In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive

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• 作者：Shilong Chen ; Konghua Liu ; Yuanfang Luo ; Demin Jia ; Hong Gao ; Guojun Hu ; Lan Liu
• 关键词：Epoxy ; Adhesive ; Silver ; Sinter
• 刊名：International Journal of Adhesion and Adhesives
• 出版年：2013
• 出版时间：September, 2013
• 年：2013
• 卷：45
• 期：Complete
• 页码：138-143
• 全文大小：1663 K

文摘

A facile method to prepare low-cost, highly conductive and reliable silver-coated copper (Ag-coated Cu) flakes filled isotropic conductive adhesive (ICAs) by in situ generation and sintering of silver nanoparticles (AgNPs) during the curing process is presented. The silver-triethanolamine complex is derived from the complexing reaction between AgNO₃ and triethanolamine in the epoxy matrix. At the curing temperature, AgNPs are in situ generated by the thermal decomposition of silver-triethanolamine complex. The sintering of AgNPs anchored on the surface of Ag-coated Cu flakes could effectively prevent the exposed Cu from oxidizing. Compared with the ICAs without AgNPs which has a resistivity of 9.6¡Á10^?4 ¦¸ cm, the ICAs filled with AgNPs shows a much lower volume resistivity of 6.62¡Á10^?4 ¦¸ cm. Furthermore, the contact resistance of the ICAs is only 6.7 % increase after aging at 85 ¡ãC and 85 % RH for 500 h, while the increase in contact resistance of the controlled ICAs reaches to 23 % . The facile approach will pave the way towards high performance and low cost ICAs for electronic packaging applications.