Cu/Al复合材料热电性能的研究
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摘要
运用新型感应加热工艺,通过固-液-固相复合法制备铜/铝复合材料。分析了不同成分结合层的电阻率及结合层厚度与铜铝复合材料热电性能间的关系。实验中用氙灯导热仪DXF200对Cu/Al复合材料结合层的导热系数进行测定,用SB100A/20A型四探针导体/半导体电阻率测试仪对Cu/Al复合材料结合层电阻率进行测定。结果表明,铜铝复合材料结合层的导热系数为205.6 W/(m·K),铜铝复合材料中间化合物Cu9Al4的电阻率为14.35×10-8Ω·m,CuAl的电阻率为11.56×10-8Ω·m,CuAl2的电阻率为8.17×10-8Ω·m,且随着结合层厚度的增加,复合材料的等效导热系数逐渐减小,当铜铝复合材料结合层厚度保持在1~100μm的范围时有具有较好的导电、导热性能。
Using a new type of induction heating process,copper/aluminum composite was prepared by solid-liquid-solid method.The resistivity of binding layers of different components and the relationship between the thickness of bonding layers and the thermoelectric properties of copper/aluminum composite were investigated.The thermal conductivity was observed by xenon lamp thermal conductivity meter DXF200.The resistivity was measured by SB100 A/20 Afour probe conductor/semiconductor resistivity tester.The results showed that the thermal conductivity of Cu/Al compound materials bonding layers is 205.6 W/(m·K)and the resistivities of Intermetallic compounds of bonding layer,Cu9 Al4 layer,AlCu layer and CuAl2 layer are 14.35×10-8,8.17×10-8 and 11.56×10-8Ω·m,respectively.Moreover,with the concentration of the thickness of bonding layers,the complex thermal conductivity of copper/aluminum composite gradually decreased.When the thickness of bonding layer was in the range of 1 to 100μm,the copper/aluminum composite produced the satisfactory thermoelectric properties.
Using a new type of induction heating process,copper/aluminum composite was prepared by solid-liquid-solid method.The resistivity of binding layers of different components and the relationship between the thickness of bonding layers and the thermoelectric properties of copper/aluminum composite were investigated.The thermal conductivity was observed by xenon lamp thermal conductivity meter DXF200.The resistivity was measured by SB100 A/20 Afour probe conductor/semiconductor resistivity tester.The results showed that the thermal conductivity of Cu/Al compound materials bonding layers is 205.6 W/(m·K)and the resistivities of Intermetallic compounds of bonding layer,Cu9 Al4 layer,AlCu layer and CuAl2 layer are 14.35×10-8,8.17×10-8 and 11.56×10-8Ω·m,respectively.Moreover,with the concentration of the thickness of bonding layers,the complex thermal conductivity of copper/aluminum composite gradually decreased.When the thickness of bonding layer was in the range of 1 to 100μm,the copper/aluminum composite produced the satisfactory thermoelectric properties.
引文
[1]Li Qingyun,Wang Mingguang.Intermetallic of compound interface of aluminum/copper[J].Journal of Jiamusi University(Natural Science Edition),2009,27(4):556-558(in Chinese).李青云,王明光.铝/铜复合界面金属间化合物[J].佳木斯大学学报(自然科学版),2009,27(4):556-558.
[2]Lu Xilong,Liu Ping,Liu Xinkuan,et al.Microstructure and bonding strength of hafnium and copper brazed joints[J].Chinese Journal of Rare Metals,2014,38(1):22-28(in Chinese).路希龙,刘平,刘新宽,等.铪与铜钎焊接头的组织与强度[J].稀有金属,2014,38(1):22-28.
[3]Wang Zheng,Liu Ping,Liu Xinkuan,et al.Diffusion layer growth kinetics model of copper hot-dipping aluminum coating[J].Journal of Functional Materials,2015,46(2):2080-2083(in Chinese).王征,刘平,刘新宽,等.铜热浸镀铝扩散层生长动力学模型[J].功能材料,2015,46(2):2080-2083.
