Effects of nano-Al₂O₃ particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

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• 作者：L.C. Tsao^a ; ^{tlclung@mail.npust.edu.tw} ; R.W. Wu^b ; Te-Hsien Cheng^a ; Kuo-Huan Fan^a ; R.S. Chen^b
• 关键词：A. Non-ferros metals and alloys ; D. Brazing and soldering ; F. Microstructure
• 刊名：Materials and Design
• 出版年：2013
• 出版时间：September, 2013
• 年：2013
• 卷：50
• 期：Complete
• 页码：774-781
• 全文大小：5064 K

文摘

A Sn3.5Ag0.5Cu (SAC)-XAl₂O₃ nano-composite solder was prepared by adding 100 nm Al₂O₃ to SAC (wt. % ) solder. The interfacial microstructures and mechanical properties of SAC-XAl₂O₃ nano-composite solder balls on immersion Sn surface finished BGA joints after multiple reflows was investigated. As a whole, adding Al₂O₃ nanoparticles to SAC solders significantly changed in the interfacial microstructure, and both scallop-type and prism-type modes were observed in the plain SAC solder and SAC-XAl₂O₃ nano-composite solder after reflowing, respectively. The nanoparticles suppressed the growth of the Cu₆Sn₅ layer, significantly improving the shear strength. The fracture surfaces of the plain SAC solder showed a semi-brittle fracture mode, but those of the SAC-XAl₂O₃ nano-composite solder exhibited typical ductile failures.