Properties of power electronic substrates based on thick printed copper technology

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• 作者：Jan Reboun^a ; ^{jreboun@ket.zcu.cz} ; Karel Hromadka^a ; Vojtech Hermansky^a ; Jan Johan^b
• 关键词：Copper paste ; Thick printed copper technology ; Thick film copper firing ; Copper film morphology ; Copper film properties ; Inert gas batch furnace
• 刊名：Microelectronic Engineering
• 出版年：2017
• 出版时间：5 January 2017
• 年：2017
• 卷：167
• 期：Complete
• 页码：58-62
• 全文大小：1070 K
• 卷排序：167

文摘

Principles and characteristics of particular firing phases in inert gas batch furnace Morphology and film properties of the fired copper films Evaluation of copper pastes for TPC technology Firing of up to 300 μm thick copper film in inert gas batch furnace