions.Journal of Molecular Structure.2005,740(1-3):37-45.
[65]Xu D L.Xue D F.Morphology control of KDP crystallites.Physica B.2005.370:84-89.
[66]董志刚,田业冰,康仁科等.硅片超精密磨床的发展状况.新技术与新设备.2004,113:54-66.
[67]片桐匡教,鞋波羲治.超精密平面研削にょる無机非缘性光孥结晶KDP の光学面创成.精密工学会誌.1999,65(6):888-892.
[68]Lawn B R,Swain M V.Microfracture beneath point indentations in brittle solids.Journal of Material Science.1975,10(1):113-122.
[69]Richard A,Schultz,Martin C et al.Single crystal cleavage of brittle materials.International Journal of Fracture.1994,65(4):291-312.
[70]Riedle J,Gumbsch P,Fischmeister H F.Cleavage Anisotropy in Tungsten Single Crystals.Physical Review Letters.1996,76(19):3594-3597.
[71]J.弗里埃德尔.位错(增订版).北京:科学出版社,1984.
[72]Fang T,Lambropoulos J C.Microhardness and Indentation Fracture of Potassium Dihydrogen Phosphate(KDP).Journal of the American Ceramic Society.2002,85(11):174-178.
[73]曹先锁,吴东江,王奔等.KDP晶体各向异性力学性能分析.人工晶体学报.2008,37(3):704-709.
[74]张银霞.单晶硅片超精密磨削加工表面层损伤的研究:(博士学位论文).大连:大连理工大学,2006.
[75]朱洪涛,林滨,吴辉等.陶瓷磨削机理及其对表面/亚表面损伤的影响.精密制造与自动化.2004,第2期:15-18.
[76]邓朝晖,张璧,周志雄等.陶瓷磨削的表面/亚表面损伤.湖南大学学报.2002,29(5):61-71.
[77]邓朝晖,刘建,曹德芳等.纳米结构陶瓷图层精密磨削的材料去除机理及磨削加工技术.金刚石与磨料磨具工程.2003,6:5-11.
[78]Desa O,Bahadur S.Material removal and subsurface damage studies in dry and lubricated single-point scratch tests on alumina and silicon nitride.Wear.1999,225-229(2):1264-1275.
[79]Zhang B,Zheng X L,Tokura H et al.Grinding induced damage in ceramics.Journal of Materials Processing Technology.2003,132(1-3):353-364.
[80]吴东江,曹先锁,王强国等.KDP晶体加工表面的亚表面损伤检测与分析.光学精密工程,2007,15(11):1715-1720.
[81]张胜利.超精密磨削硅片表层损伤检测的试验研究:(硕士学位论文).大连:大连理工大学.2005.
[82]Bulsaraa V H,Chandrasekarb S.Direct Observation of Contact Damage Around Scratches in Brittle Solids.Proceedings of SPIE.1997,3060:76-88.
[83]Ashida K,Morita N,Yoshida Y.Study on nano-machining process using mechanism of a friction force microscope.JSME International Journal Series C.2001,44(1):244-253.
[84]黄依森,赵庆兰,曾金波.大截面KDP晶体的生长与位错的检测.硅酸盐学报.1990,18(2):158-164.
[85]Masayoshi N,Tsunetaka S,Toshiro E.Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope.Surface and Coatings Technology.2003,169-170(2):743-747.
[86]Quinn,Terence F J.Physical analysis for tribology.New York:Cambridge University Press,2005.
[87]Guin C H,Katrich M D,Savinkov A I,et al.Plastic Strain and Dislocation Structure of the KDP Group Crystals.Kristall and Technik.1980,15(4):479-488.
[88]王景贺,陈明君,董申等.KDP晶体单点金刚石切削脆塑转变机理的研究.光电工程.2005,32(7):67-88.
[89]Swanson P L,Fairbanks C J,Lawn B R et al.Crack-interfacegrain bridging as a fracture resistance mechanism in ceramics.Ⅰ:Experimental study on alumina.Journal of the American Ceramic Society.1987,70(4):279-289.
[90]Tvergaard V,Hutchinson J W.The relation between crack growth resistance and fracture process parameters in e]astic-plastic solids.Journal of the Mechanics and Physics of Solids.1992,40(6):1377-1397.
[91]陈金长,黄依森,魏培才.KDP晶体中位错的研究.物理学报.1985,34(3):377-380.
[92]Wheeler E K,Mcwhirter J T,Whitman P K,et al.Scatter loss from environmental degradation of KDP crystals.Proceedings of SPIE.1999,3902:451-459.