热像仪光机热集成分析综述
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  • 英文篇名:Review of Thermal-structural-optical Integration Analysis of Thermal Imager
  • 作者:马宏川 ; 范宏波 ; 林宇 ; 王磊
  • 英文作者:MA Hongchuan;FAN Hongbo;LIN Yu;WANG Lei;Kunming Institute of Physics;
  • 关键词:光机热 ; 梯度折射率 ; 胶模拟
  • 英文关键词:TSO;;gradient index;;glue modeling
  • 中文刊名:HWJS
  • 英文刊名:Infrared Technology
  • 机构:昆明物理研究所;
  • 出版日期:2019-02-03 07:14
  • 出版单位:红外技术
  • 年:2019
  • 期:v.41;No.314
  • 语种:中文;
  • 页:HWJS201902005
  • 页数:8
  • CN:02
  • ISSN:53-1053/TN
  • 分类号:38-45
摘要
光机热集成分析不仅能够对红外成像系统在复杂环境下像质进行评价,而且能够在设计阶段对热像仪模型进行优化设计,从而节省研发时间,提高研究效率。本文介绍了光机热集成分析的基本原理,对该领域近年出现的光机热集成方法进行归纳总结与分析对比,指出目前光机热集成分析存在的缺点与不足,重点介绍了折射率梯度和光学胶对热像仪像质的影响,并对热像仪集成分析发展趋势做出展望。
        Thermal–structural–optical(TSO) integrated analysis combines optical, mechanical, and thermal analyses and is essential for designing an optical mechanical system. It can be used to identify shortcomings in a design, reduce the time required for the research, and make it more efficient. This paper introduces the basic principle of TSO integrated analysis and summarizes its development. The paper focuses on the gradient index and glue modeling. Finally, development trend of TSO integrated analysis is investigated.
引文
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