Facile patterning silicon wafer by Rochow reaction over patterned Cu-based catalysts

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Facile patterning silicon wafer by Rochow reaction over patterned Cu-based catalysts

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作者：Wenfeng Ren^a ; ^b ; Yanhong Wang^a ; ^{wangyanhong@ipe.ac.cn" class="auth_mail" title="E-mail the corresponding author} ; Zailei Zhang^a ; Qiangqiang Tan^a ; Ziyi Zhong^c ; Fabing Su^a ; ^{fbsu@ipe.ac.cn" class="auth_mail" title="E-mail the corresponding author}
关键词：Si wafers ; Direct-pattern ; Rochow reaction ; Copper catalysts ; CH3Cl
刊名：Applied Surface Science
出版年：2016
出版时间：1 January 2016
年：2016
卷：360
期：part_PA
页码：192-197
全文大小：2638 K

文摘

•: Patterned Si wafer was prepared by Rochow reaction over patterned Cu-based catalysts.
•: Patterned Si wafers consisted of regular shape and clear boundary.
•: This simple and low-cost synthetic approach is promising for scale-up.

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