Effective Schottky barrier lowering of Ni silicide/p-Si(100) using an ytterbium confinement structure for high performance n-type MOSFETs
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文摘
The insertion of Ti layer effectively suppresses Yb out-diffusion and prevents the Yb from oxidation during silicidation. Yb atoms are confined by the inserted Ti layer and react with both Ni and Si to form Yb-Ni silicide. The confinement leads the SBH of the system to a 0.02 and 0.025 eV lowering at 500 and 600 °C, respectively. The RE metal confinement structure provides a CMOS compatible approach for further SBH engineering and technology nodes.
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