[4]Ding Zhimin,Song Jianmin,Guan Junshi,et al.Influence of diffusion-treatment temperature on phase,morphology and properties of aluminum-plating coating on the steel[J].Journal of Functional Materials,2010,41(8):1321-1322(in Chinese).丁志敏,宋建敏,关君实,等.扩散处理对钢基铝镀层的相、形貌和性能的影响[J].功能材料,2010,41(8):1321-1322.
[5]Liu Xiaodi,Yang Yi,Li Fengsheng.Fabricating nanometer Cu/Al composite powder by electroless copper plating[J].Journal of Functional Materials,2006,37(8):1335-1337(in Chinese).刘小娣,杨毅,李凤生.化学镀法制备纳米Cu/Al复合粉末[J].功能材料,2006,37(8):1335-1337.
[6]Yu Baoyi,Qiao Gang,Chen Yan,et al.Investigation on the Cu/A1liquid-solid bonding bimetallic composite with process of hot-dipping[J].Special Casting and Nonferrous Alloys,2010,30(6):581-583(in Chinese).于宝义,乔刚,陈岩,等.热浸镀法Cu/A1液固复合的研究[J].特种铸造及有色合金,2010,30(6):581-583.
[7]Bao Weibing,Zhang Li.Application analysis of copperclad aluminium bus bars as the railway vehicles grounding products[J].China New Technologies and Products,2015(4):101-102(in Chinese).鲍伟兵,张丽.铜包铝母材料作为轨道车辆接地产品的应用分析[J].中国新技术新产品,2015(4):101-102.
[8]Wen Kaiyuan.Improvement and application of copper and aluminum products of terminal connector[J].New Technology&New Process,2011(7):100-102(in Chinese).温开元.铜铝设备线夹产品的改进与应用-基于爆炸焊接新技术新工艺的应用[J].新技术新工艺,2011(7):100-102.
[9]奚同庚,严东升,郭景坤,等.复合材料导热因子的理论分析及其导热性的实验研究和预测[J].工程热物理学报,1983,V4(2):153-157.
[10]Wang B X,Wang R.On the thermal conductivity of moist porous building materials[J].Joural of Engineering Thermophysics,1983,V4(2):147-152(in Chinese).王补宣,王仁.含湿建筑材料的导热系数[J].工程热物理学报,1983,V4(2):147-152.
[11]Zhang Jianchen.Optimization design based on the explosive welding of copper aluminum composite radiator[J].Welding Technology,2007,36(5):35-37(in Chinese).张建臣.基于爆炸焊接的铜铝复合散热片的优化设计[J].焊接技术,2007,36(5):35-37.
[12]Wang Zheng,Liu Ping,Liu Xinkuan,et al.Microstructure and performance of hot-dip aluminizing coating of copper[J].Chinese Journal of Rare Metals,2015,39(10):955-960(in Chinese).王征,刘平,刘新宽,等.铜热浸镀铝的组织与性能[J].稀有金属,2015,39(10):955-960.
[13]Wei Mingkun,Duan Mingcheng,Wang Zhu.The investigation of aluminum oxide film with continuous beds of passage[J].Journal of Functional Materials,1996,27(3):279-280(in Chinese).魏明坤,段明诚,王柱.含过渡层氧化铝膜的制备[J].功能材料,1996,27(3):279-280.
[14]Guo Yajie,Liu Guiwu,Jin Haiyun,et al.Investigation on the interracial structure and phase formation mechanism of the diffusion-bonded Cu/Al laminates[J].Rare Metal Materials and Engineering,2011,40(S2):215-219(in Chinese).郭亚杰,刘桂武,金海云,等.扩散结合Cu/Al叠层复合材料的界面结构与相生成机制[J].稀有金属材料与工程,2011,40(S2):215-219.
[15]Athar M M H,Tolaminejad B.Weldability window and the effect of interface morphology on the properties of Al/Cu/Al laminated composites fabricated by explosive welding[J].Materials&Design,2015,12(86):516-525.
[16]Tanaka Y,Kajihara M,Watanabe Y.Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Materials Science and Engineering A,2007,445-446(6):355-363.
[17]Zhang Shenghua,Guo ZuJun.Study on Cu/Al compound materials[J].The Chinese Journal of Nonferrous Metal,1995,5(4):128-130(in Chinese).张胜华,郭祖军.铜-铝复合材料的研究[J].中国有色金属学报,1995,5(4):128-130.
