OLED封装用粘接材料的研究进展
|
摘要
OLED(有机电致发光器件)由于具有结构简单、超轻薄、色饱和度和对比度高、功耗低、容易实现柔性显示等优势,成为产业界和学术界投资与研究的重点。但OLED器件容易接触到空气中的水氧气而降低发光效率,从而缩短使用寿命。因此要实现OLED器件的大规模量产必须采用适当的封装技术有效得阻隔水氧气进入OLED器件。封装技术中除了应用不同的封装材料外,还需要使用粘接材料将这些封装材料复合在一起,同时也要求粘接材料必须具备高水汽阻隔性能。本文根据不同的封装技术,对不同的封装用功能材料以及将这些功能材料复合粘接在一起的粘接材料进行简要综述,并对粘接材料的未来发展提出一些看法。
Because of its advantages of simple structure, super light weight, high color saturation, high contrast, low power consumption and easy realization of flexible display, OLED(Organic Light-Emitting Diode) has become the focus of investment and research in industry and academia. However, OLED devices are easy to contact with water and oxygen in the air and reduce luminous efficiency, thus shortening the service life. Therefore, in order to achieve mass production of OLED devices, proper encapsulation technology must be adopted to prevent water and oxygen from entering OLED devices effectively. In addition to the application of different encapsulation materials, the encapsulation materials need to be combined with the bonding materials, and the bonding materials must have high water vapor barrier properties as well. According to the different encapsulation technology, the functional materials for different encapsulation technology and also the bonding materials that combine these functional materials were briefly reviewed in this paper. The future development of bonding materials was also discussed.
Because of its advantages of simple structure, super light weight, high color saturation, high contrast, low power consumption and easy realization of flexible display, OLED(Organic Light-Emitting Diode) has become the focus of investment and research in industry and academia. However, OLED devices are easy to contact with water and oxygen in the air and reduce luminous efficiency, thus shortening the service life. Therefore, in order to achieve mass production of OLED devices, proper encapsulation technology must be adopted to prevent water and oxygen from entering OLED devices effectively. In addition to the application of different encapsulation materials, the encapsulation materials need to be combined with the bonding materials, and the bonding materials must have high water vapor barrier properties as well. According to the different encapsulation technology, the functional materials for different encapsulation technology and also the bonding materials that combine these functional materials were briefly reviewed in this paper. The future development of bonding materials was also discussed.
引文
[1]李斌,彭玲,潘晓勇,等.有机电致发光器件(OLED)的封装技术研究[J].电子元器件应用,2011,13(4):28-30.
[2]刘善鹏.利用缓变结提高蓝色有机发光二极管寿命[J].光学学报,2007,27(9):1687-1690.
[3]U Mitschke,P B?uerle.The electroluminescence of organic materials[J].J.Mater Chem,2000,10(10):1471-1507.
[4]黄卫东,王旭洪,盛玫,等.有机发光器件的低温氮化硅薄膜封装[J].功能材料与器件学报,2003,9(2):179-184.
[5]Burrows PE,Bulovic V,Forrest SR,et al.Reliability and degradation of organic light emitting devices[J].Applied Physics Letters,1994,65(23):2922-2924.
[6]Grover R,Srivastava R,Kamalasanan MN,et al.Multilayer thin film encapsulation for organic light emitting diodes[J].RSC Advances,2014,4(21):10808-10814.
[7]Weaver M S,Michalski L A,Rajan K,et al.Brown organic light-emtting devices with extended operation lifetimes on plastic substrates[J].Appl Phys Lett,2002,81:2929-2931.
[8]Feldman D.Polymer Nanocomposite Barriers[J].Journal of Macromolecular Science,Part A:Pure and Applied Chemistry,2013,50(4):441-448.
[9]Maniar KK.Polymeric nanocomposites:a review[J].Polymer-Plastics Technology and Engineering,2004,43(2):427-443.
[10]罗世永,李东立,吕勇,等.LCD/OLED用紫外光固化胶粘剂研究进展[J].化工新型材料,2008,36(3):7-8.
[11]蔡泉,罗顺,李建波,等.无影胶在3C行业中的应用及发展[J].中国胶粘剂,2017,26(3):56-59.
[12]李会录,南峰,李东辉,等.有机电致发光显示器用框胶封装材料的研制[J].中国胶粘剂,2010,19(11):45-48.
[13]A斯蒂恩,T克拉温克尔,K基特特尔根布舍,等.封装电子装置的粘合剂和方法[P].中国:CN103348465 B,20170208.
[14]陈维斌.OLED封装用高性能阻隔胶粘带的研制[J].广东化工,2017,44(21):48-49.
[15]陈维斌.一种高阻隔性复合离型膜和胶带[P].中国:CN107502221A,20171222.
[2]刘善鹏.利用缓变结提高蓝色有机发光二极管寿命[J].光学学报,2007,27(9):1687-1690.
[3]U Mitschke,P B?uerle.The electroluminescence of organic materials[J].J.Mater Chem,2000,10(10):1471-1507.
[4]黄卫东,王旭洪,盛玫,等.有机发光器件的低温氮化硅薄膜封装[J].功能材料与器件学报,2003,9(2):179-184.
[5]Burrows PE,Bulovic V,Forrest SR,et al.Reliability and degradation of organic light emitting devices[J].Applied Physics Letters,1994,65(23):2922-2924.
[6]Grover R,Srivastava R,Kamalasanan MN,et al.Multilayer thin film encapsulation for organic light emitting diodes[J].RSC Advances,2014,4(21):10808-10814.
[7]Weaver M S,Michalski L A,Rajan K,et al.Brown organic light-emtting devices with extended operation lifetimes on plastic substrates[J].Appl Phys Lett,2002,81:2929-2931.
[8]Feldman D.Polymer Nanocomposite Barriers[J].Journal of Macromolecular Science,Part A:Pure and Applied Chemistry,2013,50(4):441-448.
[9]Maniar KK.Polymeric nanocomposites:a review[J].Polymer-Plastics Technology and Engineering,2004,43(2):427-443.
[10]罗世永,李东立,吕勇,等.LCD/OLED用紫外光固化胶粘剂研究进展[J].化工新型材料,2008,36(3):7-8.
[11]蔡泉,罗顺,李建波,等.无影胶在3C行业中的应用及发展[J].中国胶粘剂,2017,26(3):56-59.
[12]李会录,南峰,李东辉,等.有机电致发光显示器用框胶封装材料的研制[J].中国胶粘剂,2010,19(11):45-48.
[13]A斯蒂恩,T克拉温克尔,K基特特尔根布舍,等.封装电子装置的粘合剂和方法[P].中国:CN103348465 B,20170208.
[14]陈维斌.OLED封装用高性能阻隔胶粘带的研制[J].广东化工,2017,44(21):48-49.
[15]陈维斌.一种高阻隔性复合离型膜和胶带[P].中国:CN107502221A,20171222.