Fabrication of alumina/copper heat dissipation substrates by freeze tape casting and melt infiltration for high-power LED

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Fabrication of alumina/copper heat dissipation substrates by freeze tape casting and melt infiltration for high-power LED

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作者：Yufei Tang ; ^{yftang@xaut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Sha Qiu ; Miaomiao Li ; Kang Zhao
关键词：Freeze tape casting ; Melt infiltration ; Alumina/copper ; Heat dissipation substrate
刊名：Journal of Alloys and Compounds
出版年：2017
出版时间：5 January 2017
年：2017
卷：690
期：Complete
页码：469-477
全文大小：3096 K

文摘

•: Novel alumina/copper heat dissipation substrates for LED were synthesized.
•: High thermal conductivity and low thermal expansion coefficient were obtained.
•: Mechanisms about heat dissipation in the fabricated samples were discussed.

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