[18]Xie Jun,Wu Weidong,Du Kai,et al.Process and microstructure analysis in vacuum diffusion bonding of aluminum and copper films[J].Automic Energy Science and Technology,2004,38(7):120-124(in Chinese).谢军,吴卫东,杜凯,等.Al/Cu微米级厚度薄膜扩散连接工艺及显微组织分析[J].原子能科学技术,2004,38(7):120-124.
[19]Parker W J,Jenkins R J,Butler C P,et al.Flash method of determining thermal diffusivity,heat capacity and thermal conductivity[J].J Appl Phys,1961(32):1679-1685.
[20]德国耐驰仪器制造有限公司.LFA457仪器操作手册[S].上海:耐弛仪器(上海)有限公司,2009:2-3.
[21]Tang Yunjie,Chen Bei.The experimental exploration of thermal conductivity measurement of double-layered materials by flash method[C].Shanghai:China Printed Circutt Association,2013(in Chinese).唐云杰,陈蓓.激光闪射法测量双层材料导热系数的实验探索[C].上海:中国印刷电路行业协会,2013.
[22]Cui Qishan.Complex thermal conductivity coefficient and it’scalculation[J].Petro-Chemical Equipment,2004,33(6):32(in Chinese).崔其山.综合导热系数及其计算[J].石油化工设备,2004,33(6):32.
[23]Braunovic M,Alexandrov N.Intermetallic compound at aluminum-to-copper electrical interface-effect of temperature and electric-current[J].IEEE Transaction Components Packging Manufacture Technology Part A,1994,17(1):78.
[2]Lu Xilong,Liu Ping,Liu Xinkuan,et al.Microstructure and bonding strength of hafnium and copper brazed joints[J].Chinese Journal of Rare Metals,2014,38(1):22-28(in Chinese).路希龙,刘平,刘新宽,等.铪与铜钎焊接头的组织与强度[J].稀有金属,2014,38(1):22-28.
[3]Wang Zheng,Liu Ping,Liu Xinkuan,et al.Diffusion layer growth kinetics model of copper hot-dipping aluminum coating[J].Journal of Functional Materials,2015,46(2):2080-2083(in Chinese).王征,刘平,刘新宽,等.铜热浸镀铝扩散层生长动力学模型[J].功能材料,2015,46(2):2080-2083.
[4]Ding Zhimin,Song Jianmin,Guan Junshi,et al.Influence of diffusion-treatment temperature on phase,morphology and properties of aluminum-plating coating on the steel[J].Journal of Functional Materials,2010,41(8):1321-1322(in Chinese).丁志敏,宋建敏,关君实,等.扩散处理对钢基铝镀层的相、形貌和性能的影响[J].功能材料,2010,41(8):1321-1322.
[5]Liu Xiaodi,Yang Yi,Li Fengsheng.Fabricating nanometer Cu/Al composite powder by electroless copper plating[J].Journal of Functional Materials,2006,37(8):1335-1337(in Chinese).刘小娣,杨毅,李凤生.化学镀法制备纳米Cu/Al复合粉末[J].功能材料,2006,37(8):1335-1337.
[6]Yu Baoyi,Qiao Gang,Chen Yan,et al.Investigation on the Cu/A1liquid-solid bonding bimetallic composite with process of hot-dipping[J].Special Casting and Nonferrous Alloys,2010,30(6):581-583(in Chinese).于宝义,乔刚,陈岩,等.热浸镀法Cu/A1液固复合的研究[J].特种铸造及有色合金,2010,30(6):581-583.
[7]Bao Weibing,Zhang Li.Application analysis of copperclad aluminium bus bars as the railway vehicles grounding products[J].China New Technologies and Products,2015(4):101-102(in Chinese).鲍伟兵,张丽.铜包铝母材料作为轨道车辆接地产品的应用分析[J].中国新技术新产品,2015(4):101-102.
[8]Wen Kaiyuan.Improvement and application of copper and aluminum products of terminal connector[J].New Technology&New Process,2011(7):100-102(in Chinese).温开元.铜铝设备线夹产品的改进与应用-基于爆炸焊接新技术新工艺的应用[J].新技术新工艺,2011(7):100-102.
