摘要
有铅焊料焊接无铅元器件的混装工艺是目前军事电子中迫切需要进行研究的课题。通过对两组混装焊接工艺中无铅焊球和有铅焊料的可靠性分析,得出回流峰值温度为220℃~230℃,液相线(204℃)以上时间大于60 s的回流曲线焊接工艺能较好完成有铅焊料对无铅FBGA的焊接。
The Mixed Assembly technology of Sn/Pb solder paste soldering lead-free devices is an urgent research topic in military electronics. Through the reliability analysis of lead-free solder balls and Sn/Pb solder paste in two groups of mixed soldering process, it is concluded that the reflow soldering process with lead solder paste to lead-free FBGA can be successfully completed by reflow peak temperature of 220 ~230 ℃ and the time above liquidus(204 ℃) greater than 60 s.
引文
[1]田坤.无铅有铅混装焊接工艺方法研究[D].长沙:国防科学技术大学,2011.
[2]宁叶香.无铅过渡时期混合组装PBGA焊点可靠性及封装体结构参数优化研究[D].桂林:桂林电子科技大学,2009.
[3]崔献威.无铅与锡铅混装结构显微组织研究[D].沈阳:沈阳航空航天大学,2013.
[4]贺晓斌,刘双宝,徐燕铭,等.高密度混装印制板组件力学特性研究[J].电子工艺技术,2017,38(6),326-330.
[5]李杨.混合组装BGA焊点可靠性模拟与试验研究[D].哈尔滨:哈尔滨工业大学,2013.
[6]徐驰,包晓云.有铅焊料焊接无铅BGA回流参数探索[J].电子工艺技术,2011,32(6),342-345.
[7]邹嘉佳,李苗,孙晓伟,等.无铅QFP金属间化合物层的高温可靠性研究[J].电子工艺技术,2018,39(3),150-153.
[8]李勋平.BGA结构Cu(Ni)/Sn-3.0Ag-0.5Cu/Ni(Cu)微焊点显微组织形成和演及剪切断裂行为的尺寸效应[D].广州:华南理工大学,2011.