Femtosecond laser fabricated micro/nano interface structures toward enhanced bonding strength and heat transfer capability of W/Cu joining

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• 作者：Dafa Jiang ; Jiangyou Long ; Mingyong Cai ; Yi Lin ; Peixun Fan ; Hongjun Zhang ; Minlin Zhong ; ^{zhml@tsinghua.edu.cn}
• 关键词：Fs laser fabrication ; W/Cu joining ; Micro/nano interface structures ; Bonding strength ; Heat transfer capability
• 刊名：Materials & Design
• 出版年：2017
• 出版时间：15 January 2017
• 年：2017
• 卷：114
• 期：Complete
• 页码：185-193
• 全文大小：1991 K
• 卷排序：114

文摘

Diverse micro/nano surface structures fabricated by fs laser ablation on W. Micro/nano structures introduced into W/Cu interface by hot pressing joining. W/Cu bonding strength up to 120 MPa enhanced by micro/nano interface structures. Enhanced thermal diffusivity and thermal stress resistance of W/Cu joining.