Analysis of adhesive joints in corrugated board under shear loading

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• 作者：I. Conde ; B. Garc¨ªa ; E. Liarte ; M.A. Jim¨¦nez
• 关键词：Hot melt ; Finite element stress analysis ; Delamination
• 刊名：International Journal of Adhesion and Adhesives
• 出版年：2012
• 出版时间：October, 2012
• 年：2012
• 卷：38
• 期：Complete
• 页码：50-57
• 全文大小：1582 K

文摘

The aim of this study is the development and validation of a methodology for modelling corrugated board adhesive joints subjected to shear, considered to be the main load in most of these joints, and the analysis of the influence of several joint parameters. Testing and simulation of double-lap corrugated cardboard adhesive joints has been carried out. The corrugated board was glued with a hot-melt adhesive, the type of adhesive commonly used in the assembly of corrugated boxes. The corrugated board adhesive joint model reproduced quite well the stiffness obtained in the test samples, as well as the failure load with a deviation of less than 14 % . A simplified plane strain model has also been evaluated in order to obtain a significant reduction in generation and computational costs. Finally, the influence of some of the most significant parameters in the corrugated board adhesive joint has been analysed independently using the simplified model.