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SpringerLink电子期刊(19)

在“SpringerLink电子期刊”中，命中：19条，耗时：小于0.01 秒

在所有数据库中总计命中：37条

1. Mechanical aspects of the chemical mechanical polishing process: A review

作者： Hyunseop Lee ; Dasol Lee ; Haedo Jeong

关键词：Chemical mechanical polishing ; CMP mechanism ; Consumables ; Mechanical aspects ; Process parameters

刊名：International Journal of Precision Engineering and Manufacturing

出版年：2016

2. Effect of glycine on copper CMP

作者： Soocheon Jang ; Haedo Jeong ; Minjong Yuh…

关键词：Chemical mechanical planarization (CMP) ; Complexing agent ; Glycine ; Tafel extrapolation ; Polarization resistance

刊名：International Journal of Precision Engineering and Manufacturing-Green Technology

出版年：2016

3. Slurry components in metal chemical mechanical planarization (CMP) process: A review

作者： Dasol Lee ; Hyunseop Lee ; Haedo Jeong

关键词：Chelating agent ; Chemical mechanical polishing (CMP) ; CMP mechanism ; Metal ; Oxidizer ; Slurry

刊名：International Journal of Precision Engineering and Manufacturing

出版年：2016

4. Effect of platen shape on evolution of total thickness variation in single-sided lapping of sapphire wafer

作者： Taekyung Lee ; Haedo Jeong ; Hyoungjae Kim…

刊名：International Journal of Precision Engineering and Manufacturing-Green Technology

出版年：2016

5. Preface for the special issue of hybrid manufacturing

作者： Haedo Jeong ; Won-Shik Chu

刊名：International Journal of Precision Engineering and Manufacturing-Green Technology

出版年：2016

6. Combined study on conductive AFM and damascene process to visualize Nano-Scaled defects in Cr thin films on polymer substrate

作者：Eun-Wook Jeong (1)
Se-Hun Kwon (1)
Haedo Jeong (2)
Youngson Choe (3)
Young-Rae Cho (1)

1. School of Materials Science and Engineering ; Pusan National University ; Busan ; 609-735 ; Korea
2. School of Mechanical Engineering ; Pusan National University ; Busan ; 609-735 ; Korea
3. Dept. of Chemical Engineering ; Pusan National University ; Busan ; 609-735 ; Korea

关键词：nano ; scaled defect ; C ; AFM ; damascene process ; direct observation ; thin film ; electrical conductivity

刊名：Electronic Materials Letters

出版年：2015

7. Effect of surfactant on package substrate in chemical mechanical planarization

作者： Soocheon Jang ; Haedo Jeong ; Minjong Yuh…

关键词：Chemical mechanical planarization(CMP) ; Dishing ; Erosion ; Package substrate ; Surfactant

刊名：International Journal of Precision Engineering and Manufacturing-Green Technology

出版年：2015

8. Signal analysis of CMP process based on AE monitoring system

作者： Sun-Joon Park ; Hyun-Seop Lee ; Haedo Jeong

关键词：Chemical mechanical planarization(CMP) ; Acoustic emission(AE) sensor ; Fast fourier transform(FFT)

刊名：International Journal of Precision Engineering and Manufacturing-Green Technology

出版年：2015

9. Effect of non-spherical colloidal silica particles on removal rate in oxide CMP

作者： Hojun Lee ; Moonsung Kim ; Haedo Jeong

关键词：CMP ; Oxide ; Non ; spherical colloidal silica ; Mixed abrasive slurry ; Removal rate

刊名：International Journal of Precision Engineering and Manufacturing

出版年：2015

10. The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

作者： Dasol Lee ; Hyunseop Lee ; Haedo Jeong

关键词：Copper (Cu) ; Chemical mechanical polishing (CMP) ; Spray slurry nozzle ; Slurry flow rate ; Nozzle height ; Cooling effect ; Computational fluid dynamic (CFD) ; Turbulent flow ; Minimum quantity lubrication (MQL)

刊名：Journal of Mechanical Science and Technology

出版年：2015

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