Application of robust color composite fringe in flip-chip solder bump 3-D measurement

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• 作者：Chung-Feng Jeffrey Kuo ; ^{jeffreykuo@mail.ntust.edu.tw} ; Han-Cheng Wu ^{tomylover25@gmail.com}
• 关键词：Optical inspection ; Fringe projection profilometry ; Color composite fringe ; Phase unwrapping
• 刊名：Optics and Lasers in Engineering
• 出版年：2017
• 出版时间：April 2017
• 年：2017
• 卷：91
• 期：Complete
• 页码：261-269
• 全文大小：1002 K
• 卷排序：91

文摘

Color composite fringe have different fringe modulation intensities in each channel. The proposed method could combine the phase information in each channel. Different fringe modulation to solve the reflective coefficient problem. The proposed method has high accuracy and stability in the flip-chip measurement.