软基片高质量点压焊接工艺方法研究
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摘要
软基片微带电路板焊接是混合电路微组装中的关键技术之一,针对传统工装夹具压合焊接方法存在的夹具不通用、易污染电路、焊透率低等不足,本文提出了一种新颖的软基片焊接工艺方法,即采用软基片扰曲修正、馈电绝缘子自定位共焊、焊接过程局部点压等技术,实现了软基片无夹具高效、高质量焊接。本文介绍了软基片点压焊接工艺流程,并且应用试验数据对工艺参数进行优化。焊接实验结果表明,该方法可显著缩短软基片焊接时间,如某复杂组件单套组装时间缩减55%,焊透率从70%提高到95%左右,有效提高了混合电路微组装生产效率和焊接质量,同时降低了生产成本。
Soft substrate microstrip circuit board welding is one of the key techniques for micro assembly of hybrid circuits. In order to overcome the disadvantages of the traditional fixture welding method,such as non-universal fixture requirement,easy polluting circuit,lowpenetration rate and so on,a novel welding craftwork method of soft substrate was presented. Some key techniques such as soft substrate perturbation correction,self-position welding of the feed insulator and local point pressure in the welding process were developed in the novel welding craftwork method. Through this method,efficient and high-quality fixture-free welding on the soft substrates can be achieved. In this paper,the point pressure welding process of the soft substrate was introduced,and the process parameters were optimized by using the experimental data. The welding experimental results showthat the time of soft substrate welding is significantly shorten by this method. For a case of complex component,its assembly time of single set is reduced by 55%,meanwhile the penetration rate is increased from 70% to 95%. Therefore,the hybrid circuit micro assembly production efficiency can be effectively improved and the production cost is greatly reduced using the method.
Soft substrate microstrip circuit board welding is one of the key techniques for micro assembly of hybrid circuits. In order to overcome the disadvantages of the traditional fixture welding method,such as non-universal fixture requirement,easy polluting circuit,lowpenetration rate and so on,a novel welding craftwork method of soft substrate was presented. Some key techniques such as soft substrate perturbation correction,self-position welding of the feed insulator and local point pressure in the welding process were developed in the novel welding craftwork method. Through this method,efficient and high-quality fixture-free welding on the soft substrates can be achieved. In this paper,the point pressure welding process of the soft substrate was introduced,and the process parameters were optimized by using the experimental data. The welding experimental results showthat the time of soft substrate welding is significantly shorten by this method. For a case of complex component,its assembly time of single set is reduced by 55%,meanwhile the penetration rate is increased from 70% to 95%. Therefore,the hybrid circuit micro assembly production efficiency can be effectively improved and the production cost is greatly reduced using the method.
引文
[1]谢颖.微组装关键工艺技术研究[D].成都:电子科技大学,2010.
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[3]王春青,李明雨,田艳红.电子封装与组装中的微连接技术[C]//第十次全国焊接会议论文集(第1册).北京:中国机械工程学会焊接学会,2001:D107-D118.
[4]金忠,谢锋,何迎辉,等.倒装焊接在压力敏感芯片封装工艺中的研究[J].电子与封装,2012,12(9):10-13.
[5]杨宗亮,张晨曦.微组装大面积基板焊膏共晶焊工艺研究[J].电子工艺技术,2016,37(5):270-272.
[6]任榕,卢绍英,赵丹,等.毫米波射频互连微组装工艺优化研究[J].电子与封装,2013,13(10):1-9.
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[8]李孝轩.微波多芯片组件微组装关键技术及其应用研究[D].南京:南京理工大学,2009.
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[10]邵优华,韦炜.T/R组件微组装工艺技术[J].舰船电子对抗,2012,35(2):103-107.
[2]Tapan K G.厚薄膜混合微电子学手册[M].王瑞庭,朱征,译.北京:电子工业出版社,2005:213-214.
[3]王春青,李明雨,田艳红.电子封装与组装中的微连接技术[C]//第十次全国焊接会议论文集(第1册).北京:中国机械工程学会焊接学会,2001:D107-D118.
[4]金忠,谢锋,何迎辉,等.倒装焊接在压力敏感芯片封装工艺中的研究[J].电子与封装,2012,12(9):10-13.
[5]杨宗亮,张晨曦.微组装大面积基板焊膏共晶焊工艺研究[J].电子工艺技术,2016,37(5):270-272.
[6]任榕,卢绍英,赵丹,等.毫米波射频互连微组装工艺优化研究[J].电子与封装,2013,13(10):1-9.
[7]周德俭.电子产品微组装技术[J].电子机械工程,2011,27(1):1-6.
[8]李孝轩.微波多芯片组件微组装关键技术及其应用研究[D].南京:南京理工大学,2009.
[9]严伟,姜伟卓,禹胜林.小型化、高密度微波组件微组装技术及应用[C]//2010中国电子制造技术论坛论文集.北京:中国电子学会电子制造与封装技术分会,2010:7.
[10]邵优华,韦炜.T/R组件微组装工艺技术[J].舰船电子对抗,2012,35(2):103-107.