Electroless Ni-plated graphene for tensile strength enhancement of copper

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• 作者：Rongrong Jiang ; Xufeng Zhou ; ^{zhouxf@nimte.ac.cn" class="auth_mail" title="E-mail the corresponding author} ; Zhaoping Liu ; ^{liuzp@nimte.ac.cn" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Graphene ; Copper ; Electroless plating ; Strength ; Electrical conductivity
• 刊名：Materials Science & Engineering A
• 出版年：2017
• 出版时间：2 January 2017
• 年：2017
• 卷：679
• 期：Complete
• 页码：323-328
• 全文大小：1018 K

文摘

Graphene nanosheets have shown a significant strengthening effect for metal matrixes. In this paper, we develop a novel eletroless plating method to prepare Ni decorated graphene as an enhancing component in a copper matrix. A good dispersion of Ni nanoparticles on graphene sheets is achieved, which effectively enhances the interfacial compatibility between graphene and copper. The electroless plated graphene-copper composite bulk has a better performance in the mechanical tensile strength compared to pure copper, and also maintains superior ductility, elongation and electrical conductivity.