Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials

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• 作者：Jonathan Lind ; ^{lind9@llnl.gov" class="auth_mail" title="E-mail the corresponding author} ; Shiu Fai Li ^{li31@llnl.gov" class="auth_mail" title="E-mail the corresponding author} ; Mukul Kumar ^{kumar3@llnl.gov" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Grain boundary engineering ; 3D characterization ; TRD ; nf-HEDM
• 刊名：Acta Materialia
• 出版年：2016
• 出版时间：1 August 2016
• 年：2016
• 卷：114
• 期：Complete
• 页码：43-53
• 全文大小：4339 K

文摘

The concept of twin-limited microstructures has been explored in the literature as a crystallographically constrained grain boundary network connected via only coincident site lattice (CSL) boundaries. The advent of orientation imaging has made classification of twin-related domains (TRD) or any other orientation cluster experimentally accessible in 2D using EBSD. With the emergence of 3D orientation mapping, a comparison of TRDs in measured 3D microstructures is performed and compared against their 2D counterparts. The TRD analysis is performed on a conventionally processed (CP) and a grain boundary engineered (EM) high purity copper sample that have been subjected to successive anneal procedures to promote grain growth. The EM sample shows extremely large TRDs which begin to approach that of a twin-limited microstructure, while the TRDs in the CP sample remain relatively small and remote.