硅基BCB工艺X波段发夹型带通滤波器的实现
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摘要
设计了发夹型微带线带通滤波器,并通过电磁仿真软件高频结构仿真器(HFSS)进行优化。以高阻硅为衬底,以大厚度低损耗因子的苯并环丁烯(BCB)为介质,通过MEMS加工技术制作了中心频率8. 6 GHz、带宽为9%的X波段带通滤波器样品。给出了详细的工艺流程,并就关键步骤进行介绍。给出了仿真结果与测试结果的对比,测试结果与仿真结果基本相符,制得的滤波器具有良好的传输性能,可以满足8. 2～9. 0 GHz频率范围内的通信要求,表明提出的设计方法合理,可实现工程应用。
The hairpin microstrip band-pass filters parameters are designed and optimized with electromagnetic simulation software high frequency structure simulator( HFSS). X-band microstrip band-pass filters with center frequency of 8. 6 GHz and bandwidth of 9 % are fabricated on the MEMS processing platform by using highresistance silicon as substrate and large thickness benzocyclobutene( BCB) with low dissipation factor as dielectric.The detailed process is given and the key steps are introduced. Comparison of simulation result and test result are given. Test result consistents with the simulation result very well and the filters have good transmission performance,which can meet the communication requirements in the frequency range of 8. 2 ～ 9. 0 GHz. This shows that the design method is reasonable and suitable for engineering applications.
The hairpin microstrip band-pass filters parameters are designed and optimized with electromagnetic simulation software high frequency structure simulator( HFSS). X-band microstrip band-pass filters with center frequency of 8. 6 GHz and bandwidth of 9 % are fabricated on the MEMS processing platform by using highresistance silicon as substrate and large thickness benzocyclobutene( BCB) with low dissipation factor as dielectric.The detailed process is given and the key steps are introduced. Comparison of simulation result and test result are given. Test result consistents with the simulation result very well and the filters have good transmission performance,which can meet the communication requirements in the frequency range of 8. 2 ～ 9. 0 GHz. This shows that the design method is reasonable and suitable for engineering applications.
引文
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[2]刘欣,谢廷明.非光敏BCB工艺技术研究[J].微电子学,2010,40(5):754-757.
[3]耿菲.以BCB为介质层的圆片级三维多芯片封装结构研究[J].半导体学报,2009,30(10):106003-106006.
[4] Carchon G,Vaesen K,Brebels S,et al. Multilayer thin-film MCMDfor the integration of high-performance RF and microwavecircuits[J]. IEEE Transactions on Components&PackagingTechnologies,2001,24(3):510-519.
[5] Song S,Kim Y,Maeng J,et al. A millimeter-wave system-on-package technology using a thin-film substrate with a flip-chipinterconnection[J]. IEEE Transactions on Advanced Packaging,2009,32(1):101-108.
[6] Pieters P,Vaesen K,Brebels S,et al. Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wirelesstelecommunication applications[J]. IEEE Transactions on Micro-wave Theory&Techniques,2001,49(4):589-599.
[7] Topper M,Buschick K,Wolf J,et al. Embedding technology—achip-first approach using BCB[C]∥International Symposium onAdvanced Packaging Materials. Proceedings. IEEE,1997:11-14.
[8]森荣二,薛培鼎. LC滤波器设计与制作[M].北京:科学出版社,2006,22-24.
[9] Thomas J B. Cross-coupling in coaxial cavity filters—A tutorialoverview[J]. IEEE Transactions on Microwave Theory&Tech-niques,2003,51(4):1368-1376.
[10] Wong K Y,Tam W Y. Analysis of the frequency response of SAWfilters using finite-difference time-domain method[J]. IEEETransactions on Microwave Theory&Techniques,2005,53(11):3364-3370.
[11] Hong J S,Lancaster M J. Cross-coupled microstrip hairpin-resona-tor filters[J]. IEEE Transactions on Microwave Theory&Tech-niques,2002,46(1):118-122.
[12] Deng Z,Cheng C H,LüW J,et al. Experimental study onmicrostrip hairpin resonator filters[J]. Journal of Microwaves,2005,21(4):122-126.