Monolithic thermally bonded Er<sup>3+</sup>, Yb<sup>3+</sup>:glass/Co<sup>2+</sup>:MgAl<sub>2</sub>O<sub>4</sub> microchip lasers

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Monolithic thermally bonded Er³⁺, Yb³⁺:glass/Co²⁺:MgAl₂O₄ microchip lasers

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作者：Jaroslaw Mlynczak ; ^{jmlynczak@wat.edu.pl" class="auth_mail" title="E-mail the corresponding author} ; Nabil Belghachem
关键词：Thermally bonded microchip laser ; Monolithic microchip laser ; Erbium pulse microchip laser
刊名：Optics Communications
出版年：2015
出版时间：1 December 2015
年：2015
卷：356
期：Complete
页码：166-169
全文大小：1776 K

文摘

•: Monolithic thermally bonded Er³⁺, Yb³⁺:glass/CO₂+:MgAl₂O₄ microchip lasers were described for the first time.
•: The highest ever reported 10 kW peak power in monolithic thermally bonded Er³⁺, Yb³⁺:glass/Co²⁺:MgAl₂O₄ was presented.
•: Laser characteristics of monolithic microchip laser were compared with the ones of microchip laser with external mirrors.
•: The advantage of monolithic microchip lasers over those with external mirrors was shown.

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