Effects of BEOL on self-heating and thermal coupling in SiGe multi-finger HBTs under real operating condition

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Effects of BEOL on self-heating and thermal coupling in SiGe multi-finger HBTs under real operating condition

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作者：A.D.D. Dwivedi^a ; ^{arun-dev-dhar.dwivedi@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; ^{adddwivedi@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Anjan Chakravorty^b ; ^{anjan@ee.iitm.ac.in" class="auth_mail" title="E-mail the corresponding author} ; Rosario D&rsquo ; Esposito^a ; ^{rosario.desposito@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; Amit Kumar Sahoo^a ; ^{amit7phy@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Sebastien Fregonese^a ; ^{sebastien.fregonese@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; Thomas Zimmer^a ; ^{thomas.zimmer@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author}
关键词：SiGe ; Multi-finger HBT ; TCAD ; Self-heating ; Thermal coupling ; Compact model
刊名：Solid State Electronics
出版年：2016
出版时间：January 2016
年：2016
卷：115
期：part_PA
页码：1-6
全文大小：615 K

文摘

•: Effects of back-end-of-line on the self-heating and thermal coupling are estimated.
•: A method to estimate the coupling under a real operating condition is proposed.
•: Coupling factors are found to slightly increase with dissipated power.
•: A closed-form formulation is proposed for the coupling factors in a multi-finger HBT.

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