On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

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On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

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作者：Anil Kunwar ; Haoran Ma ; Haitao Ma ; ^{htma@dlut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Junhao Sun ; Ning Zhao ; Mingliang Huang
关键词：Thermomigration ; Metals and alloys ; Diffusion ; Synchrotron radiation ; Finite element method ; Intermetallic alloys and compounds
刊名：Materials Letters
出版年：2016
出版时间：1 June 2016
年：2016
卷：172
期：Complete
页码：211-215
全文大小：1366 K

文摘

•: Synchrotron radiation imaging technique is applied for thermomigration study.
•: The thermotransport of Cu in Sn has been modelled using FEM.
•: Higher temperatures enhances the rate of increase of cold end intermetallic compound size.
•: The smaller cold end Cu₆Sn₅ in Sn–3.5Ag than Sn may be attributed to the role of Ag₃Sn.

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