Evaluation of film adhesion to substrates by means of surface acoustic wave dispersion

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• 作者：Jikai Du ; Bernhard R. Tittmann ; Hyeong Sick Ju
• 关键词：Adhesion ; Mechanical wave propagation ; Acoustical microscopy
• 刊名：Thin Solid Films
• 出版年：2010
• 出版时间：2 August 2010
• 年：2010
• 卷：518
• 期：20
• 页码：5786-5795
• 全文大小：1003 K

文摘

For thin film structures acoustically classified as slow-on-fast systems, modeling and evaluation of their interfacial condition are known to be very complex and difficult due to dispersion and multi-mode excitation of acoustic waves. This paper presents a quantitative model and a reliable measurement procedure established for adhesion evaluation of such film structures. An effective interface model employing a virtual intermediate layer is utilized for the dispersion prediction of the surface acoustic wave, which is affected by various interfacial conditions. Through acoustic microscopy experiments, this model presents a potential method to classify the bonding condition. Comparisons with a destructive scratch test and an acoustic imaging verify the failure mode of the film structure.