基于参数识别的贴片机键合臂约束工况模态提取与特征分析
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摘要
为掌握键合臂的模态特性对保障贴片机键合精度的影响,建立键合臂的模态特性综合对比分析模型,以简化安装工况下的键合臂为对象,通过理论计算与实验测试相结合的方法对比分析键合臂的约束模态特性。通过ANSYS有限元数值计算得到前6阶振型特征,并以此为参考确定实验中激振点布置方案,然后联合使用LMS Test.Lab锤击系统和POLYTEC激光测振仪等工具对键合臂进行模态实验。通过模态参数特征识别和提取,经一致性对比分析,得到键合臂准确的模态参数和刚度分布情况。研究表明,键合臂的一阶固有频率为306 Hz,远高于外部激振源最高频率,动态特性满足设计要求。研究结果为贴片机键合臂的结构轻量化、结构优化及整机的防振、抑振等提供理论支撑和实验参考。
In order to grasp the influence of the modal characteristics of the picking-up arm on the bonding precision of the chip bonder. The comprehensive comparison and analysis model of the modal characteristics of the picking-up arm is established. The constraint modality characteristic of bonding arm under the simplified installation condition is analyzed by finite element calculation and modal test. Theoretical and experimental results were compared and discussed. Exact modal characteristics, weak link and its influential factors of bonding arm are obtained. The results show that the first order inherent frequency is 306 Hz, is higher than external excitation frequency. This research result provides a theoretical support and experiment reference for optimizing structure, preventing resonance and reduces vibration of bonding arm.
In order to grasp the influence of the modal characteristics of the picking-up arm on the bonding precision of the chip bonder. The comprehensive comparison and analysis model of the modal characteristics of the picking-up arm is established. The constraint modality characteristic of bonding arm under the simplified installation condition is analyzed by finite element calculation and modal test. Theoretical and experimental results were compared and discussed. Exact modal characteristics, weak link and its influential factors of bonding arm are obtained. The results show that the first order inherent frequency is 306 Hz, is higher than external excitation frequency. This research result provides a theoretical support and experiment reference for optimizing structure, preventing resonance and reduces vibration of bonding arm.
引文
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[3]GONG W F,HUANG M F,CHEN L L,et al.Dynamic characteristics analysis of the flip chip bonding head based on multiple working conditions[J].International Conference on Electronic Packaging Technology.IEEE,2013:732-73.
[4]姜益军,姜珊,陶楠.缺陷对薄板结构振动模态影响的数值与实验分析[J].振动工程学报,2017,30(4):564-569.
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[6]MASSA F,TISON T,LALLEMAND B.Fuzzy modal analysis:prediction of experimental behaviors[J].Journal of Sound and Vibration,2009,322:135-154.
[7]宫文峰,黄美发,张美玲.倒装芯片键合机模态特性研究与实验验证[J].中国测试,2016,42(11):119-125.
[8]蔡力钢,马仕明,赵永胜,等.重载摆角铣头模态分析与实验研究[J].振动与冲击,2011,30(7):250-255.
[9]沈高飞,陈立.振动筛振动模态测试及分析[J].噪声与振动控制,2017,37(1):188-190.
[10]向玲,鄢小安,陈涛.基于PolyMAX方法的悬臂梁振动模态分析[J].中国测试,2016,42(4):132-135.
[11]魏超,吴坚,张良良,等.汽油机曲轴系统扭振特性仿真与实验研究[J].机械科学与技术,2016,35(4):507-513.
[12]安邦,潘宏侠,张玉学,等.变分模态分解在自动机故障诊断中的应用[J].中国测试,2017,7(43):112-116.