Microstructure formation and evolution mechanism of Cu-Ti coating during dual-magnetron sputtering and thermo plasma nitriding

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Microstructure formation and evolution mechanism of Cu-Ti coating during dual-magnetron sputtering and thermo plasma nitriding

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作者：Y.D. Zhu^a ; M.F. Yan^a ; ^{yanmufu@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; ^{prsm804@163.com" class="auth_mail" title="E-mail the corresponding author} ; Y.X. Zhang^a ; H.T. Chen^b ; Y. Yang^a
关键词：Dual magnetron sputtering ; Thermo plasma nitriding ; Cu-Ti coating ; Amorphous ; Crystallization ; Nanocrystalline TiN
刊名：Vacuum
出版年：2016
出版时间：December 2016
年：2016
卷：134
期：Complete
页码：25-28
全文大小：1699 K

文摘

•: Amorphous Cu-Ti coating with tuned Cu/Ti = 1:1.2 was fabricated by dual magnetron sputtering.
•: Crystallization of Cu-Ti intermetallics occurred during thermo plasma nitriding.
•: Nanocrystalline TiN formed in the outmost layer.
•: A multiphase layer containing hard nitrides, brittle CuTi, ductile Cu₃Ti and CuTi₂ was successfully fabricated.

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