[9]奚同庚,严东升,郭景坤,等.复合材料导热因子的理论分析及其导热性的实验研究和预测[J].工程热物理学报,1983,V4(2):153-157.
[10]Wang B X,Wang R.On the thermal conductivity of moist porous building materials[J].Joural of Engineering Thermophysics,1983,V4(2):147-152(in Chinese).王补宣,王仁.含湿建筑材料的导热系数[J].工程热物理学报,1983,V4(2):147-152.
[11]Zhang Jianchen.Optimization design based on the explosive welding of copper aluminum composite radiator[J].Welding Technology,2007,36(5):35-37(in Chinese).张建臣.基于爆炸焊接的铜铝复合散热片的优化设计[J].焊接技术,2007,36(5):35-37.
[12]Wang Zheng,Liu Ping,Liu Xinkuan,et al.Microstructure and performance of hot-dip aluminizing coating of copper[J].Chinese Journal of Rare Metals,2015,39(10):955-960(in Chinese).王征,刘平,刘新宽,等.铜热浸镀铝的组织与性能[J].稀有金属,2015,39(10):955-960.
[13]Wei Mingkun,Duan Mingcheng,Wang Zhu.The investigation of aluminum oxide film with continuous beds of passage[J].Journal of Functional Materials,1996,27(3):279-280(in Chinese).魏明坤,段明诚,王柱.含过渡层氧化铝膜的制备[J].功能材料,1996,27(3):279-280.
[14]Guo Yajie,Liu Guiwu,Jin Haiyun,et al.Investigation on the interracial structure and phase formation mechanism of the diffusion-bonded Cu/Al laminates[J].Rare Metal Materials and Engineering,2011,40(S2):215-219(in Chinese).郭亚杰,刘桂武,金海云,等.扩散结合Cu/Al叠层复合材料的界面结构与相生成机制[J].稀有金属材料与工程,2011,40(S2):215-219.
[15]Athar M M H,Tolaminejad B.Weldability window and the effect of interface morphology on the properties of Al/Cu/Al laminated composites fabricated by explosive welding[J].Materials&Design,2015,12(86):516-525.
[16]Tanaka Y,Kajihara M,Watanabe Y.Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Materials Science and Engineering A,2007,445-446(6):355-363.
[17]Zhang Shenghua,Guo ZuJun.Study on Cu/Al compound materials[J].The Chinese Journal of Nonferrous Metal,1995,5(4):128-130(in Chinese).张胜华,郭祖军.铜-铝复合材料的研究[J].中国有色金属学报,1995,5(4):128-130.
[18]Xie Jun,Wu Weidong,Du Kai,et al.Process and microstructure analysis in vacuum diffusion bonding of aluminum and copper films[J].Automic Energy Science and Technology,2004,38(7):120-124(in Chinese).谢军,吴卫东,杜凯,等.Al/Cu微米级厚度薄膜扩散连接工艺及显微组织分析[J].原子能科学技术,2004,38(7):120-124.
[19]Parker W J,Jenkins R J,Butler C P,et al.Flash method of determining thermal diffusivity,heat capacity and thermal conductivity[J].J Appl Phys,1961(32):1679-1685.
[20]德国耐驰仪器制造有限公司.LFA457仪器操作手册[S].上海:耐弛仪器(上海)有限公司,2009:2-3.
[21]Tang Yunjie,Chen Bei.The experimental exploration of thermal conductivity measurement of double-layered materials by flash method[C].Shanghai:China Printed Circutt Association,2013(in Chinese).唐云杰,陈蓓.激光闪射法测量双层材料导热系数的实验探索[C].上海:中国印刷电路行业协会,2013.
[22]Cui Qishan.Complex thermal conductivity coefficient and it’scalculation[J].Petro-Chemical Equipment,2004,33(6):32(in Chinese).崔其山.综合导热系数及其计算[J].石油化工设备,2004,33(6):32.
[23]Braunovic M,Alexandrov N.Intermetallic compound at aluminum-to-copper electrical interface-effect of temperature and electric-current[J].IEEE Transaction Components Packging Manufacture Technology Part A,1994,17(1):78.