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在“Elsevier电子期刊”中，命中：725条，耗时：0.040976 秒

在所有数据库中总计命中：1,417条

1.Rapid formation of Ni₃Sn₄ joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

作者：Z.L. Li^a ; H.J. Dong^a ; X.G. Song^a ; ^b ; ^{xgsong@hitwh.edu.cn} ; H.Y. Zhao^a ; ^b ; J.C. Feng^a ; ^b ; J.H. Liu^a ; H. Tian^a ; S.J. Wang^a

关键词：Ultrasonic soldering ; TLP bonding ; Ni3Sn4 joints ; Grain morphology ; Orientation relationship ; EBSD

刊名：Ultrasonics Sonochemistry

出版年：2017

2.Water-based adhesive formulations for rubber to metal bonding developed by statistical design of experiments

作者：Juliana Lasprilla-Botero^a ; ^{jlaspril@eafit.edu.co} ; Mó ; nica Á ; lvarez-Lá ; inez^a ; ^{malvar26@eafit.edu.co} ; Diego A. Acosta^b ; ^{dacostam@eafit.edu.co} ; José ; Miguel Martı́n-Martı́nez^c

关键词：A. Water based ; B. Metals ; B. Rubbers ; Design of experiments

刊名：International Journal of Adhesion and Adhesives

出版年：2017

3.In situ bridging effect of Ag₂O on pressureless and low-temperature sintering of micron-scale silver paste

作者：Hao Zhang^a ; ^b ; ^{gao_zhang@eco.sanken.osaka-u.ac.jp} ; Yue Gao^a ; ^b ; Jinting Jiu^b ; ^{jiu@eco.sanken.osaka-u.ac.jp} ; Katsuaki Suganuma^a ; ^b

关键词：Die bonding ; Micron silver paste ; Ag2O additive ; Lowtemperature ; Sintering ; Pressureless

刊名：Journal of Alloys and Compounds

出版年：2017

4.Study of the electronic, bonding, elastic and acoustic properties of covellite via first principles

作者：Zhenlong Lv^a ; ^{9902883@haust.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Hongling Cui^a ; Haiming Huang^a ; Xiaohong Li^a ; Hui Wang^a ; ^{nkxirainbow@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Guangfu Ji^b

关键词：Inorganic compound ; Electronic property ; Elastic property ; Acoustic property ; First-principles calculation

刊名：Journal of Alloys and Compounds

出版年：2017

5.Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

刊名：Journal of Alloys and Compounds

出版年：2017

6.Chemical profiling of the major components in natural waxes to elucidate their role in liquid oil structuring

作者：Chi Diem Doan^a ; ^d ; ^{Chi.DoanDiem@UGent.be" class="auth_mail" title="E-mail the corresponding author} ; ^{ddchi@ctu.edu.vn" class="auth_mail" title="E-mail the corresponding author} ; Chak Ming To^a ; Mike De Vrieze^b ; Frederic Lynen^b ; Sabine Danthine^c ; Allison Brown^a ; Koen Dewettinck^a ; Ashok R. Patel^a ; ^{Patel.Ashok@UGent.be" class="auth_mail" title="E-mail the corresponding author}

关键词：Heptacosane (PubChem CID ; 11636) ; Nonacosane (PubChem CID ; 12409) ; Hentriacontane (PubChem CID ; 12410) ; Palmitic acid (PubChem CID ; 985) ; Stearic acid (PubChem CID ; 5281) ; Arachidic acid (PubChem CID ; 10467) ; Octacosanoic acid (PubChem CID ; 10470) ; Myricic acid (PubChem CID ; 5461027) ; 1-Triacontanol (PubChem CID ; 68972) ; 1-Dotriacontanol (PubChem CID ; 96117)

刊名：Food Chemistry

出版年：2017

7.Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application

作者：Hongjun Ji ; ^{jhj7005@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Yunfei Qiao ; Mingyu Li ; ^{myli@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author}

关键词：Ultrasonic-assisted soldering ; Die bonding ; Microstructure ; Intermetallic joint ; Thermal conductivity

刊名：Scripta Materialia

出版年：2016

8.Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material

作者：Tzu-Hao Wang^a ; Hsuan Lee^a ; Chih-Ming Chen^a ; ^{chencm@nchu.edu.tw" class="auth_mail" title="E-mail the corresponding author} ; Ming-Guan Chen^b ; Chi-Chang Hu^b ; Yu-Jie Chen^c ; Ray-Hua Horng^c ; ^d

关键词：Microstructure ; Thermal ; Optical ; Low-temperature ; Die-bonding

刊名：Microelectronics Reliability

出版年：2016

9.Analysis of longitudinal weld seam defects and investigation of solid-state bonding criteria in porthole die extrusion process of aluminum alloy profiles

作者：Junquan Yu ^{yujunquansdu@163.com" class="auth_mail" title="E-mail the corresponding author} ; Guoqun Zhao ; ^{zhaogq@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Liang Chen ^{chenliang@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author}

关键词：Aluminum alloy profile ; Extrusion ; Weld seam defect ; Welding path ; Bonding criterion

刊名：Journal of Materials Processing Technology

出版年：2016

10.Ni₃Sn₄-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging

作者：Hongjun Ji ; ^{jhj7005@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Minggang Li ; Shu Ma ; Mingyu Li ^{myli@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author}

关键词：Ultrasonic-assisted bonding ; Die bonding ; Tin-nickel compounds ; Power electronics ; Interconnections ; Aging

刊名：Materials & Design

出版年：2016

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