Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration

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• 作者：Till Huesgen ; Gabriel Lenk ; Bjö ; rn Albrecht ; Paul Vulto ; Thomas Lemke ; Peter Woias
• 关键词：Adhesive bonding ; Dry-film photoresist ; Ordyl ; Bistable ; Microvalve
• 刊名：Sensors and Actuators A: Physical
• 出版年：2010
• 出版时间：July 2010
• 年：2010
• 卷：162
• 期：1
• 页码：137-144
• 全文大小：500 K

文摘

A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 μm thick layer of Ordyl. A bond yield of 95 % and a tensile bond strength of 13.36 MPa are measured. Membrane-covered cavity structures, that maintain low vacuum pressures in the range of a few kPa over a period of several months, demonstrate leak tightness. The process is applied to fabricate a novel thermopneumatic microvalve with an integrated Peltier-cooler chip for direct temperature control. A wafer-level bond with an Ordyl layer thickness of 20 μm is used for the valve chamber and a chip–wafer bond with 120 μm thick Ordyl is used to integrate a commercial micro-scale Peltier cooler. Test results indicate the functionality of the microvalve, demonstrating the suitability of Ordyl bonding for 3D MEMS fabrication.