大功率LED新型相变热沉传热性能测试（英文）
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摘要
针对现有固态金属热沉在大功率LED散热方面的局限性,设计并制造了一款微型相变热沉。首先,研究了该微型相变热沉的加工工艺,包括热沉本体和端盖的加工、蒸发端面三维沸腾结构成形、吸液芯烧结以及相变热沉的封装。然后,基于开发的测试系统,对相变热沉在自然对流环境下进行传热性能测试,研究了热载荷和工质对传热性能的影响。最后,将该相变热沉的传热性能与固态金属热沉进行比较。研究结果表明,该相变热沉具有很好的传热性能,且适用于大功率LED的封装。
In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode(LED),a kind of miniaturized phase change heat sink is developed for high power LED packaging.First,the fabrication process of miniaturized phase change heat sink is investigated,upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink,the formation of three-dimensional boiling structures at the evaporation end,the sintering of the wick,and the encapsulation of high power LED phase change heat sink.Subsequently,with the assistance of the developed testing system,heat transfer performance of the heat sink is tested under the condition of natural convection,upon which the influence of thermal load and working medium on the heat transfer performance is investigated.Finally,the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink.Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink,and is suitable for the packaging of high power LED.
In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode(LED),a kind of miniaturized phase change heat sink is developed for high power LED packaging.First,the fabrication process of miniaturized phase change heat sink is investigated,upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink,the formation of three-dimensional boiling structures at the evaporation end,the sintering of the wick,and the encapsulation of high power LED phase change heat sink.Subsequently,with the assistance of the developed testing system,heat transfer performance of the heat sink is tested under the condition of natural convection,upon which the influence of thermal load and working medium on the heat transfer performance is investigated.Finally,the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink.Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink,and is suitable for the packaging of high power LED.
引文
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[2]LUO Xiao-bing,HU Run,LIU Sheng,WANG Kai.Heat and fluid flow in high-power LED packaging and applications[J].Progress in Energy and Combustion Science,2016,56:1-32.
[3]ZHAO T,CHEN R.Recent progress in understanding of coupled heat/mass transport and electrochemical reactions in fuel cells[J].International Journal of Energy Research,2011,35(1):15-23.
[4]FENG Ming-jie,WANG En-gang,WANG Hai,LI Yan-dong,LIU Bing.Numerical simulation on boiling heat transfer of evaporation cooling in a billet reheating furnace[J].Journal of Central South University,2016,23(6):1515-1524.
[5]FSADNI A M,WHITTY J P M.A review on the two-phase heat transfer characteristics in helically coiled tube heat exchangers[J].International Journal of Heat&Mass Transfer,2016,95:551-565.
[6]DENG Da-xiang,WAN Wei,SHAO Hao-ran,TANG Yong,FENG Jun-yuan,ZENG Jian.Effects of operation parameters on flow boiling characteristics of heat sink cooling systems with reentrant porous microchannels[J].Energy Conversion and Management,2015,96:340-351.
[7]HOSSEIN G,MOSLEM N.Thermo-structural analysis on evaluating effects of friction and transient heat transfer on performance of gears in high-precision assemblies[J].Journal of Central South University,2017,24(1):71-80.
[8]KANG Lei,ZHAO Gang,TIAN Ni,ZHANG Hai-tao.Computation of synthetic surface heat transfer coefficient of7B50 ultra-high-strength aluminum alloy during spray quenching[J].Transactions of Nonferrous Metals Society of China,2018,28(5):989-997.
[9]ARSHAD W,ALI H M.Graphene nanoplatelets nanofluids thermal and hydrodynamic performance on integral fin heat sink[J].International Journal of Heat and Mass Transfer,2017,107:995-1001.
[10]XIANG Jian-hua,ZHANG Chun-liang,JIANG Fan,LIUXiao-chu,TANG Yong.Fabrication and testing of phase change heat sink for high power LED[J].Transactions of Nonferrous Metals Society of China,2011,21(9):2066-2071.
[11]XIANG Jian-hua,DUAN Ji-an,ZHOU Hai-bo,ZHANGChun-liang,LIU Gui-yun,ZHOU Chao.Forming mechanism of three-dimensional integral fin based on flat surface[J].Journal of Central South University,2015,22(5):1660-1666.
[12]ALI H M,ARSHAD W.Effect of channel angle of pin-fin heat sink on heat transfer performance using water based graphene nanoplatelets nanofluids[J].International Journal of Heat&Mass Transfer,2016,106:465-472.
[13]ARSHAD W,ALI H M.Experimental investigation of heat transfer and pressure drop in a straight minichannel heat sink using Ti O2 nanofluid[J].International Journal of Heat&Mass Transfer,2017,248:248-256.
[14]YANG K S,CHUNG C H,LEE M T,CHIANG S B,WONGC H,WANG C C.An experimental study on the heat dissipation of LED lighting module using metal/carbon foam[J].International Communications in Heat&Mass Transfer,2013,48(11):73-79.
[15]HA M,GRAHAM S.Development of a thermal resistance model for chip-on-board packaging of high power LEDarrays[J].Microelectronics Reliability,2012,52(5):836-844.
[16]XIAO Cheng-di,LIAO Hai-long,WANG Yan,LI Jun-hui,ZHU Wen-hui.A novel automated heat-pipe cooling device for high-power LEDs[J].Applied Thermal Engineering,2017,111:1320-1329.
[17]ZHAO Xin-jie,CAI Yi-xi,WANG Jing,LI Xiao-hua,ZHANG Chun.Thermal model design and analysis of the high-power LED automotive headlight cooling device[J].Applied Thermal Engineering,2015,75:248-258.(Edited by YANG Hua)